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Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.

Other Function Telecom Interface ICs

Available Parts 1,254

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
CC2560BRVMT by Texas Instruments

CC2560BRVMT

Texas Instruments

Texas Instruments CC2560BRVMT is a 76-terminal telecom IC with matte tin finish. Operating b/w -40 to 85°C, it has a nominal voltage of 3.6V and terminal pitch of 0.6mm. Ideal for telecom circuits, this chip carrier is surface mountable and features an industrial temperature grade.

S-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

8 mm

CC2564BRVMT by Texas Instruments

CC2564BRVMT

Texas Instruments

Texas Instruments CC2564BRVMT is a 76-terminal telecom IC with a 3.6V supply voltage, operating b/w -40 to 85°C. It features matte tin finish, quad terminal position, and chip carrier package style for industrial applications requiring thin profile and surface mount compatibility.

R-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

7.73 mm

SN65DSI86ZQER by Texas Instruments

SN65DSI86ZQER

Texas Instruments

SN65DSI86ZQER by Texas Instruments is a 64-terminal, telecom interface IC with a data rate of 5400 Mbps. It operates b/w -40 to 85°C and has a supply voltage of 1.2V, making it suitable for industrial applications requiring high-speed data transmission in compact spaces. The package style is grid array with very thin profile and fine pitch, ideal for surface mount assembly processes.

5400 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

PGA5807ARGCR by Texas Instruments

PGA5807ARGCR

Texas Instruments

PGA5807ARGCR by Texas Instruments is a 64-terminal telecom IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a package style of chip carrier. Suitable for telecom circuits, it features nickel palladium gold terminal finish and is surface mountable.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

PGA5807ARGCT by Texas Instruments

PGA5807ARGCT

Texas Instruments

PGA5807ARGCT by Texas Instruments is a 64-terminal telecom interface IC in a square chip carrier package. With a supply voltage of 3.3V, it operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. Ideal for industrial applications requiring very thin profile components.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

TCC-106A-RT by Onsemi

TCC-106A-RT

Onsemi

TCC-106A-RT by Onsemi is a Telecom Circuit IC with 20 terminals in a very thin profile grid array package. Operating temperature ranges from -30 to 85 °C, suitable for telecom interface applications. It has a nominal voltage of 3.3V and terminal pitch of 0.4mm, making it ideal for compact electronic devices.

R-PBGA-B20

2.58 mm

1

20

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.65 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

2.23 mm

TCP-3027N-QT by Onsemi

TCP-3027N-QT

Onsemi

TCP-3027N-QT by Onsemi is a RECTANGULAR CHIP CARRIER with 6 terminals, suitable for TELECOM CIRCUIT applications. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for surface mount installations due to its very thin profile design.

R-XQCC-N6

1.6 mm

1

6

85 Cel

-30 Cel

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

1 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

1.2 mm

TLK10022CTR by Texas Instruments

TLK10022CTR

Texas Instruments

TLK10022CTR by Texas Instruments is a 144-terminal, telecom interface IC with data rate of 10 Gbps. It operates b/w -40 to 85°C and has a supply voltage of 1V. Ideal for industrial applications requiring high-speed telecommunications circuitry in compact form factor.

10000 Mbps

S-PBGA-B144

e1

13.05 mm

4

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

3.25 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.05 mm

SA606DK/03,118 by NXP Semiconductors

SA606DK/03,118

NXP Semiconductors

SA606DK/03,118 by NXP Semiconductors is a telecom interface IC designed for industrial applications. It features a dual terminal configuration with a max operating temp of 85 °C and operates at a nominal voltage of 3V. Its compact size (4.4mm x 6.5mm) ensures efficient integration in various devices.

R-PDSO-G20

6.5 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

TLK2711HFG/EM by Texas Instruments

TLK2711HFG/EM

Texas Instruments

TLK2711HFG/EM by Texas Instruments is a telecom IC with 68 terminals in a square package. It operates at 2.5V and has a terminal pitch of 0.64mm. This IC is suitable for telecom circuit applications due to its compact flatpack design and metal-sealed co-fired body material.

