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TLV320VD30PN

Texas Instruments

TLV320VD30PN by Texas Instruments

TLV320VD30PN by Texas Instruments is a telecom IC with 80 terminals, operating at -40 to 85°C. It supports data rates up to 52 Mbps and nominal voltage of 3.3 V. Ideal for telecom applications requiring low profile, fine pitch packaging in industrial temperature environments.

Median Price

$5.640

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$4.870

1k+ parts

$4.360

10k+ parts

$4.100

228

-

$4.870

$4.360

$4.100

DigiKey

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$5.640

1k+ parts

-

10k+ parts

-

228

-

$5.640

-

-

Verical

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$6.088

1k+ parts

$5.450

10k+ parts

$5.125

228

-

$6.088

$5.450

$5.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,760 parts In-Stock

1+ parts

$5.149

100+ parts

-

1k+ parts

-

10k+ parts

-

1,760

$5.149

-

-

-

Vyrian

USA . 7,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,697

-

-

-

-

DigiKey Marketplace

USA . 228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

228

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,580 parts In-Stock

1+ parts

$4.878

100+ parts

-

1k+ parts

-

10k+ parts

-

4,580

$4.878

-

-

-

Parana Technologies

USA . 2,080 parts In-Stock

1+ parts

$10.668

100+ parts

-

1k+ parts

$11.160

10k+ parts

-

2,080

$10.668

-

$11.160

-

DigiPath Technology Company

USA . 1,271 parts In-Stock

1+ parts

$11.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,271

$11.746

-

-

-

ChromeModa Solutions

Germany . 4,290 parts In-Stock

1+ parts

$11.986

100+ parts

$9.829

1k+ parts

-

10k+ parts

-

4,290

$11.986

$9.829

-

-

IDEA Electronic Components Group

UK . 2,034 parts In-Stock

1+ parts

$11.986

100+ parts

$11.387

1k+ parts

$10.787

10k+ parts

-

2,034

$11.986

$11.387

$10.787

-

Overview

Discover the Texas Instruments TLV320VD30PN, a high-quality Other Function Telecom Interface IC perfect for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers customers unmatched value and benefits. From its advanced technology to its reliable performance, the TLV320VD30PN is the ideal choice for those seeking top-notch telecom IC solutions. Experience the advantages of this innovative product today and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and good thermal properties, making this product suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and labor costs.

Power Supplies (V): 2.5/3.3,3.3

Compatible with multiple power supply voltages, providing flexibility in system design and integration.

No. of Terminals: 80

High number of terminals enable the device to handle complex telecom interfaces and functions efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in various industrial environments.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures ensures functionality in extreme conditions.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and compatibility with telecom systems.

Technical Specifications

Other Function Telecom Interface ICs TLV320VD30PN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

52 Mbps

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2.5/3.3,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TLV320VD30PN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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