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TRF8011PWP

Texas Instruments

TRF8011PWP by Texas Instruments

TRF8011PWP by Texas Instruments is a BICMOS technology telecom IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, consuming max 350mA at 4.8V. Ideal for telecom circuits, it features dual terminal position and Gull Wing form factor.

Median Price

$1.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 431 parts In-Stock

1+ parts

-

100+ parts

$1.300

1k+ parts

$1.080

10k+ parts

$0.962

431

-

$1.300

$1.080

$0.962

DigiKey

USA . 431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.100

10k+ parts

-

431

-

-

$1.100

-

Verical

USA . 431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.350

10k+ parts

$1.202

431

-

-

$1.350

$1.202

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,771 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

-

1,771

$1.007

-

-

-

Vyrian

USA . 4,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,251

-

-

-

-

Component Sense

UK . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

490

-

-

-

-

DigiKey Marketplace

USA . 431 parts In-Stock

1+ parts

-

100+ parts

$1.100

1k+ parts

-

10k+ parts

-

431

-

$1.100

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,775 parts In-Stock

1+ parts

$0.954

100+ parts

-

1k+ parts

-

10k+ parts

-

1,775

$0.954

-

-

-

Parana Technologies

USA . 164 parts In-Stock

1+ parts

$11.131

100+ parts

$1,033.704

1k+ parts

$10.018

10k+ parts

-

164

$11.131

$1,033.704

$10.018

-

DigiPath Technology Company

USA . 889 parts In-Stock

1+ parts

$12.257

100+ parts

-

1k+ parts

-

10k+ parts

-

889

$12.257

-

-

-

ChromeModa Solutions

Germany . 5,918 parts In-Stock

1+ parts

$12.507

100+ parts

$10.256

1k+ parts

-

10k+ parts

-

5,918

$12.507

$10.256

-

-

IDEA Electronic Components Group

UK . 1,980 parts In-Stock

1+ parts

$12.507

100+ parts

$11.882

1k+ parts

$11.256

10k+ parts

-

1,980

$12.507

$11.882

$11.256

-

Overview

Experience unparalleled quality and reliability with the TRF8011PWP by Texas Instruments. As a leading manufacturer in telecom interface ICs, Texas Instruments offers cutting-edge technology that meets industrial standards. This small outline, thin profile package is perfect for a variety of applications, providing customers with exceptional performance and efficiency. Trust in Texas Instruments to deliver superior products that exceed expectations and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Allows for easy and efficient installation on PCBs.

Package Shape: RECTANGULAR

Rectangular shape makes the product easy to integrate into various designs.

No. of Terminals: 20

Provides flexibility in connectivity options.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide range of temperature conditions.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power consumption and high-speed operation.

Nominal Supply Voltage: 4.8 V

Optimal supply voltage for reliable performance.

Technical Specifications

Other Function Telecom Interface ICs TRF8011PWP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

350 mA

Nominal Supply Voltage:

4.8 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRF8011PWP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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