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TLK6201EARGTTG4

Texas Instruments

TLK6201EARGTTG4 by Texas Instruments

TLK6201EARGTTG4 by Texas Instruments is a 16-terminal telecom IC with 3.3V supply voltage, operating b/w -40 to 85°C. It features a no-lead terminal form, quad position, and nickel palladium gold finish. Ideal for industrial applications requiring very thin profile chip carriers in surface mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,253 parts In-Stock

1+ parts

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5,253

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Digiode

USA . 2,860 parts In-Stock

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2,860

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Distributors (Availability)

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AZTECH Wire

Italy . 661 parts In-Stock

1+ parts

$12.833

100+ parts

-

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661

$12.833

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Parana Technologies

USA . 775 parts In-Stock

1+ parts

$13.652

100+ parts

-

1k+ parts

$14.154

10k+ parts

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775

$13.652

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$14.154

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ChromeModa Solutions

Germany . 3,111 parts In-Stock

1+ parts

$15.339

100+ parts

$12.578

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3,111

$15.339

$12.578

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IDEA Electronic Components Group

UK . 1,694 parts In-Stock

1+ parts

$15.339

100+ parts

$14.572

1k+ parts

$13.805

10k+ parts

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1,694

$15.339

$14.572

$13.805

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One Stop Electronics

USA . 1,621 parts In-Stock

1+ parts

$789.000

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1,621

$789.000

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Corphita

USA . 4,442 parts In-Stock

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4,442

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DigiPath Technology Company

USA . 1,666 parts In-Stock

1+ parts

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100+ parts

$13.830

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1,666

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$13.830

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Overview

Experience unparalleled quality and reliability with the TLK6201EARGTTG4 by Texas Instruments, a top contender in the realm of Other Function Telecom Interface ICs. Boasting a package body material of PLASTIC/EPOXY and an industrial temperature grade, this chip carrier offers a myriad of applications for your telecom circuit needs. With a 3.3V nominal supply voltage and minimal supply current, this product provides exceptional value and performance. Elevate your projects with Texas Instruments' expertise and innovation, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Power Supplies (V): 3.3

Operates at a common and widely available voltage, making it compatible with various systems.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance in challenging environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-lasting connections.

Width: 3 mm

Compact width allows for space-saving design in electronic applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance in telecommunications systems.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage for easy integration into existing systems.

Technical Specifications

Other Function Telecom Interface ICs TLK6201EARGTTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.067 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TLK6201EARGTTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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