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BUL43BBA

Onsemi

BUL43BBA by Onsemi

BUL43BBA by Onsemi is a NPN Power BJT with max. VCE of 350V, IC of 2A, and hFE of 6. Ideal for switching applications, it operates up to 150 °C with a fT of 13MHz. The transistor comes in a plastic/epoxy package with through-hole terminals in a flange mount style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,006 parts In-Stock

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Vyrian

USA . 71 parts In-Stock

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Problanco Electronics

Mexico . 7,737 parts In-Stock

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TANS Electronics

Latvia . 6,257 parts In-Stock

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SupplyDigital Components

Austria . 2,967 parts In-Stock

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Northwest PG Solutions

USA . 2,303 parts In-Stock

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Corphita

USA . 1,634 parts In-Stock

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Kulean Microsystems

USA . 1,068 parts In-Stock

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UHIMA Technologies

Türkiye . 630 parts In-Stock

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Native Components

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Corohmni

South Africa . 329 parts In-Stock

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Overview

Enhance your power control applications with the reliable BUL43BBA by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products that deliver exceptional performance and durability. Ideal for switching purposes, this NPN Power Bipolar Junction Transistor offers a maximum operating temperature of 150 °C and a maximum collector-emitter voltage of 350V, providing customers with a versatile and efficient solution for their electronic needs. Trust Onsemi and elevate your projects with the BUL43BBA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: NPN

NPN transistors have higher current gain and faster switching speeds, making them suitable for many applications.

Configuration: SINGLE

Simplified design and easy to integrate into circuits.

Transistor Application: SWITCHING

Optimized for switching applications, offering efficient performance.

Package Shape: RECTANGULAR

Space-saving design for compact circuit layouts.

Terminal Form: THROUGH-HOLE

Ease of mounting and soldering onto PCBs.

No. of Terminals: 3

Simple connection setup for basic circuit requirements.

Package Style (Meter): FLANGE MOUNT

Secure mounting option for stability and reliability.

Minimum DC Current Gain (hFE): 6

Ensures consistent and reliable amplification of current.

Maximum Operating Temperature: 150 °C

Can withstand high-temperature environments, increasing versatility in applications.

Maximum Collector-Emitter Voltage: 350 V

Allows for higher voltage applications without risk of damage.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its reliability and performance.

Maximum Collector Current (IC): 2 A

Capable of handling moderate current levels for various applications.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability for secure connections.

Terminal Position: SINGLE

Simplified wiring setup for easy integration into circuits.

Case Connection: COLLECTOR

Clear identification of terminal connections for proper circuit configuration.

Nominal Transition Frequency (fT): 13 MHz

Suitable for high-frequency applications, enabling faster data processing.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BUL43BBA attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

2 A

Maximum Collector-Emitter Voltage:

350 V

Configuration:

Minimum DC Current Gain (hFE):

6

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BUL43BBA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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