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Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.

Other Function Telecom Interface ICs

Available Parts 1,254

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
AD73360ARZ-REEL7 by Analog Devices

AD73360ARZ-REEL7

Analog Devices

AD73360ARZ-REEL7 by Analog Devices is a CMOS telecom IC with 28 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it has matte tin finish and gull wing terminal form.

R-PDSO-G28

e3

17.9 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

2.65 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

30

7.5 mm

AD974BRS-RL7 by Analog Devices

AD974BRS-RL7

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

10.2 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

240

Not Qualified

2 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

5.3 mm

AN7580 by Panasonic

AN7580

Panasonic

The Panasonic AN7580 is a telecom interface IC with 12 terminals, operating temperature range of -25 to 75°C. It features bipolar technology, nominal voltage of 12V, and is designed for telecom circuit applications. The package style is in-line rectangular made of plastic/epoxy material.

R-PSIP-T12

1

12

75 Cel

-25 Cel

PLASTIC/EPOXY

SIP

RECTANGULAR

IN-LINE

Not Qualified

12 V

NO

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

SINGLE

TRF2436IRTBRG4 by Texas Instruments

TRF2436IRTBRG4

Texas Instruments

TRF2436IRTBRG4 by Texas Instruments is a 40-terminal telecom IC with 3.3V supply voltage, operating b/w -20 to 85°C. It features a square chip carrier package style and matte tin terminal finish, suitable for telecom circuit applications requiring low power consumption at 0.55mA.

S-PQCC-N40

e3

6 mm

3

1

40

85 Cel

-20 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

.9 mm

Other Telecom ICs

.55 mA

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

MATTE TIN

NO LEAD

.5 mm

QUAD

30

6 mm

XE1203FI063TRLF by Semtech

XE1203FI063TRLF

Semtech

Semtech's XE1203FI063TRLF is a 48-terminal IC with 2.5/3.3V supplies, suitable for telecom circuits in industrial settings. With a compact square chip carrier package and low supply current of 0.075mA, it operates b/w -40 to 85°C temperatures efficiently.

S-PQCC-N48

e3

7 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5/3.3

Not Qualified

.9 mm

Other Telecom ICs

.075 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Matte Tin (Sn)

NO LEAD

.5 mm

QUAD

7 mm

STPAC01F2 by STMicroelectronics

STPAC01F2

STMicroelectronics

STPAC01F2 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It features an operating temp range of -30 °C to 85°C, a nominal voltage of 2.7V, and an ultra-thin profile with 8 terminals. Ideal for compact telecom devices, it ensures reliable performance in various environments.

S-PBGA-B8

1.57 mm

1

8

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.715 mm

2.7 V

YES

TELECOM CIRCUIT

OTHER

BALL

.5 mm

BOTTOM

1.57 mm

CY7B9234-270JXCT by Cypress Semiconductor

CY7B9234-270JXCT

Cypress Semiconductor

CY7B9234-270JXCT by Cypress Semiconductor is a BICMOS technology chip carrier with 28 terminals. It operates b/w 0-70°C, has matte tin finish, and supports 5V supply voltage. Ideal for telecom circuits, it is a square-shaped, surface-mountable IC for various telecom interface applications.

S-PQCC-J28

e3

11.5316 mm

3

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

260

Not Qualified

4.572 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

J BEND

1.27 mm

QUAD

20

11.5316 mm

CY7B9334-270JXC by Cypress Semiconductor

CY7B9334-270JXC

Cypress Semiconductor

CY7B9334-270JXC by Cypress Semiconductor is a BICMOS technology telecom IC with 28 terminals in a square chip carrier package. It operates b/w 0°C to 70°C, suitable for telecom circuits requiring a nominal voltage of 5V. The PLASTIC/EPOXY body material and J BEND terminal form make it ideal for surface mount applications.

S-PQCC-J28

11.5316 mm

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

NOT SPECIFIED

Not Qualified

4.572 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

J BEND

1.27 mm

QUAD

NOT SPECIFIED

11.5316 mm

SN65LVPE501RGET by Texas Instruments

SN65LVPE501RGET

Texas Instruments

SN65LVPE501RGET by Texas Instruments is a telecom interface IC with 2 functions, operating at 3.3V. It features a data rate of 5 Mbps and is designed for industrial applications requiring a temperature range from -40 to 85°C. This chip carrier package has 24 terminals, is surface mountable, and uses CMOS technology.

5 Mbps

S-PQCC-N24

e4

4 mm

2

2

2

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER

260

3.3

Not Qualified

1 mm

Other Telecom ICs

.12 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

SN65LVPE502RGET by Texas Instruments

SN65LVPE502RGET

Texas Instruments

SN65LVPE502RGET by Texas Instruments is a telecom interface IC with 2 functions, operating at 3.3V. It features a data rate of 5 Mbps and comes in a square chip carrier package, suitable for telecom circuit applications. With a terminal pitch of 0.5mm and no lead terminal form, it offers high performance in compact designs.

