Loading...

AR0130CSSC00SPBA0-DP1

Onsemi

AR0130CSSC00SPBA0-DP1 by Onsemi

Onsemi's AR0130CSSC00SPBA0-DP1 is a 1/3 inch CMOS image sensor with 1280x960 pixels. It operates at 50 MHz with a dynamic range of 82 dB and outputs digital voltage in the range of 0.40-1.50V. Ideal for applications requiring high-resolution imaging, such as surveillance cameras and industrial machine vision systems.

Median Price

$7.070

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 277 parts In-Stock

1+ parts

-

100+ parts

$7.070

1k+ parts

$6.320

10k+ parts

$5.950

277

-

$7.070

$6.320

$5.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 796 parts In-Stock

1+ parts

$7.448

100+ parts

-

1k+ parts

-

10k+ parts

-

796

$7.448

-

-

-

Vyrian

USA . 6,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,310

-

-

-

-

Chip Stock

USA . 3,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,088

-

-

-

-

Flip Electronics

USA . 109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

109

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,334 parts In-Stock

1+ parts

$7.056

100+ parts

-

1k+ parts

-

10k+ parts

-

2,334

$7.056

-

-

-

Corohmni

South Africa . 396 parts In-Stock

1+ parts

$7.840

100+ parts

-

1k+ parts

-

10k+ parts

-

396

$7.840

-

-

-

AZTECH Wire

Italy . 651 parts In-Stock

1+ parts

$10.780

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$10.780

-

-

-

Problanco Electronics

Mexico . 6,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,660

-

-

-

-

TANS Electronics

Latvia . 4,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,922

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

SupplyDigital Components

Austria . 3,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,215

-

-

-

-

Kulean Microsystems

USA . 1,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

-

-

-

-

Northwest PG Solutions

USA . 1,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,341

-

-

-

-

Native Components

USA . 995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

995

-

-

-

-

UHIMA Technologies

Türkiye . 829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

829

-

-

-

-

RC Electronics

USA . 359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

359

-

-

-

-

Kepictronics

USA . 299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

299

-

-

-

-

Overview

Capture every moment with the Onsemi AR0130CSSC00SPBA0-DP1 Image Sensor. Known for its exceptional quality and precision engineering, Onsemi delivers cutting-edge technology that exceeds expectations. This image sensor is perfect for a wide range of applications, offering unparalleled value and performance. From security cameras to industrial automation, this sensor provides crystal-clear images with a dynamic range that will elevate your projects to the next level. Trust Onsemi to deliver excellence in every pixel.

Feature Benefit Bullets

Pixel Size (um) 3.75

Small pixel size allows for higher resolution images to be captured

Maximum Supply Voltage 1.95 V

Low maximum supply voltage helps in reducing power consumption

Master Clock 50 MHz

High master clock frequency enables faster data processing

Body Width 11.43 inch

Compact size makes it suitable for various applications

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensor provides high image quality and low power consumption

Body Height 1.535 mm

Slim profile makes it suitable for space-constrained designs

Package Shape or Style SQUARE

Square package shape allows for easier integration into circuit boards

Minimum Supply Voltage 1.7 V

Low minimum supply voltage helps in reducing power consumption

Maximum Operating Temperature 70 °C

Wide operating temperature range makes it suitable for various environments

Horizontal Pixel 1280

High horizontal pixel count allows for detailed image capture

Output Range 0.40-1.50V

Wide output range provides flexibility in signal processing

Output Type DIGITAL VOLTAGE

Digital output simplifies interfacing with other components

Minimum Operating Temperature -30 °C

Low minimum operating temperature range makes it suitable for cold environments

Maximum Operating Current 65 mA

Low maximum operating current helps in reducing power consumption

Housing PLASTIC

Plastic housing is lightweight and cost-effective

Dynamic Range 82 dB

High dynamic range allows for capturing both bright and dark areas in an image

Vertical Pixel 960

High vertical pixel count allows for detailed image capture

Body Length/Diameter 11.43 mm

Compact size makes it suitable for various applications

Optical Format (inch) 1/3

1/3 inch optical format is commonly used in image sensors for consumer electronics

Termination Type SOLDER

Solder termination provides secure electrical connections

Output Interface Type 2-WIRE INTERFACE

2-wire interface simplifies connectivity with other devices

Frame Rate 60 fps

High frame rate allows for capturing fast-moving objects with clarity

Array Type FRAME

Frame array type provides efficient image capture and processing

Mounting Feature SURFACE MOUNT

Surface mount feature allows for easy and secure mounting on circuit boards

Technical Specifications

Image Sensors AR0130CSSC00SPBA0-DP1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5 TO 3.1 V

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

1.535 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

82 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

Housing:

PLASTIC

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

65 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20