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TLK6201EARGTRG4

Texas Instruments

TLK6201EARGTRG4 by Texas Instruments

TLK6201EARGTRG4 by Texas Instruments is a 16-terminal telecom IC with 3.3V supply voltage and 6250 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has a compact chip carrier package suitable for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,882 parts In-Stock

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3,882

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Digiode

USA . 3,639 parts In-Stock

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3,639

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Distributors (Availability)

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AZTECH Wire

Italy . 681 parts In-Stock

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$4.957

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681

$4.957

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Parana Technologies

USA . 1,509 parts In-Stock

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$8.119

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$8.713

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1,509

$8.119

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$8.713

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DigiPath Technology Company

USA . 1,372 parts In-Stock

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$8.940

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$8.224

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1,372

$8.940

$8.224

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ChromeModa Solutions

Germany . 3,911 parts In-Stock

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$9.122

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$7.480

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$9.122

$7.480

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IDEA Electronic Components Group

UK . 1,196 parts In-Stock

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$9.122

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$8.666

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$8.210

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1,196

$9.122

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$8.210

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One Stop Electronics

USA . 130 parts In-Stock

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$915.000

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130

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Corphita

USA . 2,885 parts In-Stock

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Microchip USA

USA . 1,950 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the TLK6201EARGTRG4 by Texas Instruments. Crafted with precision and excellence, this telecom interface IC ensures reliable performance in various applications. Whether you're looking to enhance your communication systems or upgrade your networking devices, this product delivers unparalleled quality and efficiency. Experience the difference with Texas Instruments, a trusted name in the industry, and elevate your projects to new heights. Embrace innovation, reliability, and superior performance with the TLK6201EARGTRG4, your gateway to a seamless connectivity experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient.

Package Shape: SQUARE

The square shape helps in optimizing space on the PCB.

Power Supplies (V): 3.3

Operating at 3.3V allows for compatibility with standard power supplies.

No. of Terminals: 16

Having 16 terminals provides flexibility for connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style enhances thermal performance and overall reliability.

Maximum Operating Temperature: 85 °C

Being able to operate at up to 85°C ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40°C makes it suitable for extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and reliability.

Maximum Seated Height: 1 mm

The low seated height helps in minimizing the overall profile of the product.

Width: 3 mm

The compact width allows for efficient use of space on the PCB.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures robust soldering during assembly.

Temperature Grade: INDUSTRIAL

Being industrial-grade means the product is suitable for rugged and harsh operating conditions.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and helps in RoHS compliance.

Maximum Supply Current: 0.067 mA

The low maximum supply current helps in energy efficiency.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring optimal performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V makes it compatible with standard power sources.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting on the PCB.

Data Rate: 6250 Mbps

The high data rate of 6250 Mbps enables fast and efficient data transmission.

Moisture Sensitivity Level (MSL): 2

Having an MSL of 2 indicates a moderate level of moisture sensitivity, ensuring reliability during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs TLK6201EARGTRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

6250 Mbps

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.067 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

TLK6201EARGTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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