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Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.

Other Function Telecom Interface ICs

Available Parts 1,254

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
CC2430ZF128RTCG3 by Texas Instruments

CC2430ZF128RTCG3

Texas Instruments

Texas Instruments CC2430ZF128RTCG3 is a telecom IC with CMOS tech. It operates b/w -40 to 85°C, has 48 terminals in a square chip carrier package style. With a nominal voltage of 3V, it's ideal for telecom circuit applications requiring surface mount compatibility and a low profile design.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

CC2430ZF128RTCRG3 by Texas Instruments

CC2430ZF128RTCRG3

Texas Instruments

Texas Instruments CC2430ZF128RTCRG3 is a 48-terminal IC with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it's ideal for compact designs requiring low power consumption.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

MAX2472EUT-T by Maxim Integrated

MAX2472EUT-T

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.45 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

MAX2473EUT-T by Maxim Integrated

MAX2473EUT-T

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.45 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

CMX992Q3 by Cml Microcircuits

CMX992Q3

Cml Microcircuits

CMX992Q3 by Cml Microcircuits is a 48-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. Its square chip carrier package suits industrial applications, featuring a 0.5mm terminal pitch and no-lead form for compact designs in telecom interfaces.

S-XQCC-N48

7 mm

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

7 mm

LM3290TME/NOPB by Texas Instruments

LM3290TME/NOPB

Texas Instruments

LM3290TME/NOPB by Texas Instruments is a 30-terminal GRID ARRAY IC with TIN SILVER COPPER finish. It operates b/w -30 to 85 °C, with peak reflow temp of 260C for telecom circuits. Its 0.4mm pitch and 0.675mm height make it suitable for compact telecom interface applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3290TMX/NOPB by Texas Instruments

LM3290TMX/NOPB

Texas Instruments

LM3290TMX/NOPB by Texas Instruments is a telecom IC with 30 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30 seconds. With a very thin profile and fine pitch, it's ideal for telecom circuit applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TME/NOPB by Texas Instruments

LM3291TME/NOPB

Texas Instruments

LM3291TME/NOPB by Texas Instruments is a 12-terminal IC with a rectangular package style. It operates b/w -30 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for telecom circuits due to its thin profile and fine pitch grid array package design.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TMX/NOPB by Texas Instruments

LM3291TMX/NOPB

Texas Instruments

LM3291TMX/NOPB by Texas Instruments is a telecom interface IC with 12 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30s. This very thin profile IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

ADN2917ACPZ-RL7 by Analog Devices

ADN2917ACPZ-RL7

Analog Devices

ADN2917ACPZ-RL7 by Analog Devices is a telecom IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use with a supply voltage of 3.3V. The IC has a terminal pitch of 0.5mm and matte tin finish, ideal for telecom interface applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

ADN2917ACPZ by Analog Devices

ADN2917ACPZ

Analog Devices

ADN2917ACPZ by Analog Devices is a telecom interface IC with 24 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 3.3V, it is ideal for telecom circuit applications requiring a very thin profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

BGS12SL6E6327XTSA1 by Infineon Technologies

BGS12SL6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B6

1.1 mm

1

6

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

.32 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.4 mm

BOTTOM

NOT SPECIFIED

.7 mm

MAX3750CEE by Maxim Integrated

MAX3750CEE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.9 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.084 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

MAX3751CEE by Maxim Integrated

MAX3751CEE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.89 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.078 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

P5DF081HN/T1AD2060 by NXP Semiconductors

P5DF081HN/T1AD2060

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N32

e4

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

QUAD

BQ51010BYFPT by Texas Instruments

BQ51010BYFPT

Texas Instruments

BQ51010BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating from -40 to 85 °C. It features TIN SILVER COPPER finish, 0.5 mm seated height, and 0.4 mm terminal pitch. Ideal for TELECOM CIRCUITS in INDUSTRIAL settings due to its fine pitch and thin profile package style.

