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FGHL50T65MQDTL4

Onsemi

FGHL50T65MQDTL4 by Onsemi

FGHL50T65MQDTL4 by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 80A IC, and 1.8V VGE(th). Ideal for power control applications, it features a single configuration with built-in diode in a rectangular package suitable for flange mount installations.

Median Price

$5.181

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 305 parts In-Stock

1+ parts

$0.695

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305

$0.695

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Chip1Stop

Japan . 305 parts In-Stock

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$4.030

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305

$4.030

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Farnell

UK . 25 parts In-Stock

1+ parts

$5.050

100+ parts

$3.150

1k+ parts

$2.250

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25

$5.050

$3.150

$2.250

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Mouser Electronics

USA . 321 parts In-Stock

1+ parts

$5.360

100+ parts

$3.430

1k+ parts

$2.990

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321

$5.360

$3.430

$2.990

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Newark

USA . 25 parts In-Stock

1+ parts

$5.520

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$3.080

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25

$5.520

$3.080

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DigiKey

USA . 2,009 parts In-Stock

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$6.530

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$2.615

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$6.530

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$2.615

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Element14

Singapore . 25 parts In-Stock

1+ parts

$8.490

100+ parts

$3.890

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$3.710

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25

$8.490

$3.890

$3.710

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Verical

USA . 1,800 parts In-Stock

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$2.632

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1,800

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$2.632

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RS (Exports)

UK . 433 parts In-Stock

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$5.181

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433

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$5.181

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Distributors (In-Stock)

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Digiode

USA . 844 parts In-Stock

1+ parts

$3.247

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844

$3.247

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Vyrian

USA . 2,303 parts In-Stock

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$3.418

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2,303

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Flip Electronics

USA . 2,250 parts In-Stock

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2,250

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Corphita

USA . 2,443 parts In-Stock

1+ parts

$3.076

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$3.076

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Corohmni

South Africa . 53 parts In-Stock

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$3.418

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53

$3.418

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Continental Prestige Electronics

USA . 295 parts In-Stock

1+ parts

$4.990

100+ parts

$2.810

1k+ parts

$2.310

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295

$4.990

$2.810

$2.310

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Microchip USA

USA . 9,137 parts In-Stock

1+ parts

$15.570

100+ parts

$15.350

1k+ parts

$15.230

10k+ parts

$15.120

9,137

$15.570

$15.350

$15.230

$15.120

Kulean Microsystems

USA . 5,595 parts In-Stock

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Problanco Electronics

Mexico . 5,075 parts In-Stock

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SupplyDigital Components

Austria . 3,019 parts In-Stock

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TANS Electronics

Latvia . 2,892 parts In-Stock

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Perfect Parts

USA . 1,736 parts In-Stock

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Northwest PG Solutions

USA . 1,187 parts In-Stock

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GreenTree Electronics

Israel . 368 parts In-Stock

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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UHIMA Technologies

Türkiye . 123 parts In-Stock

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Native Components

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Overview

Enhance your power control systems with the FGHL50T65MQDTL4 from Onsemi, a top-tier manufacturer known for its high-quality Insulated Gate Bipolar Transistors. Designed for efficiency and durability, this N-CHANNEL transistor with a built-in diode offers exceptional performance in various applications. With a maximum collector-emitter voltage of 650V and a maximum power dissipation of 268W, this transistor ensures reliable power control. Upgrade your electronics with this reliable and efficient transistor, providing value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective solution for insulating the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and low ON-resistance, making it suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, reducing the need for additional components.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance under high power loads.

Maximum VCEsat: 1.8 V

Low VCEsat voltage results in reduced power losses and improved efficiency in power switching applications.

Package Shape: RECTANGULAR

Enables easy mounting and installation in various electronic systems and circuit designs.

Terminal Form: THROUGH-HOLE

Facilitates secure and reliable connections in PCBs, ensuring stable operation in demanding environments.

Nominal Turn Off Time (toff): 373 ns

Fast turn-off time enhances switching speed and performance, crucial for high-frequency power control applications.

Maximum Power Dissipation (Abs): 268 W

Capable of handling high power dissipation, making it suitable for heavy-duty applications that require robust performance.

Package Style (Meter): FLANGE MOUNT

Allows for convenient mounting and heat dissipation, ensuring reliable operation in demanding environments.

Maximum Operating Temperature: 175 °C

Can withstand high operating temperatures, suitable for industrial applications that require extended temperature range.

Maximum Collector-Emitter Voltage: 650 V

High VCE voltage rating makes it suitable for high voltage applications, ensuring reliable performance under voltage stress.

Transistor Element Material: SILICON

Silicon-based construction provides high conductivity and reliability, essential for power control applications.

Maximum Gate-Emitter Voltage: 20 V

Safely operates within specified voltage limits, preventing damage to the transistor during switching operations.

Minimum Operating Temperature: -55 °C

Capable of functioning in low-temperature environments, making it suitable for a wide range of operating conditions.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling large currents, ideal for high-power applications that require high current capacity.

Maximum Gate-Emitter Threshold Voltage: 6 V

Optimal gate-emitter threshold voltage for efficient switching and control, ensuring stable operation under varying load conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and resistance to corrosion, ensuring long-term reliability in electronic assemblies.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, ensuring ease of use in diverse circuit designs.

Nominal Turn On Time (ton): 77 ns

Fast turn-on time enhances switching speed and performance, crucial for high-speed power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGHL50T65MQDTL4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

373 ns

Nominal Turn On Time (ton):

77 ns

Maximum VCEsat:

1.8 V

Trade Compliance

FGHL50T65MQDTL4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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