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FGHL50T65MQDT

Onsemi

FGHL50T65MQDT by Onsemi

FGHL50T65MQDT by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 80A IC, and 1.8V VGE. Ideal for POWER CONTROL applications, it has a TOFF of 144ns and TON of 51ns. The device comes in a RECTANGULAR package with FLANGE MOUNT style suitable for high-power operations up to 175°C.

Median Price

$5.455

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,335 parts In-Stock

1+ parts

$4.610

100+ parts

$2.200

1k+ parts

$1.880

10k+ parts

-

1,335

$4.610

$2.200

$1.880

-

Mouser Electronics

USA . 1,574 parts In-Stock

1+ parts

$5.050

100+ parts

-

1k+ parts

$2.380

10k+ parts

-

1,574

$5.050

-

$2.380

-

Newark

USA . 1,335 parts In-Stock

1+ parts

$5.860

100+ parts

$2.870

1k+ parts

$2.810

10k+ parts

-

1,335

$5.860

$2.870

$2.810

-

DigiKey

USA . 600 parts In-Stock

1+ parts

$5.910

100+ parts

$3.359

1k+ parts

$2.389

10k+ parts

-

600

$5.910

$3.359

$2.389

-

Element14

Singapore . 1,335 parts In-Stock

1+ parts

$6.360

100+ parts

$3.480

1k+ parts

$3.470

10k+ parts

-

1,335

$6.360

$3.480

$3.470

-

Chip1Stop

Japan . 1,050 parts In-Stock

1+ parts

$14.700

100+ parts

$6.620

1k+ parts

$4.250

10k+ parts

-

1,050

$14.700

$6.620

$4.250

-

Verical

USA . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.404

10k+ parts

-

1,800

-

-

$2.404

-

RS (Exports)

UK . 346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.762

10k+ parts

$3.203

346

-

-

$3.762

$3.203

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 64 parts In-Stock

1+ parts

$3.762

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$3.762

-

-

-

Digiode

USA . 432 parts In-Stock

1+ parts

$4.854

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$4.854

-

-

-

Cyclops Electronics Ltd

UK . 423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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423

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 382 parts In-Stock

1+ parts

$3.762

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$3.762

-

-

-

Corphita

USA . 1,595 parts In-Stock

1+ parts

$4.599

100+ parts

-

1k+ parts

-

10k+ parts

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1,595

$4.599

-

-

-

Microchip USA

USA . 435 parts In-Stock

1+ parts

$14.500

100+ parts

$14.300

1k+ parts

$14.190

10k+ parts

$14.090

435

$14.500

$14.300

$14.190

$14.090

Problanco Electronics

Mexico . 4,620 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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4,620

-

-

-

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TANS Electronics

Latvia . 3,945 parts In-Stock

1+ parts

-

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3,945

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-

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Kulean Microsystems

USA . 3,422 parts In-Stock

1+ parts

-

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10k+ parts

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3,422

-

-

-

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SupplyDigital Components

Austria . 3,390 parts In-Stock

1+ parts

-

100+ parts

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3,390

-

-

-

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Northwest PG Solutions

USA . 1,329 parts In-Stock

1+ parts

-

100+ parts

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1,329

-

-

-

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UHIMA Technologies

Türkiye . 915 parts In-Stock

1+ parts

-

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915

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Native Components

USA . 621 parts In-Stock

1+ parts

-

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621

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iodParts Technologies Inc.

India . 423 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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423

-

-

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Overview

Unleash the power of innovation with the FGHL50T65MQDT by Onsemi! This high-quality Insulated Gate Bipolar Transistor (IGBT) is a game-changer in the world of power control applications. With its N-channel configuration and built-in diode, this transistor offers unparalleled performance and reliability. From its fast turn-on and turn-off times to its impressive maximum power dissipation, the FGHL50T65MQDT is designed to exceed your expectations. Trust Onsemi's expertise and invest in cutting-edge technology that delivers value and efficiency. Elevate your projects with the FGHL50T65MQDT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides good insulation and protection for the IGBT, making it suitable for a variety of applications.

Maximum VCEsat: 1.8 V

Low VCEsat value indicates efficient power control and minimal energy loss in the IGBT.

Maximum Power Dissipation (Abs): 268 W

High power dissipation capability allows the IGBT to handle large amounts of power, making it suitable for high-power applications.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating provides flexibility in designing circuits with higher voltage requirements.

Maximum Collector Current (IC): 80 A

High collector current rating allows the IGBT to handle high current loads, making it suitable for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGHL50T65MQDT attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

144 ns

Nominal Turn On Time (ton):

51 ns

Maximum VCEsat:

1.8 V

Trade Compliance

FGHL50T65MQDT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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