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FGHL40T65MQD

Onsemi

FGHL40T65MQD by Onsemi

FGHL40T65MQD by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.8V and a max collector-emitter voltage of 650V. It is designed for power amplifier applications, featuring a single configuration with built-in diode. With a max power dissipation of 238W and operating temperature up to 175°C, it offers reliable performance in various high-power electronic systems.

Median Price

$5.170

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 582 parts In-Stock

1+ parts

$5.170

100+ parts

-

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$1.921

10k+ parts

$1.917

582

$5.170

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$1.921

$1.917

Mouser Electronics

USA . 370 parts In-Stock

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$5.170

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$2.200

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370

$5.170

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$2.200

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Chip1Stop

Japan . 60 parts In-Stock

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$54.810

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60

$54.810

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Flip Electronics (Authorized)

USA . 601 parts In-Stock

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Verical

USA . 450 parts In-Stock

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$2.388

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450

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$2.388

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Rochester

USA . 450 parts In-Stock

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$1.910

1k+ parts

$1.710

10k+ parts

$1.610

450

-

$1.910

$1.710

$1.610

Distributors (In-Stock)

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Digiode

USA . 1,071 parts In-Stock

1+ parts

$3.819

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1,071

$3.819

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Vyrian

USA . 9,070 parts In-Stock

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Flip Electronics

USA . 601 parts In-Stock

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601

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Distributors (Availability)

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Ampacity Inc.

Singapore . 150 parts In-Stock

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$3.420

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150

$3.420

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Corphita

USA . 143 parts In-Stock

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$3.618

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$3.618

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Corohmni

South Africa . 434 parts In-Stock

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$4.020

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Microchip USA

USA . 3,592 parts In-Stock

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$27.430

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Kulean Microsystems

USA . 7,447 parts In-Stock

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Problanco Electronics

Mexico . 4,040 parts In-Stock

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TANS Electronics

Latvia . 2,033 parts In-Stock

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Perfect Parts

USA . 1,737 parts In-Stock

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Northwest PG Solutions

USA . 1,463 parts In-Stock

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SupplyDigital Components

Austria . 1,268 parts In-Stock

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UHIMA Technologies

Türkiye . 945 parts In-Stock

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945

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Native Components

USA . 297 parts In-Stock

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GreenTree Electronics

Israel . 262 parts In-Stock

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Authorized Procurement Solutions

USA . 222 parts In-Stock

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Overview

Experience the superior performance and reliability of the FGHL40T65MQD by Onsemi, a leading manufacturer of high-quality electronic components. As an Insulated Gate Bipolar Transistor (IGBT), this product offers unparalleled efficiency and power for applications such as power amplifiers. With a maximum collector-emitter voltage of 650V and a built-in diode configuration, this transistor provides exceptional value and benefits to customers seeking optimal performance in their electronic devices. Trust Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower ON-state resistance and higher switching speeds, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for faster switching and provides protection against reverse current flow, enhancing overall efficiency.

Transistor Application: POWER AMPLIFIER

Designed for high power amplification applications, making it ideal for use in power electronics and motor control systems.

Maximum VCEsat: 1.8 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to lower power dissipation and higher efficiency.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and efficient heat dissipation.

Nominal Turn Off Time (toff): 203 ns

Fast turn-off time enables quick switching transitions, reducing heat generation and improving overall performance.

Maximum Power Dissipation (Abs): 238 W

High power dissipation capability ensures the IGBT can handle high current and voltage loads without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for use in various environmental conditions without compromising performance.

Maximum Collector-Emitter Voltage: 650 V

High maximum voltage rating ensures the IGBT can handle high voltage applications safely and efficiently.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and high performance in power electronics applications.

Maximum Gate-Emitter Voltage: 20 V

Sufficient gate-emitter voltage rating for reliable and efficient switching operation.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold environments without performance degradation.

Maximum Collector Current (IC): 80 A

High maximum collector current rating allows for handling of large current loads, suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures efficient switching operation and minimal power losses.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good electrical conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, reducing complexity in circuit design.

Nominal Turn On Time (ton): 52 ns

Fast turn-on time allows for quick response and high-speed operation in power switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGHL40T65MQD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER AMPLIFIER

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

203 ns

Nominal Turn On Time (ton):

52 ns

Maximum VCEsat:

1.8 V

Trade Compliance

FGHL40T65MQD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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