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FGHL50T65MQD

Onsemi

FGHL50T65MQD by Onsemi

FGHL50T65MQD by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.8V and a max collector-emitter voltage of 650V. It is designed for power control applications, offering a max operating temperature of 175 °C and a max collector current of 80A.

Median Price

$5.300

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 404 parts In-Stock

1+ parts

$5.300

100+ parts

$2.790

1k+ parts

$2.520

10k+ parts

-

404

$5.300

$2.790

$2.520

-

DigiKey

USA . 5 parts In-Stock

1+ parts

$5.730

100+ parts

-

1k+ parts

$2.200

10k+ parts

-

5

$5.730

-

$2.200

-

Chip1Stop

Japan . 302 parts In-Stock

1+ parts

$16.300

100+ parts

$6.710

1k+ parts

-

10k+ parts

-

302

$16.300

$6.710

-

-

Rochester

USA . 82,750 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

82,750

-

$2.190

$1.960

$1.850

Verical

USA . 82,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

$2.313

82,750

-

-

$2.450

$2.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,143 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

-

10k+ parts

-

1,143

$2.318

-

-

-

Flip Electronics

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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54,000

-

-

-

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Vyrian

USA . 10,467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,467

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,783 parts In-Stock

1+ parts

$2.196

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$2.196

-

-

-

Corohmni

South Africa . 163 parts In-Stock

1+ parts

$2.440

100+ parts

-

1k+ parts

-

10k+ parts

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163

$2.440

-

-

-

Component Stockers USA

USA . 1,441 parts In-Stock

1+ parts

$4.420

100+ parts

$3.600

1k+ parts

-

10k+ parts

-

1,441

$4.420

$3.600

-

-

Microchip USA

USA . 6,700 parts In-Stock

1+ parts

$31.070

100+ parts

-

1k+ parts

-

10k+ parts

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6,700

$31.070

-

-

-

SupplyDigital Components

Austria . 8,360 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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8,360

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-

-

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Kulean Microsystems

USA . 8,214 parts In-Stock

1+ parts

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100+ parts

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8,214

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-

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TANS Electronics

Latvia . 7,426 parts In-Stock

1+ parts

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7,426

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Perfect Parts

USA . 1,440 parts In-Stock

1+ parts

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100+ parts

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1,440

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-

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Problanco Electronics

Mexico . 1,428 parts In-Stock

1+ parts

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100+ parts

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1,428

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-

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Northwest PG Solutions

USA . 1,397 parts In-Stock

1+ parts

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1,397

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-

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Native Components

USA . 682 parts In-Stock

1+ parts

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682

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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500

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GreenTree Electronics

Israel . 402 parts In-Stock

1+ parts

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402

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UHIMA Technologies

Türkiye . 180 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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180

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-

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-

Overview

Elevate your power control applications with the FGHL50T65MQD by Onsemi. This N-CHANNEL IGBT offers top-notch quality and reliability, thanks to Onsemi's reputation for excellence in semiconductor manufacturing. With a maximum VCEsat of 1.8V and a maximum operating temperature of 175 °C, this transistor provides efficient power management while ensuring optimal performance. Whether you're looking to enhance industrial equipment or automotive systems, the FGHL50T65MQD delivers the value, benefits, and advantages that customers need for their projects. Trust Onsemi to power up your applications with cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulation for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Offers low on-state voltage drop and high switching speed, making it suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance.

Maximum VCEsat: 1.8 V

Low VCEsat minimizes power loss and improves overall efficiency of the transistor.

Package Shape: RECTANGULAR

Allows for easy mounting and installation in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and connection to a circuit board for secure and stable operation.

Maximum Power Dissipation (Abs): 268 W

High power dissipation capability enables the transistor to handle large amounts of power without overheating.

Package Style (Meter): FLANGE MOUNT

Allows for easy mounting on a flange for secure and stable installation.

Maximum Operating Temperature: 175 °C

Can operate effectively at high temperatures, ensuring reliable performance in demanding environments.

Maximum Collector-Emitter Voltage: 650 V

Can handle high collector-emitter voltages, making it suitable for high voltage applications.

Transistor Element Material: SILICON

Silicon-based construction provides excellent performance characteristics such as high temperature tolerance and reliability.

Maximum Gate-Emitter Voltage: 20 V

Can withstand high gate-emitter voltages, ensuring stable operation in a variety of applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in low temperature environments without compromising performance.

Maximum Collector Current (IC): 80 A

High collector current capability makes it suitable for applications requiring high power output.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage allows for efficient and precise control of the transistor.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: SINGLE

Simplified terminal configuration makes it easy to connect and integrate into circuits.

Case Connection: COLLECTOR

Collector case connection simplifies circuit design and layout, improving overall efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGHL50T65MQD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

1.8 V

Trade Compliance

FGHL50T65MQD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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