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FGHL75T65LQDT

Onsemi

FGHL75T65LQDT by Onsemi

FGHL75T65LQDT by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.35V and IC of 80A, ideal for POWER CONTROL applications. It features a package style of FLANGE MOUNT, operating temperature range from -55 to 175°C, and a turn-off time of 696ns.

Median Price

$8.400

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 102 parts In-Stock

1+ parts

$7.050

100+ parts

$3.610

1k+ parts

$3.540

10k+ parts

-

102

$7.050

$3.610

$3.540

-

Mouser Electronics

USA . 400 parts In-Stock

1+ parts

$8.400

100+ parts

$5.230

1k+ parts

$4.240

10k+ parts

-

400

$8.400

$5.230

$4.240

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DigiKey

USA . 213 parts In-Stock

1+ parts

$8.410

100+ parts

-

1k+ parts

$3.662

10k+ parts

-

213

$8.410

-

$3.662

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Newark

USA . 2 parts In-Stock

1+ parts

$8.600

100+ parts

$4.320

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-

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2

$8.600

$4.320

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Element14

Singapore . 102 parts In-Stock

1+ parts

$11.740

100+ parts

$6.070

1k+ parts

$5.830

10k+ parts

-

102

$11.740

$6.070

$5.830

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Chip1Stop

Japan . 3,948 parts In-Stock

1+ parts

$22.900

100+ parts

$10.100

1k+ parts

$6.530

10k+ parts

-

3,948

$22.900

$10.100

$6.530

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Future Electronics

Canada . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.900

10k+ parts

$3.830

450

-

-

$3.900

$3.830

Verical

USA . 450 parts In-Stock

1+ parts

-

100+ parts

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$5.450

10k+ parts

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450

-

-

$5.450

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RS (Exports)

UK . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.619

10k+ parts

$3.682

450

-

-

$4.619

$3.682

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 563 parts In-Stock

1+ parts

$5.909

100+ parts

-

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-

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563

$5.909

-

-

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Vyrian

USA . 3,941 parts In-Stock

1+ parts

-

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3,941

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Flip Electronics

USA . 1,800 parts In-Stock

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1,800

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-

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IBS Electronics

USA . 914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.470

10k+ parts

$5.456

914

-

-

$5.470

$5.456

NAC Semi

USA . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.150

10k+ parts

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900

-

-

$7.150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 498 parts In-Stock

1+ parts

$3.980

100+ parts

-

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498

$3.980

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Corphita

USA . 175 parts In-Stock

1+ parts

$5.598

100+ parts

-

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175

$5.598

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-

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Microchip USA

USA . 221 parts In-Stock

1+ parts

$18.650

100+ parts

$18.380

1k+ parts

$18.250

10k+ parts

$18.120

221

$18.650

$18.380

$18.250

$18.120

Native Components

USA . 990 parts In-Stock

1+ parts

$35.575

100+ parts

-

1k+ parts

-

10k+ parts

$34.152

990

$35.575

-

-

$34.152

Northwest PG Solutions

USA . 1,121 parts In-Stock

1+ parts

$39.133

100+ parts

-

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1,121

$39.133

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QUARKTWIN TECHNOLOGY LTD

USA . 25,208 parts In-Stock

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Kulean Microsystems

USA . 7,039 parts In-Stock

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7,039

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GreenTree Electronics

Israel . 4,078 parts In-Stock

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4,078

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TANS Electronics

Latvia . 3,997 parts In-Stock

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3,997

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SupplyDigital Components

Austria . 2,356 parts In-Stock

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Problanco Electronics

Mexico . 1,192 parts In-Stock

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1,192

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UHIMA Technologies

Türkiye . 875 parts In-Stock

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875

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Perfect Parts

USA . 762 parts In-Stock

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Authorized Procurement Solutions

USA . 20 parts In-Stock

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20

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Overview

Discover the FGHL75T65LQDT by Onsemi, a high-quality Insulated Gate Bipolar Transistor (IGBT) designed for power control applications. With a maximum VCEsat of 1.35V and a maximum collector current of 80A, this single-channel transistor with built-in diode offers superior performance and reliability. The rectangular package shape and through-hole terminal form provide ease of installation, making it ideal for various industrial and commercial uses. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations in power dissipation, operating temperature, and gate-emitter voltage. Upgrade your power control systems with the FGHL75T65LQDT and experience unmatched efficiency and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower on-state voltage drop and faster switching speeds, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces component count, making the product more compact and efficient.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and precise control over electrical power.

Maximum VCEsat: 1.35 V

Low VCEsat value reduces power losses and improves efficiency in power control applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into existing systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure mechanical connection and are easy to solder onto a circuit board.

Nominal Turn Off Time (toff): 696 ns

Fast turn-off time improves the switching speed of the IGBT, reducing power losses and improving efficiency.

Maximum Power Dissipation (Abs): 469 W

High maximum power dissipation allows the IGBT to handle high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides mechanical support and easy installation in a variety of applications.

Maximum Operating Temperature: 175 °C

Wide operating temperature range makes the IGBT suitable for use in various environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

High maximum voltage rating allows the IGBT to handle high voltages safely and reliably.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage rating ensures reliable and stable operation of the IGBT.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the IGBT to function in cold environments without issues.

Maximum Collector Current (IC): 80 A

High maximum collector current rating enables the IGBT to handle high current loads effectively.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures efficient and accurate control of the IGBT.

Terminal Position: SINGLE

Single terminal position simplifies the connection and installation process of the IGBT.

Nominal Turn On Time (ton): 88 ns

Fast turn-on time improves the switching speed and efficiency of the IGBT, allowing for precise power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGHL75T65LQDT attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

696 ns

Nominal Turn On Time (ton):

88 ns

Maximum VCEsat:

1.35 V

Trade Compliance

FGHL75T65LQDT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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