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LM15851NKER

Texas Instruments

LM15851NKER by Texas Instruments

LM15851NKER by Texas Instruments is a telecom interface IC with 68 terminals in a square chip carrier package. It operates b/w -40 to 85°C, has a max analog input of 1.995V, and supports data rates up to 4000 Mbps. Ideal for industrial applications requiring high-speed telecommunications functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,816 parts In-Stock

1+ parts

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3,816

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Vyrian

USA . 3,346 parts In-Stock

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3,346

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$6.177

100+ parts

-

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674

$6.177

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Parana Technologies

USA . 1,372 parts In-Stock

1+ parts

$12.925

100+ parts

-

1k+ parts

$13.411

10k+ parts

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1,372

$12.925

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$13.411

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DigiPath Technology Company

USA . 306 parts In-Stock

1+ parts

$14.232

100+ parts

$13.093

1k+ parts

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306

$14.232

$13.093

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ChromeModa Solutions

Germany . 1,371 parts In-Stock

1+ parts

$14.522

100+ parts

$11.908

1k+ parts

-

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1,371

$14.522

$11.908

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IDEA Electronic Components Group

UK . 673 parts In-Stock

1+ parts

$14.522

100+ parts

$13.796

1k+ parts

$13.070

10k+ parts

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673

$14.522

$13.796

$13.070

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Microchip USA

USA . 3,125 parts In-Stock

1+ parts

$619.010

100+ parts

$596.500

1k+ parts

$585.240

10k+ parts

$573.990

3,125

$619.010

$596.500

$585.240

$573.990

Semicontronic

India . 1,638 parts In-Stock

1+ parts

$916.000

100+ parts

$893.100

1k+ parts

$888.520

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1,638

$916.000

$893.100

$888.520

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One Stop Electronics

USA . 562 parts In-Stock

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$943.000

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562

$943.000

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Ampacity Inc.

Singapore . 312 parts In-Stock

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$1,000.000

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312

$1,000.000

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Corphita

USA . 1,546 parts In-Stock

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1,546

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Corohmni

South Africa . 96 parts In-Stock

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96

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Overview

Unlock the potential of your telecom applications with the LM15851NKER by Texas Instruments. Designed with precision and expertise, this product offers unmatched quality and reliability. From its innovative design to its advanced features, this IC delivers superior performance in a compact package. Whether you're looking to enhance data rates or optimize power efficiency, this telecom interface IC is the ideal solution for your next project. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and drives success. Experience the difference with the LM15851NKER.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for industrial applications where it may be exposed to higher temperatures.

Data Rate: 4000 Mbps

The high data rate of 4000 Mbps enables fast and efficient communication, making this product ideal for telecommunications applications.

Nominal Supply Voltage: 1.2 V

The low nominal supply voltage of 1.2 V helps in reducing power consumption, making this product energy-efficient.

Technical Specifications

Other Function Telecom Interface ICs LM15851NKER attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Maximum Analog Input:

1.995 V

Data Rate:

4000 Mbps

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.45 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LM15851NKER Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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