R-XBGA-B28

e1

3 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.88 mm

AD8015AR-REEL7 by Analog Devices

AD8015AR-REEL7

Analog Devices

AD8015AR-REEL7 by Analog Devices is a telecom IC with 8 terminals, operating b/w -40 to 85°C. It has a supply current of 26mA at 5V, suitable for industrial applications requiring small outline packages and gull wing terminal form.

R-PDSO-G8

e0

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

240

Not Qualified

1.75 mm

26 mA

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

AD9816JSRL by Analog Devices

AD9816JSRL

Analog Devices

AD9816JSRL by Analog Devices is a 44-terminal IC with CMOS technology, operating at 0-70°C. It features a 5V supply voltage, GULL WING terminals, and is ideal for TELECOM CIRCUIT applications. The package is SQUARE in shape, made of PLASTIC/EPOXY material, and has a FLATPACK style with 0.8mm terminal pitch.

S-PQFP-G44

e0

10 mm

1

44

70 Cel

0 Cel

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

Not Qualified

2.45 mm

5 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.8 mm

QUAD

10 mm

AD9832BRU-REEL7 by Analog Devices

AD9832BRU-REEL7

Analog Devices

AD9832BRU-REEL7 by Analog Devices is a Telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and consumes up to 5mA current. This CMOS technology-based IC is ideal for telecom circuits due to its small outline package and dual terminal position.

R-PDSO-G16

e0

5 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

240

Not Qualified

1.1 mm

5 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

4.4 mm

MAX3265CUB by Maxim Integrated

MAX3265CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.076 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm

MAX3265CUE by Maxim Integrated

MAX3265CUE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HTSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

5 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.076 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.65 mm

DUAL

4.4 mm

MAX3268CUB by Maxim Integrated

MAX3268CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.062 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm

MAX3269CUB by Maxim Integrated

MAX3269CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.078 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

.5 mm

DUAL

20

3 mm

ABBTM-NVC-MDCS42A by Abracon

ABBTM-NVC-MDCS42A

Abracon

ABBTM-NVC-MDCS42A by Abracon is a 32-terminal telecom IC with 3.3V supply voltage, suitable for industrial use at temperatures ranging from -40 to 85°C. It features a rectangular package style, surface mount capability, and no-lead terminal form, making it ideal for telecom circuit applications.

R-XXMA-N32

25.8 mm

3

1

32

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

13.4 mm

AD974AN by Analog Devices

AD974AN

Analog Devices

Analog Devices' AD974AN is a BICMOS technology telecom IC with 28 terminals in an IN-LINE package. It operates b/w -40 to 85°C, ideal for industrial applications. With a nominal voltage of 5V, it's commonly used in telecom circuits for various functions.

R-PDIP-T28

e0

36.687 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Not Qualified

5.33 mm

5 V

NO

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

AD974BN by Analog Devices

AD974BN

Analog Devices

AD974BN by Analog Devices is a BICMOS technology telecom IC with 28 terminals in an IN-LINE package. It operates b/w -40 to 85 °C, ideal for industrial applications requiring a nominal voltage of 5 V. The PLASTIC/EPOXY package measures 7.62mm in width and 36.687mm in length, making it suitable for various telecom circuit interfaces.

R-PDIP-T28

e0

36.687 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Not Qualified

5.33 mm

5 V

NO

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

AD9832BRU by Analog Devices

AD9832BRU

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

5 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

240

Not Qualified

1.1 mm

5 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

4.4 mm

AD974AR by Analog Devices

AD974AR

Analog Devices

AD974AR by Analog Devices is a BICMOS technology Telecom IC with 28 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial applications. The GULL WING terminal form and 5V supply voltage make it ideal for telecom circuit interfaces.