S-CQFP-F68

13.97 mm

1

68

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

FLATPACK, GUARD RING

NOT SPECIFIED

2.68 mm

2.5 V

YES

TELECOM CIRCUIT

FLAT

.64 mm

QUAD

NOT SPECIFIED

13.97 mm

BGA711N7E6327XTSA1 by Infineon Technologies

BGA711N7E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N6

e3

2 mm

1

1

6

85 Cel

-30 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

2.8 V

YES

BIPOLAR

TELECOM CIRCUIT

OTHER

TIN

NO LEAD

.5 mm

DUAL

1.3 mm

BGM1034N7E6327XUSA1 by Infineon Technologies

BGM1034N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 7; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N7

2.3 mm

1

7

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

NOT SPECIFIED

1.7 mm

BGS15AN16E6327XTSA1 by Infineon Technologies

BGS15AN16E6327XTSA1

Infineon Technologies

BGS15AN16E6327XTSA1 by Infineon is a telecom interface IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -30 to 85°C, with a nominal voltage of 3.5V. This IC is designed for telecom circuits, featuring a very thin profile and tin terminal finish for surface mount applications.

S-PQCC-N16

e3

2.3 mm

1

1

16

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.77 mm

3.5 V

YES

TELECOM CIRCUIT

OTHER

TIN

NO LEAD

.5 mm

QUAD

2.3 mm

TDA5252XUMA1 by Infineon Technologies

TDA5252XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G38

9.7 mm

3

1

38

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

DUAL

4.4 mm

TDA5251XUMA1 by Infineon Technologies

TDA5251XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G38

9.7 mm

1

38

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

1.2 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

4.4 mm

TDA5255XUMA1 by Infineon Technologies

TDA5255XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G38

9.7 mm

3

1

38

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

DUAL

4.4 mm

HTMS1101FTB/AF,115 by NXP Semiconductors

HTMS1101FTB/AF,115

NXP Semiconductors

HTMS1101FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.

R-PDSO-N3

1.45 mm

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

LCC3(UNSPEC)

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

1 mm

HTMS1201FUG/AM,005 by NXP Semiconductors

HTMS1201FUG/AM,005

NXP Semiconductors

HTMS1201FUG/AM,005 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It operates in extreme temperatures from -40 °C to 85 °C and features a no-lead terminal form in a square package. Ideal for surface mount technology, it ensures reliable performance in demanding environments.

S-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

WAFER

SQUARE

UNCASED CHIP

Not Qualified

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

HTMS1201FTB/AF,115 by NXP Semiconductors

HTMS1201FTB/AF,115

NXP Semiconductors

HTMS1201FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.

R-PDSO-N3

1.45 mm

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

LCC3(UNSPEC)

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

1 mm

ADRF6820ACPZ-R7 by Analog Devices

ADRF6820ACPZ-R7

Analog Devices

Analog Devices' ADRF6820ACPZ-R7 is a 40-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, 0.5mm terminal pitch, and is ideal for telecom circuit applications due to its industrial temperature grade suitability.

S-XQCC-N40

6 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

BGM1032N7E6327XUSA1 by Infineon Technologies

BGM1032N7E6327XUSA1

Infineon Technologies

BGM1032N7E6327XUSA1 by Infineon is a telecom IC with 6 terminals, operating from -40 to 85°C. It has a small outline package style and nominal voltage of 2.7V, suitable for industrial applications requiring a very thin profile and surface mount capability.

R-PDSO-N6

2.3 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

2.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

NOT SPECIFIED

1.7 mm

BGM1043N7E6327XUSA1 by Infineon Technologies

BGM1043N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N6

2.3 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

2.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

NOT SPECIFIED

1.7 mm

BGS12AL74E6327XTSA1 by Infineon Technologies

BGS12AL74E6327XTSA1

Infineon Technologies

Infineon's BGS12AL74E6327XTSA1 is a telecom IC with 6 terminals in a rectangular chip carrier package. Operating b/w -30°C to 85°C, it has a nominal voltage of 2.8V. Ideal for telecom interfaces, this surface-mount IC features gold terminal finish and 0.55mm pitch.

