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Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.

Other Function Telecom Interface ICs

Available Parts 1,254

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
TDK5110XUMA1 by Infineon Technologies

TDK5110XUMA1

Infineon Technologies

Infineon's TDK5110XUMA1 is a telecom IC with 16 terminals, operating from -40 to 125°C. It has a small outline package, 0.65mm terminal pitch, and Gull Wing terminals. Ideal for automotive applications requiring a 3V supply voltage in a compact design.

R-PDSO-G16

5 mm

3

1

16

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

.65 mm

DUAL

4.4 mm

TDK5101XUMA1 by Infineon Technologies

TDK5101XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

5 mm

3

1

16

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

.65 mm

DUAL

4.4 mm

TDK5110FHTMA1 by Infineon Technologies

TDK5110FHTMA1

Infineon Technologies

Infineon's TDK5110FHTMA1 is a telecom IC with 10 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and consumes 0.021mA current. This small outline IC in plastic package is ideal for automotive telecom applications.

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.1/4

Not Qualified

1.1 mm

Other Telecom ICs

.021 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5116FHTMA1 by Infineon Technologies

TDK5116FHTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDA5212XUMA1 by Infineon Technologies

TDA5212XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

TDA7100HTMA1 by Infineon Technologies

TDA7100HTMA1

Infineon Technologies

TDA7100HTMA1 by Infineon Technologies is a telecom interface IC with 10 terminals in a small outline package. Operating temperature range from -20 to 70°C, suitable for telecom circuits with a nominal voltage of 3V. Features matte tin finish, gull wing terminal form, and shrink pitch package style.

S-PDSO-G10

e3

3 mm

1

1

10

70 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

OTHER

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5111FHTMA1 by Infineon Technologies

TDK5111FHTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5100FHTMA1 by Infineon Technologies

TDK5100FHTMA1

Infineon Technologies

Infineon's TDK5100FHTMA1 is a telecom IC with 10 terminals, operating from -40 to 125°C. Its small outline package is surface-mountable and has a matte tin finish. Ideal for automotive applications, this IC operates at 3V and features a square shape with a 3x3mm footprint.

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5101FHTMA1 by Infineon Technologies

TDK5101FHTMA1

Infineon Technologies

Infineon's TDK5101FHTMA1 is a telecom IC with 10 terminals in a small outline, thin profile package. Operating b/w -40°C to 125°C, it has matte tin finish and dual terminal position suitable for automotive applications. With a nominal voltage of 3V, it is designed for telecom circuits requiring precise temperature control.

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDA5220XUMA1 by Infineon Technologies

TDA5220XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

9.7 mm

3

1

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

TDA5150HTMA1 by Infineon Technologies

TDA5150HTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G10

e3

3 mm

1

1

10

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.05 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

GULL WING

.5 mm

DUAL

3 mm

TDA7116FHTMA1 by Infineon Technologies

TDA7116FHTMA1

Infineon Technologies

TDA7116FHTMA1 by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and dual terminal position. This IC is suitable for telecom circuits requiring a nominal voltage of 3V in industrial temperature environments.

S-PDSO-G10

e3

3 mm

1

1

10

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDA5200XUMA1 by Infineon Technologies

TDA5200XUMA1

Infineon Technologies

TDA5200XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminal form, and 5V supply voltage. Ideal for telecom circuits, it is surface mountable and has a moisture sensitivity level of 3.

R-PDSO-G28

e3

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

GULL WING

.65 mm

DUAL

4.4 mm

TDA5201XUMA1 by Infineon Technologies

TDA5201XUMA1

Infineon Technologies

TDA5201XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminals, and 5V supply voltage. Ideal for telecom circuits in industrial applications due to its compact size and high temperature range.

R-PDSO-G28

e3

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

GULL WING

.65 mm

DUAL

4.4 mm

TDK5100XUMA1 by Infineon Technologies

TDK5100XUMA1

Infineon Technologies

Infineon's TDK5100XUMA1 is a telecom IC with 16 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and low current draw of 0.0095mA. This small outline package is ideal for automotive applications due to its bipolar technology and moisture sensitivity level of 3.

R-PDSO-G16

5 mm

3

1

16

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.1/4

Not Qualified

1.2 mm

Other Telecom ICs

.0095 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

.65 mm

DUAL

4.4 mm

MLX90109CDC-AAA-000-RE by Melexis N V

MLX90109CDC-AAA-000-RE

Melexis N V

MLX90109CDC-AAA-000-RE by Melexis N V is a telecom IC with 8 terminals, operating at -40 to 70°C. It has a small outline package style, matte tin finish, and gull wing terminal form. Ideal for telecom circuits, it requires a nominal 5V supply voltage and features a rectangular shape measuring 4.9mm x 3.9mm.

R-PDSO-G8

e3

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

1.72 mm

5 V

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

3.9 mm

MLX90109EDC-AAA-000-TU by Melexis N V

MLX90109EDC-AAA-000-TU

Melexis N V

MLX90109EDC-AAA-000-TU by Melexis N V is an 8-terminal telecom IC with a supply voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and has a small outline package style. Ideal for telecom circuits, it features matte tin terminal finish and gull wing terminal form.