R-PDSO-G28

e0

17.9 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

240

Not Qualified

2.65 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

7.5 mm

AD974BRS by Analog Devices

AD974BRS

Analog Devices

AD974BRS by Analog Devices is a BICMOS technology telecom IC with 28 terminals in a small outline package. It operates b/w -40 to 85°C, with a nominal voltage of 5V. Ideal for telecom circuits, it features tin lead terminal finish and gull wing form factor.

R-PDSO-G28

e0

10.2 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

240

Not Qualified

2 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

5.3 mm

AD974BR by Analog Devices

AD974BR

Analog Devices

AD974BR by Analog Devices is a BICMOS technology telecom IC with 28 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. The GULL WING terminal form and 5V supply voltage make it ideal for telecom circuit applications.

R-PDSO-G28

e0

17.9 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

240

Not Qualified

2.65 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

7.5 mm

BQ51021YFPT by Texas Instruments

BQ51021YFPT

Texas Instruments

BQ51021YFPT by Texas Instruments is a Telecom Interface IC with 42 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With a very thin profile and fine pitch, it offers high reliability and performance in telecom circuits.

R-XBGA-B42

e1

3.556 mm

1

1

42

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

2.844 mm

STA8088GATR by STMicroelectronics

STA8088GATR

STMicroelectronics

STA8088GATR by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85°C. It features a compact 56-terminal quad package with a max height of 0.9mm and operates at a nominal voltage of 1.2V. Ideal for space-constrained environments, it supports advanced CMOS technology.

S-XQCC-N56

e3

7 mm

3

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

40

7 mm

STA8088GA by STMicroelectronics

STA8088GA

STMicroelectronics

STA8088GA by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a -40 °C to 85°C operating temp range. It has a compact 7mm x 7mm square package with 56 terminals and operates at a nominal voltage of 1.2V. Ideal for space-constrained designs, it supports advanced CMOS technology.

S-XQCC-N56

e3

7 mm

3

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

40

7 mm

TRF8011PWP by Texas Instruments

TRF8011PWP

Texas Instruments

TRF8011PWP by Texas Instruments is a BICMOS technology telecom IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, consuming max 350mA at 4.8V. Ideal for telecom circuits, it features dual terminal position and Gull Wing form factor.

R-PDSO-G20

6.5 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

Not Qualified

1.2 mm

350 mA

4.8 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

PE4312MLBA-Z by Psemi

PE4312MLBA-Z

Psemi

PE4312MLBA-Z by Psemi is a telecom interface IC with 20 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105 °C and has a nominal voltage of 3.3 V. This CMOS technology-based IC is suitable for telecom circuit applications.

S-XQCC-N20

e4

4 mm

1

1

20

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TLK2500IRCP by Texas Instruments

TLK2500IRCP

Texas Instruments

TLK2500IRCP by Texas Instruments is a telecom interface IC with 64 terminals, operating at temperatures from -40 to 85°C. It has power supplies of 2.5V and 3.3V, consuming a max current of 0.135mA. This IC is ideal for telecom circuits in industrial applications due to its compact square package design and surface-mount capability.

S-PQFP-G64

10 mm

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

2.5,3.3

Not Qualified

1 mm

Other Telecom ICs

.135 mA

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

10 mm

LM15851NKER by Texas Instruments

LM15851NKER

Texas Instruments

LM15851NKER by Texas Instruments is a telecom interface IC with 68 terminals in a square chip carrier package. It operates b/w -40 to 85°C, has a max analog input of 1.995V, and supports data rates up to 4000 Mbps. Ideal for industrial applications requiring high-speed telecommunications functionality.

1.995 V

4000 Mbps

S-XQCC-N68

e3

10 mm

3

1

68

85 Cel

-40 Cel

UNSPECIFIED

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.45 mm

QUAD

30

10 mm

TRF37A73IDSGT by Texas Instruments

TRF37A73IDSGT

Texas Instruments

TRF37A73IDSGT by Texas Instruments is an 8-terminal telecom IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and features no-lead terminal form. The package style is small outline, heat sink/slug, very thin profile, making it suitable for telecom circuit applications.