R-XBCC-B6

e4

2.3 mm

1

1

6

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.5 mm

2.8 V

YES

TELECOM CIRCUIT

OTHER

GOLD

BUTT

.55 mm

BOTTOM

1.5 mm

BGS12AL76E6327XTMA1 by Infineon Technologies

BGS12AL76E6327XTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B6

e4

1.26 mm

1

1

6

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

2.8 V

YES

TELECOM CIRCUIT

OTHER

GOLD

BUTT

.48 mm

BOTTOM

1.4 mm

SKY13453-385LF by Skyworks Solutions

SKY13453-385LF

Skyworks Solutions

SKY13453-385LF by Skyworks Solutions is a telecom IC with 6 terminals in a square chip carrier package. Operating temperature ranges from -40 to 90°C, suitable for industrial use. Nominal voltage of 2.8V makes it ideal for telecom circuit applications.

S-XQCC-N6

1 mm

1

1

6

90 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

.5 mm

2.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

1 mm

RI-STU-MRD1-30 by Texas Instruments

RI-STU-MRD1-30

Texas Instruments

RI-STU-MRD1-30 by Texas Instruments is a 30-terminal RECTANGULAR package MICROELECTRONIC ASSEMBLY with -20 to 50 °C operating temp range. It features DUAL terminals, TELECOM CIRCUIT type, and 5V supply voltage. Ideal for telecom interface applications requiring reliable performance in various temperature conditions.

R-XDMA-T30

1

30

50 Cel

-20 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

5 V

NO

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

DUAL

MAX5935CAX by Maxim Integrated

MAX5935CAX

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G36

15.375 mm

1

36

70 Cel

0 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NOT SPECIFIED

2.65 mm

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

.8 mm

DUAL

NOT SPECIFIED

7.5 mm

PHY2078QT-BR by Maxim Integrated

PHY2078QT-BR

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

e3

5 mm

1

1

32

95 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

CC2595RGTT by Texas Instruments

CC2595RGTT

Texas Instruments

CC2595RGTT by Texas Instruments is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include 3V supply voltage, surface mount design, and nickel palladium gold terminal finish.

S-PQCC-N16

e4

3 mm

2

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

AD8015AR by Analog Devices

AD8015AR

Analog Devices

AD8015AR by Analog Devices is a telecom interface IC with 8 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and max current of 26mA. Ideal for industrial applications requiring small outline packages in telecom circuits.

R-PDSO-G8

e0

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

240

Not Qualified

1.75 mm

26 mA

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

BA4116FV-E2 by ROHM

BA4116FV-E2

ROHM

ROHM's BA4116FV-E2 is a 16-terminal telecom interface IC with a small outline, thin profile package. It operates b/w -30°C to 85°C and has a peak reflow temperature of 260°C. Ideal for telecom circuits, it has a nominal voltage of 5V and Gull Wing terminal form.

R-PDSO-G16

e3/e2

5 mm

1

16

85 Cel

-30 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

OTHER

TIN/TIN COPPER

GULL WING

.65 mm

DUAL

10

4.4 mm

MAX2510EEI by Maxim Integrated

MAX2510EEI

Maxim Integrated

MAX2510EEI by Maxim Integrated is a telecom IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 3/5V and max current of 25mA. Ideal for telecom interface applications due to its small outline package and industrial temperature grade.

R-PDSO-G28

e0

9.89 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

SSOP28,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3/5

Not Qualified

1.75 mm

Other Telecom ICs

25 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

TLK2541PFPG4 by Texas Instruments

TLK2541PFPG4

Texas Instruments

TLK2541PFPG4 by Texas Instruments is a telecom IC with 80 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm. Ideal for telecom circuits, it comes in a square package style with Gull Wing terminals and Nickel Palladium Gold finish.

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

TQFP80,.55SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1.2 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MAX2105CWI by Maxim Integrated

MAX2105CWI

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

17.9 mm

1

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

245

Not Qualified

2.65 mm

5 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

7.5 mm

MAX2511EEI by Maxim Integrated

MAX2511EEI

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

9.89 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

SSOP28,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3/5

Not Qualified

1.73 mm

Other Telecom ICs

.045 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

L3845B by STMicroelectronics

L3845B

STMicroelectronics

L3845B by STMicroelectronics is a telecom interface IC designed for robust applications. It operates within a voltage range of 20V and withstands temperatures from -40 °C to 70°C. With an 8-terminal, through-hole design, it ensures reliable performance in various telecom circuits.