5 Mbps

S-PQCC-N24

e4

4 mm

2

2

2

24

85 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER

260

3.3

Not Qualified

1 mm

Other Telecom ICs

.12 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

RI-TRP-R4FF-01 by Texas Instruments

RI-TRP-R4FF-01

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; No. of Functions: 1; Minimum Operating Temperature: -25 Cel; Maximum Operating Temperature: 50 Cel; Qualification: Not Qualified;

1

1

50 Cel

-25 Cel

Not Qualified

TELECOM CIRCUIT

OTHER

RI-TRP-W4FF-01 by Texas Instruments

RI-TRP-W4FF-01

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Operating Temperature: 50 Cel; Qualification: Not Qualified; Minimum Operating Temperature: -25 Cel; No. of Functions: 1;

1

1

50 Cel

-25 Cel

Not Qualified

TELECOM CIRCUIT

OTHER

TLK6201EARGTRG4 by Texas Instruments

TLK6201EARGTRG4

Texas Instruments

TLK6201EARGTRG4 by Texas Instruments is a 16-terminal telecom IC with 3.3V supply voltage and 6250 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has a compact chip carrier package suitable for telecom circuit applications.

6250 Mbps

S-PQCC-N16

e4

3 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.12SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

.067 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

TLK6201EARGTT by Texas Instruments

TLK6201EARGTT

Texas Instruments

TLK6201EARGTT by Texas Instruments is a 16-terminal telecom IC with 3.3V supply voltage and 6250 Mbps data rate. It operates b/w -40 to 85°C, suitable for industrial applications requiring high-speed communication in a compact chip carrier package.

6250 Mbps

S-PQCC-N16

e4

3 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.12SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

.067 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

TLK4201EARGTR by Texas Instruments

TLK4201EARGTR

Texas Instruments

TLK4201EARGTR by Texas Instruments is a telecom IC with 16 terminals, operating at 3.3V. It offers a data rate of 4250 Mbps and operates in industrial temperature range (-40 to 85°C). This chip carrier package is suitable for telecom circuit applications requiring high-speed data transmission.

4250 Mbps

S-PQCC-N16

e4

3 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.12SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

.038 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

HT2DC20S20/F,122 by NXP Semiconductors

HT2DC20S20/F,122

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; No. of Functions: 1; Qualification: Not Qualified;

R-PXSS-N

1

85 Cel

-40 Cel

PLASTIC/EPOXY

MODULE(UNSPEC)

RECTANGULAR

SPECIAL SHAPE

NOT SPECIFIED

Not Qualified

Other Telecom ICs

YES

HYBRID

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

HTRC11001T/02EE,11 by NXP Semiconductors

HTRC11001T/02EE,11

NXP Semiconductors

NXP Semiconductors' HTRC11001T/02EE,11 is a telecom interface IC with 14 terminals and 5V supply voltage. It operates b/w -40 to 85°C, suitable for industrial applications. The package style is small outline, surface mountable, with nickel palladium gold finish.

R-PDSO-G14

e4

8.75 mm

1

1

14

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

260

5

Not Qualified

Other Telecom ICs

.01 mA

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

30

4 mm

HTSFCH4801EV/DH,11 by NXP Semiconductors

HTSFCH4801EV/DH,11

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Qualification: Not Qualified;

X-XUUC-N

e4

1

85 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

UPPER

HTSMOH3201EV,118 by NXP Semiconductors

HTSMOH3201EV,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;

X-XUUC-N

1

85 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

TELECOM CIRCUIT

OTHER

NO LEAD

UPPER

HTSMOH5601EV,118 by NXP Semiconductors

HTSMOH5601EV,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Qualification: Not Qualified;

X-XUUC-N

e4

1

85 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

TELECOM CIRCUIT

OTHER

SILVER

NO LEAD

UPPER

PN5110A0HN1/C2,118 by NXP Semiconductors

PN5110A0HN1/C2,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

e4

5 mm

1

1

32

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

1 mm

3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

5 mm

PN5110A0HN1/C2,151 by NXP Semiconductors

PN5110A0HN1/C2,151

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

e4

5 mm

1

1

32

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

1 mm

3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

5 mm

PN5120A0HN1/C1,151 by NXP Semiconductors

PN5120A0HN1/C1,151

NXP Semiconductors

PN5120A0HN1/C1,151 by NXP Semiconductors is a telecom interface IC with 32 terminals and power supplies of 1.8/3.3V, suitable for telecom circuits. It operates b/w -30 to 85°C, has a terminal pitch of 0.5mm, and features a nickel palladium gold finish for robust connectivity in various applications.