R-PDSO-G8

e3

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

1.72 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

3.9 mm

ENW89829A2KF by Panasonic

ENW89829A2KF

Panasonic

The Panasonic ENW89829A2KF is a telecom interface IC with 24 terminals, operating b/w -40°C to 85°C. It has a data rate of 2.178 Mbps and operates at a nominal voltage of 3.3V. This surface-mount IC is ideal for industrial applications requiring high-speed telecom circuit functionality in compact microelectronic assemblies.

2.178 Mbps

R-XXMA-N24

9.5 mm

1

24

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

250

2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UNSPECIFIED

50

9 mm

CC2564NSRVMR by Texas Instruments

CC2564NSRVMR

Texas Instruments

CC2564NSRVMR by Texas Instruments is a telecom IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features matte tin terminal finish and very thin profile design.

S-PQCC-N40

e3

8 mm

3

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

8 mm

CC2564NSYFVR by Texas Instruments

CC2564NSYFVR

Texas Instruments

The Texas Instruments CC2564NSYFVR is a telecom IC with 54 terminals in a grid array package. It operates b/w -40°C to 85°C, with peak reflow temperature of 260°C. Suitable for industrial applications, it has a nominal voltage of 3.6V and features tin silver copper terminal finish.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564NYFVR by Texas Instruments

CC2564NYFVR

Texas Instruments

Texas Instruments CC2564NYFVR is a 54-terminal IC with industrial temperature grade. It operates at -40 to 85°C, with a peak reflow temp of 260°C. Ideal for telecom circuits, it has a nominal voltage of 3.6V and features surface mount packaging in plastic/epoxy material.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVR by Texas Instruments

CC2564YFVR

Texas Instruments

Texas Instruments CC2564YFVR is a telecom IC with 54 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. Ideal for industrial applications requiring reliable telecom circuit interfaces in a surface-mount grid array package.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVT by Texas Instruments

CC2564YFVT

Texas Instruments

The Texas Instruments CC2564YFVT is a telecom IC with 54 terminals, operating from -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. This rectangular grid array package is ideal for industrial telecom applications.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PGA5807RGCR by Texas Instruments

PGA5807RGCR

Texas Instruments

PGA5807RGCR by Texas Instruments is a 64-terminal telecom IC with a 3.3V supply voltage, operating from -40 to 85°C. It features a nickel palladium gold finish, no-lead terminal form, and quad position for industrial applications requiring very thin profile chip carriers in surface-mount packages.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

PGA5807RGCT by Texas Instruments

PGA5807RGCT

Texas Instruments

PGA5807RGCT by Texas Instruments is a 64-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, nickel palladium gold terminal finish, and no-lead terminal form. Ideal for industrial applications requiring very thin profile packages in surface mount configurations.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

LMX5251SQX/NOPB by Texas Instruments

LMX5251SQX/NOPB

Texas Instruments

LMX5251SQX/NOPB by Texas Instruments is a 48-terminal IC with 3/3.3V power supplies, operating from -40 to 85°C. It features CMOS technology, matte tin finish, and 0.078mA max supply current. Ideal for telecom circuits, it comes in a square chip carrier package with a very thin profile for industrial applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3/3.3

Not Qualified

.8 mm

Other Telecom ICs

.078 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

LMX5252LQX/NOPB by Texas Instruments

LMX5252LQX/NOPB

Texas Instruments

LMX5252LQX/NOPB by Texas Instruments is a CMOS telecom IC with 36 terminals in a square chip carrier package. Operating b/w -40 to 85 °C, it requires 2.75V supply voltage and draws 0.055mA current. Ideal for telecom circuits, this IC has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.

S-XQCC-N36

e3

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.75

Not Qualified

.8 mm

Other Telecom ICs

.055 mA

2.75 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

6 mm

ALM-GP002-TR1G by Broadcom

ALM-GP002-TR1G

Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N12

4.5 mm

3

1

12

85 Cel

-40 Cel

UNSPECIFIED

QCCN

RECTANGULAR

CHIP CARRIER

260

1.05 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

2.2 mm

TCA5013ZAHR by Texas Instruments

TCA5013ZAHR

Texas Instruments

TCA5013ZAHR by Texas Instruments is a 48-terminal, telecom interface IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This square-shaped IC is designed for telecom circuits, featuring a thin profile package body suitable for surface mount applications.

S-PBGA-B48

e1

5 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

BQ500212ARGZT by Texas Instruments

BQ500212ARGZT

Texas Instruments

Texas Instruments BQ500212ARGZT is a telecom interface IC with 48 terminals in a square chip carrier package. Operating b/w -40 to 110°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for industrial applications requiring no-lead terminal form and MSL level 3 moisture sensitivity.