R-PDIP-T8

e3

1

8

70 Cel

-40 Cel

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

20

Not Qualified

5.08 mm

Analog Transmission Interfaces

20 V

NO

TELECOM CIRCUIT

OTHER

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

MAX3267CSA by Maxim Integrated

MAX3267CSA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e0

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

3/5

Not Qualified

1.75 mm

Other Telecom ICs

.05 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

AD803-20BR by Analog Devices

AD803-20BR

Analog Devices

AD803-20BR by Analog Devices is a CMOS telecom IC with 20 terminals, operating b/w -40 to 85 °C. It has a supply voltage of 5V and low supply current of 0.06 mA. Ideal for telecom circuits, this IC comes in a small outline package suitable for industrial applications.

R-PDSO-G20

e0

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

SMALL OUTLINE

5

Not Qualified

ATM/SONET/SDH ICs

.06 mA

5 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

SN75FC1000PJD by Texas Instruments

SN75FC1000PJD

Texas Instruments

SN75FC1000PJD by Texas Instruments is a telecom interface IC with 64 terminals, operating at 3.3V. It features BICMOS technology, GULL WING terminal form, and 0.5mm pitch. Ideal for telecom circuits, it has a temperature range of 0-70°C and low supply current of 0.25mA.

S-PQFP-G64

10 mm

1

64

70 Cel

0 Cel

PLASTIC/EPOXY

HTFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

NOT SPECIFIED

3.3

Not Qualified

1.2 mm

Other Telecom ICs

.25 mA

3.3 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

10 mm

L3845D1013TR by STMicroelectronics

L3845D1013TR

STMicroelectronics

STMicroelectronics L3845D1013TR is a telecom interface IC with 8 terminals in a small outline package. It operates b/w -40 °C to 70°C, suitable for telecom circuits. The package is made of plastic/epoxy, surface mountable, and has a gull wing terminal form.

R-PDSO-G8

e0

4.9 mm

1

8

70 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

YES

TELECOM CIRCUIT

OTHER

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

CY7B923-SC by Cypress Semiconductor

CY7B923-SC

Cypress Semiconductor

CY7B923-SC by Cypress Semiconductor is a BICMOS technology Telecom IC with 28 terminals, operating at 5V. It has a small outline package style and can withstand temperatures from 0 to 70°C. Ideal for telecom circuits, it features GULL WING terminal form and tin/lead finish.

R-PDSO-G28

e0

17.905 mm

1

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

225

5

Not Qualified

2.67 mm

Other Telecom ICs

85 mA

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

30

7.5 mm

CY7B923-JC by Cypress Semiconductor

CY7B923-JC

Cypress Semiconductor

CY7B923-JC by Cypress Semiconductor is a 28-terminal BICMOS chip carrier with 5V supply, suitable for telecom circuits. It operates b/w 0-70°C, has a terminal pitch of 1.27mm, and consumes up to 85mA current.

S-PQCC-J28

e0

11.53 mm

3

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

5

Not Qualified

4.57 mm

Other Telecom ICs

85 mA

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

11.53 mm

MAX3120CSA by Maxim Integrated

MAX3120CSA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e0

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

MAX3120CUA by Maxim Integrated

MAX3120CUA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G8

e0

3 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

MAX3120ESA by Maxim Integrated

MAX3120ESA

Maxim Integrated

MAX3120ESA by Maxim Integrated is an 8-terminal telecom IC with a supply voltage of 3.3V. It operates b/w -40 to 85°C, in industrial settings. This small outline package has a gull wing terminal form and is ideal for telecom circuit applications.

R-PDSO-G8

e0

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

MAX3120EUA by Maxim Integrated

MAX3120EUA

Maxim Integrated

MAX3120EUA by Maxim Integrated is an 8-terminal IC with a supply voltage of 3.3V, operating b/w -40 to 85°C. It features a small outline package style and gull wing terminal form, suitable for telecom circuit applications requiring surface mount technology.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

ADL5354ACPZ-R2 by Analog Devices

ADL5354ACPZ-R2

Analog Devices

ADL5354ACPZ-R2 by Analog Devices is a BICMOS telecom IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 5V, it is designed for telecom circuit interfaces.

S-XQCC-N36

e3

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

1 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

6 mm

CC2430F64RTCRG3 by Texas Instruments

CC2430F64RTCRG3

Texas Instruments

The Texas Instruments CC2430F64RTCRG3 is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, with a supply voltage of 3V. This CMOS technology IC is ideal for telecom circuit applications due to its compact size and industrial temperature grade suitability.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm