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PE4312MLBA-Z

Psemi

PE4312MLBA-Z by Psemi

PE4312MLBA-Z by Psemi is a telecom interface IC with 20 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105 °C and has a nominal voltage of 3.3 V. This CMOS technology-based IC is suitable for telecom circuit applications.

Median Price

$1.450

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 29 parts In-Stock

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Vyrian

USA . 5,912 parts In-Stock

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Chip Stock

USA . 4,428 parts In-Stock

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Martec Srl

Italy . 2,102 parts In-Stock

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Prism Electronics

USA . 13 parts In-Stock

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Argo Parts USA

USA . 1,181 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 420 parts In-Stock

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$1.421

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Corohmni

South Africa . 1,014 parts In-Stock

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$3.875

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AZTECH Wire

Italy . 785 parts In-Stock

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$15.647

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Semicontronic

India . 356 parts In-Stock

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$28.000

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$27.300

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S.R.D Solutions

India . 3,000 parts In-Stock

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Kepictronics

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Overview

Experience superior performance with the PE4312MLBA-Z by Psemi. As a leading manufacturer in the industry, Psemi delivers unrivaled quality and reliability. This telecom interface IC is designed to meet the demands of various applications, offering exceptional value to customers. With its compact square package shape and surface mount capability, it provides ease of integration and space-saving advantages. Whether you're in telecommunications or any other function, this product guarantees optimal performance in extreme temperatures. Say goodbye to technical headaches and embrace the benefits of the PE4312MLBA-Z today!

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on circuit boards, making it convenient for assembly and installation.

Package Shape: SQUARE

The square package shape allows for efficient use of space, making it suitable for compact devices or applications with limited room.

No. of Terminals: 20

With a sufficient number of terminals, this product offers versatile connectivity options for various circuit configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier and heat sink/slug design, along with a very thin profile, ensures excellent thermal management, making it ideal for high-performance applications.

Maximum Operating Temperature: 105 °C

This product can withstand high operating temperatures, enabling reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can operate efficiently even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy integration and compatibility with other components, simplifying circuit design and assembly.

Maximum Seated Height: 0.9 mm

With a maximum seated height of 0.9 mm, this product offers a low profile, making it suitable for applications where space is limited.

Width: 4 mm

With a width of 4 mm, this product offers a compact form factor, allowing for efficient utilization of available space.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand a maximum time of 30 seconds at peak reflow temperature, enhancing its durability during soldering processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product ensures secure and effective soldering, contributing to overall product reliability.

Length: 4 mm

The compact length of 4 mm provides flexibility in designing various types of electronic devices or circuits.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets stringent temperature requirements, ensuring reliable operation in challenging conditions.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high-speed operation, and excellent noise immunity, making it an efficient choice.

Terminal Form: NO LEAD

With a no-lead terminal form, this product complies with environmental regulations while providing reliable solder joints.

Telecom IC Type: TELECOM CIRCUIT

This product belongs to the telecom circuit IC type, making it suitable for applications involving telecommunication systems or equipment.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this product is compatible with common power supply standards, ensuring easy integration into existing systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise and compact connections, enabling denser circuitry and higher performance.

Technical Specifications

Other Function Telecom Interface ICs PE4312MLBA-Z attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Psemi

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

PE4312MLBA-Z Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Psemi

At pSemi, we design and manufacture innovative semiconductor solutions. We take what “can’t be done” and transform it into an industry first. Whether it is a cutting-edge design technique, a transformative architecture or a novel technology platform, our team explores new ways to make electronics smaller, thinner, faster and more efficient. Our RF, power management and sensor products are designed into devices that are used by millions of people worldwide. You’ll find our integrated circuits in your smartphone, your cable modem, your laptop and your neighborhood’s new 5G base station. Headquartered in San Diego, we have offices on three continents and a worldwide sales team to support our customers. Our offices are located in major global tech hubs to support our growing team of talented electrical engineers. We build intelligent electronics for the connected world.

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