S-PDSO-N8

e4

2 mm

1

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

DUAL

30

2 mm

AD8314ARM-REEL7 by Analog Devices

AD8314ARM-REEL7

Analog Devices

AD8314ARM-REEL7 by Analog Devices is a telecom IC with 8 terminals, operating from -40 to 85°C. It has a small outline package style, suitable for industrial applications. With a nominal voltage of 3V, it features Gull Wing terminal form and is designed for telecom circuits.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

240

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

AD8314ARM by Analog Devices

AD8314ARM

Analog Devices

AD8314ARM by Analog Devices is a telecom IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it features Gull Wing terminal form and is ideal for telecom circuit applications.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

240

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

MAX3265EUE by Maxim Integrated

MAX3265EUE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HTSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

5 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.076 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

20

4.4 mm

MAX3750CEE-T by Maxim Integrated

MAX3750CEE-T

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.9 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.084 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

V23814-U1306-M130 by Infineon Technologies

V23814-U1306-M130

Infineon Technologies

TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 72; Package Shape: RECTANGULAR; No. of Functions: 1; Nominal Supply Voltage: 3.3 V;

R-XXFO-G72

1

72

UNSPECIFIED

RECTANGULAR

FIBER OPTIC

Not Qualified

3.3 V

YES

TELECOM CIRCUIT

GULL WING

UNSPECIFIED

V23815-U1306-M130 by Infineon Technologies

V23815-U1306-M130

Infineon Technologies

TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 72; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Package Body Material: UNSPECIFIED;

R-XXFO-G72

1

72

UNSPECIFIED

RECTANGULAR

FIBER OPTIC

Not Qualified

3.3 V

YES

TELECOM CIRCUIT

GULL WING

UNSPECIFIED

CC8520RHAT by Texas Instruments

CC8520RHAT

Texas Instruments

The Texas Instruments CC8520RHAT is a telecom IC with 3.3V supply voltage, 5 Mbps data rate, and operates in industrial temperature range. It comes in a square chip carrier package with 40 terminals for surface mount applications. Ideal for telecom circuits requiring high-speed data transmission in harsh environments.

5 Mbps

S-PQCC-N40

e4

6 mm

3

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

GC5328IZER by Texas Instruments

GC5328IZER

Texas Instruments

GC5328IZER by Texas Instruments is a 484-terminal grid array IC with a package size of 23x23mm. Operating b/w -40 to 85°C, it has a telecom circuit type and requires 1.2V supply voltage. Ideal for telecom interfaces, this IC is surface-mountable and features TIN SILVER COPPER terminal finish.

S-PBGA-B484

e1

23 mm

4

1

484

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY

260

Not Qualified

2.48 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

23 mm

TLV320VD30PN by Texas Instruments

TLV320VD30PN

Texas Instruments

TLV320VD30PN by Texas Instruments is a telecom IC with 80 terminals, operating at -40 to 85°C. It supports data rates up to 52 Mbps and nominal voltage of 3.3 V. Ideal for telecom applications requiring low profile, fine pitch packaging in industrial temperature environments.

52 Mbps

S-PQFP-G80

12 mm

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.5/3.3,3.3

Not Qualified

1.6 mm

Other Telecom ICs

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

QUAD

12 mm

TLK2501IRCPR by Texas Instruments

TLK2501IRCPR

Texas Instruments

TLK2501IRCPR by Texas Instruments is a telecom IC with 2.5V supply voltage, 2500 Mbps data rate, and operates in industrial temperature range. It comes in a square package with 64 terminals for surface mount applications. Ideal for high-speed communication systems requiring reliable performance in harsh environments.

2500 Mbps

S-PQFP-G64

e4

10 mm

3

1

64

1

85 Cel

-40 Cel

PLASTIC/EPOXY

HVFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1 mm

Network Interfaces

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

10 mm