S-PQCC-N48

e4

7 mm

3

1

48

110 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

HPA02286ARLL by Texas Instruments

HPA02286ARLL

Texas Instruments

Texas Instruments' HPA02286ARLL is a 24-terminal telecom interface IC in a square chip carrier package. With a supply voltage of 3.3V, it operates b/w 0-85°C and has a terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface-mountable and features nickel palladium gold terminal finish.

S-PQCC-N24

e4

3 mm

2

1

24

85 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

ADN2915ACPZ by Analog Devices

ADN2915ACPZ

Analog Devices

ADN2915ACPZ by Analog Devices is a telecom IC with 24 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and consumes 0.3774mA current. This CMOS technology chip carrier is suitable for telecom circuit applications due to its compact square shape and low power consumption.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.2,1.8/3.3,3.3

Not Qualified

1 mm

ATM/SONET/SDH ICs

.3774 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

BLUENRGQTR by STMicroelectronics

BLUENRGQTR

STMicroelectronics

BLUENRGQTR by STMicroelectronics is a 32-terminal telecom IC with 3V supply voltage. It operates b/w -40 to 85 °C, in industrial settings. This square-shaped chip carrier is surface-mountable and has a very thin profile, suitable for telecom circuit applications.

S-XQCC-N32

5 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

SST12LF02-QXCE by Microchip Technology

SST12LF02-QXCE

Microchip Technology

SST12LF02-QXCE by Microchip: Telecom IC with 16 terminals, 3.3V supply voltage, -20 to 85°C operating temp. Ideal for telecom circuits, surface mountable in a square chip carrier package with 0.5mm terminal pitch.

S-XQCC-N16

e3

3 mm

1

16

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

MATTE TIN

NO LEAD

.5 mm

QUAD

3 mm

STS1TXQTR by STMicroelectronics

STS1TXQTR

STMicroelectronics

STS1TXQTR by STMicroelectronics is a telecom IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V and terminal pitch of 0.5mm, it's ideal for telecom interface applications.

S-XQCC-N20

4 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

4 mm

WL1801MODGBMOCR by Texas Instruments

WL1801MODGBMOCR

Texas Instruments

WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCR by Texas Instruments

WL1805MODGBMOCR

Texas Instruments

Texas Instruments' WL1805MODGBMOCR is a Telecom Interface IC with 100 terminals in a grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for telecom circuits, this surface-mount IC has a compact rectangular shape and nickel palladium gold finish.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCT by Texas Instruments

WL1805MODGBMOCT

Texas Instruments

WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1831MODGBMOCT by Texas Instruments

WL1831MODGBMOCT

Texas Instruments

WL1831MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a data rate of 100 Mbps and nominal voltage of 3.7V. Ideal for telecom circuits, it features surface mount capability and measures 13.4mm x 13.3mm in size.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

XWL1801MODGAMOCT by Texas Instruments

XWL1801MODGAMOCT

Texas Instruments

XWL1801MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm x 13.4mm and terminal pitch of 0.7mm. Ideal for telecom interface applications requiring surface mount technology.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1805MODGAMOCT by Texas Instruments

XWL1805MODGAMOCT

Texas Instruments

XWL1805MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm width and 13.4mm length. Ideal for telecom circuits, this IC is surface mountable and has a terminal pitch of 0.7mm for various applications.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1831MODGAMOCT by Texas Instruments

XWL1831MODGAMOCT

Texas Instruments

XWL1831MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a grid array package. It operates b/w -20°C to 70°C, making it suitable for various telecom circuit applications. The compact rectangular design with bottom terminals and no-lead form factor ensures easy surface mount installation.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1835MODGAMOCT by Texas Instruments

XWL1835MODGAMOCT

Texas Instruments

XWL1835MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a nominal voltage of 3.7V. This IC is designed for telecom circuit applications requiring surface mount installation and has a compact size of 13.3mm x 13.4mm x 2mm.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

3.7 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

CC2538NF11RTQT by Texas Instruments

CC2538NF11RTQT

Texas Instruments

CC2538NF11RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable and features nickel palladium gold terminal finish.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538NF23RTQT by Texas Instruments

CC2538NF23RTQT

Texas Instruments

CC2538NF23RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates b/w -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable with nickel palladium gold finish and very thin profile.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538NF53RTQT by Texas Instruments

CC2538NF53RTQT

Texas Instruments

CC2538NF53RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates b/w -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable and features nickel palladium gold terminal finish.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538SF23RTQT by Texas Instruments

CC2538SF23RTQT

Texas Instruments

CC2538SF23RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, has 56 terminals in a square package style, and supports a nominal voltage of 3V. This surface-mount IC features nickel palladium gold terminal finish and very thin profile packaging.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2560BRVMR by Texas Instruments

CC2560BRVMR

Texas Instruments

CC2560BRVMR by Texas Instruments is a telecom IC with 76 terminals, operating at -40 to 85°C. It has a data rate of 4 Mbps and nominal voltage of 3.6V, suitable for telecom circuit applications. The package style is chip carrier with matte tin finish, measuring 7.73mm in width and 8mm in length.

4 Mbps

R-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

7.73 mm