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FGHL75T65LQDTL4

Onsemi

FGHL75T65LQDTL4 by Onsemi

FGHL75T65LQDTL4 by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 1.35V and a max IC of 80A. It is designed for power control applications, featuring a single configuration with built-in diode and a package style of flange mount.

Median Price

$6.415

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 388 parts In-Stock

1+ parts

$1.089

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388

$1.089

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Chip1Stop

Japan . 388 parts In-Stock

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$4.970

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388

$4.970

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Farnell

UK . 304 parts In-Stock

1+ parts

$5.660

100+ parts

$2.810

1k+ parts

$2.750

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-

304

$5.660

$2.810

$2.750

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Mouser Electronics

USA . 329 parts In-Stock

1+ parts

$8.160

100+ parts

$4.470

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329

$8.160

$4.470

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Newark

USA . 293 parts In-Stock

1+ parts

$8.400

100+ parts

$4.600

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293

$8.400

$4.600

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DigiKey

USA . 277 parts In-Stock

1+ parts

$8.830

100+ parts

$5.167

1k+ parts

$3.904

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277

$8.830

$5.167

$3.904

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Element14

Singapore . 304 parts In-Stock

1+ parts

$9.580

100+ parts

$5.500

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304

$9.580

$5.500

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Rochester

USA . 1,350 parts In-Stock

1+ parts

-

100+ parts

$3.900

1k+ parts

$3.490

10k+ parts

$3.280

1,350

-

$3.900

$3.490

$3.280

RS (Exports)

UK . 450 parts In-Stock

1+ parts

-

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$6.415

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450

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$6.415

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Verical

USA . 388 parts In-Stock

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388

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Distributors (In-Stock)

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Digiode

USA . 200 parts In-Stock

1+ parts

$3.848

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200

$3.848

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Vyrian

USA . 8,678 parts In-Stock

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Flip Electronics

USA . 1,350 parts In-Stock

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Distributors (Availability)

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Northwest PG Solutions

USA . 648 parts In-Stock

1+ parts

$2.540

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648

$2.540

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Corphita

USA . 1,123 parts In-Stock

1+ parts

$3.646

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1,123

$3.646

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Corohmni

South Africa . 90 parts In-Stock

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$4.051

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90

$4.051

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Component Stockers USA

USA . 3,197 parts In-Stock

1+ parts

$4.090

100+ parts

$3.840

1k+ parts

$3.480

10k+ parts

-

3,197

$4.090

$3.840

$3.480

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Continental Prestige Electronics

USA . 403 parts In-Stock

1+ parts

$6.380

100+ parts

$4.360

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403

$6.380

$4.360

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Microchip USA

USA . 7,989 parts In-Stock

1+ parts

$20.160

100+ parts

$19.870

1k+ parts

$19.730

10k+ parts

$19.580

7,989

$20.160

$19.870

$19.730

$19.580

Kulean Microsystems

USA . 4,288 parts In-Stock

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4,288

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TANS Electronics

Latvia . 3,578 parts In-Stock

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3,578

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SupplyDigital Components

Austria . 1,091 parts In-Stock

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1,091

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Native Components

USA . 979 parts In-Stock

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$2.240

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979

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$2.240

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UHIMA Technologies

Türkiye . 539 parts In-Stock

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539

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Problanco Electronics

Mexico . 399 parts In-Stock

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399

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Overview

Unleash the power of innovation with the FGHL75T65LQDTL4 by Onsemi, a cutting-edge Insulated Gate Bipolar Transistor (IGBT) that redefines the standard for power control applications. With a single configuration and built-in diode, this N-channel transistor offers unparalleled performance and reliability. Whether you're looking to optimize energy efficiency or enhance system functionality, this product delivers maximum power dissipation and swift turn-on/off times. Trust in Onsemi's reputation for quality and precision engineering to elevate your projects to new heights. Experience the difference with the FGHL75T65LQDTL4 - where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protects the internal components from external elements, increasing the reliability and durability of the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high current and voltage capabilities, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and improves efficiency by reducing losses in freewheeling and snubber circuits.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in controlling high power levels.

Maximum VCEsat: 1.35 V

Low VCEsat reduces power dissipation and improves efficiency, making this IGBT suitable for high power applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and installation in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, enhancing the reliability and mechanical strength of the product.

Nominal Turn Off Time (toff): 660 ns

Fast turn off time ensures quick switching and improves overall performance in high-frequency applications.

Maximum Power Dissipation (Abs): 469 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating or failing.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides mechanical stability and ease of installation in various industrial applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for reliable operation in extreme temperature conditions, increasing the product's versatility.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating ensures the IGBT can handle high voltage levels without breakdown, making it suitable for high power applications.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and high breakdown voltage, making the IGBT reliable and efficient in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures reliable gate control and optimal performance in power control applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the IGBT to operate in cold environments without performance degradation.

Maximum Collector Current (IC): 80 A

High collector current rating allows the IGBT to handle large current loads, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures easy gate control and reduces power losses during operation.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability of the connections.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, making the product easier to use in various electronic applications.

Nominal Turn On Time (ton): 60 ns

Fast turn on time ensures quick response and high switching speed, making the IGBT suitable for high-performance applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGHL75T65LQDTL4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

660 ns

Nominal Turn On Time (ton):

60 ns

Maximum VCEsat:

1.35 V

Trade Compliance

FGHL75T65LQDTL4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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