S-PQCC-N32

e4

5 mm

1

1

32

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.3,2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

5 mm

SA5211D/01,112 by NXP Semiconductors

SA5211D/01,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G14

e4

8.65 mm

1

1

14

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

5 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

SA5211D/01,118 by NXP Semiconductors

SA5211D/01,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G14

e4

8.65 mm

1

1

14

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

5 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

SA5212AD/01,112 by NXP Semiconductors

SA5212AD/01,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e4

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

5 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

SA5212AD/01,118 by NXP Semiconductors

SA5212AD/01,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e4

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

5 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

SA5217D/01,112 by NXP Semiconductors

SA5217D/01,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

12.8 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

2.65 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

SA5217D/01,118 by NXP Semiconductors

SA5217D/01,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

12.8 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

2.65 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

SA58646BD,118 by NXP Semiconductors

SA58646BD,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G64

e3

10 mm

1

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

3 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

GULL WING

.5 mm

QUAD

10 mm

SA602AN/01,112 by NXP Semiconductors

SA602AN/01,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

R-PDIP-T8

e4

9.5 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Not Qualified

4.2 mm

6 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

SA612AN/01,112 by NXP Semiconductors

SA612AN/01,112

NXP Semiconductors

SA612AN/01,112 by NXP Semiconductors is an 8-terminal IC with a rectangular package style. Operating b/w -40°C to 85°C, it has a nominal voltage of 6V and terminal pitch of 2.54mm. Ideal for telecom circuits, this IC features nickel palladium gold terminal finish and is designed for industrial temperature grades.

R-PDIP-T8

e4

9.5 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Not Qualified

4.2 mm

6 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

MCP2140A-I/P by Microchip Technology

MCP2140A-I/P

Microchip Technology

MCP2140A-I/P by Microchip: Telecom IC with 18 terminals, CMOS tech, 3V supply voltage. Ideal for telecom circuits in industrial settings. Operating temp -40 to 85°C, package style in-line, TS 16949 screening level.

R-PDIP-T18

e3

22.86 mm

1

18

85 Cel

-40 Cel

PLASTIC/EPOXY

DIP

DIP18,.3

RECTANGULAR

IN-LINE

Not Qualified

TS 16949

5.334 mm

3 V

NO

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

MCP2140A-I/SO by Microchip Technology

MCP2140A-I/SO

Microchip Technology

MCP2140A-I/SO by Microchip Technology is a CMOS telecom IC with 18 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features matte tin terminal finish and gull wing terminal form.

R-PDSO-G18

e3

11.55 mm

2

1

18

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP18,.4

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

TS 16949

2.65 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

40

7.5 mm

SA602AD/01,112 by NXP Semiconductors

SA602AD/01,112

NXP Semiconductors

SA602AD/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating from -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.65mm. Ideal for telecom circuits, this IC is surface mountable and features nickel/palladium/gold/silver terminal finish.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

GULL WING

.65 mm

DUAL

30

4.4 mm

SA602AD/01,118 by NXP Semiconductors

SA602AD/01,118

NXP Semiconductors

SA602AD/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold silver terminal finish and 3V nominal voltage.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

GULL WING

.65 mm

DUAL

30

4.4 mm

SA606D/01,112 by NXP Semiconductors

SA606D/01,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA606D/01,118 by NXP Semiconductors

SA606D/01,118

NXP Semiconductors

SA606D/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C. It features nickel palladium gold terminal finish and is ideal for telecom circuit applications.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA606DK/01,112 by NXP Semiconductors

SA606DK/01,112

NXP Semiconductors

SA606DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel/palladium/gold terminal finish and Gull Wing form factor.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

SA606DK/01,118 by NXP Semiconductors

SA606DK/01,118

NXP Semiconductors

SA606DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, with terminal finish of nickel palladium gold. Ideal for telecom circuits requiring nominal voltage of 3V and industrial temperature grade.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

SA607DK/01,112 by NXP Semiconductors

SA607DK/01,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA607DK/01,118 by NXP Semiconductors

SA607DK/01,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA612AD/01,112 by NXP Semiconductors

SA612AD/01,112

NXP Semiconductors

SA612AD/01,112 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. This small outline, low profile IC is ideal for telecom circuit applications.

R-PDSO-G8

e4

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.75 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

SA612AD/01,118 by NXP Semiconductors

SA612AD/01,118

NXP Semiconductors

SA612AD/01,118 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This small outline IC is suitable for telecom circuit applications due to its dual terminal position and gull wing form factor.

R-PDSO-G8

e4

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.75 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

GULL WING

1.27 mm

DUAL

30

3.9 mm

SA616DK/01,112 by NXP Semiconductors

SA616DK/01,112

NXP Semiconductors

SA616DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and gull wing form factor for telecom circuit applications.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA616DK/01,118 by NXP Semiconductors

SA616DK/01,118

NXP Semiconductors

SA616DK/01,118 by NXP Semiconductors is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates at temperatures ranging from -40 to 85 °C. It is suitable for telecom circuit applications.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA636DK/01,112 by NXP Semiconductors

SA636DK/01,112

NXP Semiconductors

SA636DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include nickel palladium gold terminal finish, 3V supply voltage, and gull wing terminal form for telecom circuit applications.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

SSOP20,.25

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

SA636DK/01,118 by NXP Semiconductors

SA636DK/01,118

NXP Semiconductors

SA636DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and 3V nominal voltage for telecom circuit applications.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

SSOP20,.25

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm