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STA8088GATR

STMicroelectronics

STA8088GATR by STMicroelectronics

STA8088GATR by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85°C. It features a compact 56-terminal quad package with a max height of 0.9mm and operates at a nominal voltage of 1.2V. Ideal for space-constrained environments, it supports advanced CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,180 parts In-Stock

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4,180

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Digiode

USA . 2,696 parts In-Stock

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2,696

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Anansix

USA . 796 parts In-Stock

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796

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

1+ parts

$7.138

100+ parts

-

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$6.424

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1,547

$7.138

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$6.424

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AZTECH Wire

Italy . 911 parts In-Stock

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$9.220

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911

$9.220

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MKK Technologies

India . 1,861 parts In-Stock

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$13.423

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1,861

$13.423

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DigiPath Technology Company

USA . 1,861 parts In-Stock

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$13.423

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1,861

$13.423

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Component Stockers USA

USA . 1,284 parts In-Stock

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$115.970

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1,284

$115.970

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A-Z Elektronik GmbH

Germany . 6,102 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,992 parts In-Stock

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2,992

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Parana Technologies

USA . 1,469 parts In-Stock

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$8.535

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1,469

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$8.535

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Perfect Parts

USA . 560 parts In-Stock

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Overview

Elevate your telecom applications with the STA8088GATR from STMicroelectronics, a leader in innovative semiconductor solutions. This cutting-edge interface IC is designed for superior performance and reliability in demanding environments, ensuring seamless communication and enhanced functionality. Experience unmatched value with its robust design, supporting a wide temperature range for industrial use. Choose STA8088GATR to empower your projects with quality and efficiency that only STMicroelectronics can deliver!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration into various electronic systems, making it ideal for modern telecom applications.

Package Shape: SQUARE

The square package shape provides uniformity in layout and facilitates easier assembly on PCBs.

No. of Terminals: 56

With 56 terminals, this IC offers a high number of connections, enabling complex functionalities and enhanced performance.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile with heat sink/slug design ensures efficient thermal management, making it suitable for high-power applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability and stability even in demanding environments.

Minimum Operating Temperature: -40 °C

The broad temperature range (-40 °C to 85°C) makes this IC suitable for industrial and outdoor applications where extreme conditions may be encountered.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and oxidation resistance, ensuring robust connections.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing on printed circuit boards, optimizing space and layout.

Maximum Seated Height: 0.9 mm

The low seated height allows for compact designs, essential for space-constrained applications.

Width: 7 mm

A width of 7mm strikes a balance between ease of integration and functional density.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum peak reflow time of 40 seconds ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for robust soldering, ensuring reliable performance in end applications.

Length: 7 mm

The compact length is conducive to high-density PCB designs without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading confirms that this IC is designed for demanding environments, providing confidence in its reliability.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it efficient for telecom applications.

Terminal Form: NO LEAD

No lead form allows for a smaller footprint and can lead to improved performance in high-frequency applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed as a telecom circuit, this IC is optimized for signal processing, making it ideal for communication systems.

Nominal Supply Voltage: 1.2 V

A low nominal supply voltage of 1.2V contributes to lower power consumption, making it suitable for energy-sensitive applications.

Terminal Pitch: 0.4 mm

A fine terminal pitch of 0.4mm allows for more connections within a smaller area, enhancing versatility in PCB design.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring proper handling and storage, yet ensuring compatibility with standard manufacturing processes.

Technical Specifications

Other Function Telecom Interface ICs STA8088GATR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

STA8088GATR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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