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Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.

Other Function Telecom Interface ICs

Available Parts 1,254

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
ONET8501TY by Texas Instruments

ONET8501TY

Texas Instruments

ONET8501TY by Texas Instruments is a telecom IC with 11300 Mbps data rate, operating at -40 to 100°C. It has 19 terminals in a rectangular package suitable for industrial use. With a supply voltage of 3.3V and max current of 44mA, it's ideal for telecom interface applications.

Data rate is 11.3 Gbps

11300 Mbps

R-XUUC-N19

1

19

100 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

Not Qualified

44 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

AMIS-49250-XTD by Onsemi

AMIS-49250-XTD

Onsemi

AMIS-49250-XTD by Onsemi is a telecom interface IC with 44 terminals, operating at -40 to 85 °C. It has a supply voltage of 3.5V, data rate of 0.03125 Mbps, and terminal pitch of 0.5mm. Ideal for industrial applications requiring low power consumption and compact design in a square chip carrier package.

.03125 Mbps

S-XQCC-N44

e3

7 mm

3

1

44

1

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC44,.28SQ,20

SQUARE

CHIP CARRIER

260

3,5

Not Qualified

.9 mm

Network Interfaces

.0008 mA

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

30

7 mm

AMIS-49250-XTP by Onsemi

AMIS-49250-XTP

Onsemi

AMIS-49250-XTP by Onsemi is a telecom IC with 44 terminals, operating at -40 to 85°C. It has a supply voltage of 3V, data rate of 0.03125 Mbps, and power supplies of 3.5V. This square chip carrier package is ideal for industrial telecom applications.

.03125 Mbps

S-XQCC-N44

e3

7 mm

3

1

44

1

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC44,.28SQ,20

SQUARE

CHIP CARRIER

260

3,5

Not Qualified

.9 mm

Network Interfaces

.0008 mA

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

XRT85L61IG-F by Exar

XRT85L61IG-F

Exar

Exar's XRT85L61IG-F is a telecom interface IC with 28 terminals in a small outline package. Operating b/w -40°C to 85°C, it has a nominal voltage of 3.3V and matte tin terminal finish. Ideal for telecom circuits, this IC features gull wing terminals and is designed for industrial temperature grade applications.

R-PDSO-G28

e3

9.7 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

4.4 mm

AD9993BBCZ by Analog Devices

AD9993BBCZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

RI-TRP-R4FF-30 by Texas Instruments

RI-TRP-R4FF-30

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Package Body Material: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;

1

50 Cel

-25 Cel

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

TELECOM CIRCUIT

OTHER

NOT SPECIFIED

RI-TRP-W4FF-30 by Texas Instruments

RI-TRP-W4FF-30

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Package Body Material: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;

1

50 Cel

-25 Cel

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

TELECOM CIRCUIT

OTHER

NOT SPECIFIED

MRF24WB0MA/RM by Microchip Technology

MRF24WB0MA/RM

Microchip Technology

MRF24WB0MA/RM by Microchip: 3.3V supply, 36 terminals, telecom IC for commercial use. Rectangular package, surface mountable. Ideal for telecom circuit applications in temperatures from 0 to 70°C.

R-XUUC-N36

e3

1

36

70 Cel

0 Cel

UNSPECIFIED

DIE

MODULE,36LEAD,.8

RECTANGULAR

UNCASED CHIP

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

NO LEAD

UPPER

MRF24WB0MB/RM by Microchip Technology

MRF24WB0MB/RM

Microchip Technology

MRF24WB0MB/RM by Microchip Tech is a 36-terminal IC with telecom circuit type. Operating temp range: 0-70°C, supply voltage: 3.3V. Ideal for telecom interfaces due to its surface mount capability and commercial temperature grade suitability.

R-XUUC-N36

e3

1

36

70 Cel

0 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

Not Qualified

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

NO LEAD

UPPER

HTRM800/AED,122 by NXP Semiconductors

HTRM800/AED,122

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified; Package Body Material: PLASTIC/EPOXY; Nominal Negative Supply Voltage: -15 V;

-15 V

70 Cel

-25 Cel

PLASTIC/EPOXY

MODULE(UNSPEC)

MICROELECTRONIC ASSEMBLY

+-15

Not Qualified

Other Telecom ICs

.55 mA

15 V

TELECOM CIRCUIT

OTHER

UAA3201T/V1,112 by NXP Semiconductors

UAA3201T/V1,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G16

16

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

3.5/6

Not Qualified

Other Telecom ICs

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

1.27 mm

DUAL

UAA3220TS/V1,118 by NXP Semiconductors

UAA3220TS/V1,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G24

8.2 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

5.3 mm

PN5110A0HN1/C2,157 by NXP Semiconductors

PN5110A0HN1/C2,157

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

e4

5 mm

1

1

32

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.3

Not Qualified

1 mm

Other Telecom ICs

.1 mA

3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL EXTENDED

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

5 mm

PN5120A0HN1/C1,157 by NXP Semiconductors

PN5120A0HN1/C1,157

NXP Semiconductors

PN5120A0HN1/C1,157 by NXP Semiconductors is a telecom interface IC with 32 terminals in a square package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V. Ideal for telecom circuits, this chip carrier has a very thin profile and nickel palladium gold finish for robust performance in various applications.

S-PQCC-N32

e4

5 mm

1

1

32

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.3,2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

5 mm

SA5211D,602 by NXP Semiconductors

SA5211D,602

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G14

8.65 mm

1

14

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

260

5

Not Qualified

1.75 mm

Other Telecom ICs

.031 mA

5 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

1.27 mm

DUAL

40

3.9 mm

SA5212AD,602 by NXP Semiconductors

SA5212AD,602

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

4.9 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

260

5

Not Qualified

1.75 mm

Other Telecom ICs

.033 mA

5 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

1.27 mm

DUAL

40

3.9 mm

SA602AD,602 by NXP Semiconductors

SA602AD,602

NXP Semiconductors

SA602AD,602 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 6V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style. Ideal for telecom circuits, it features gull wing terminals and is surface mountable.

R-PDSO-G8

4.9 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

1.27 mm

DUAL

3.9 mm

SA606DK,112 by NXP Semiconductors

SA606DK,112

NXP Semiconductors

SA606DK,112 by NXP Semiconductors is a telecom interface IC with 20 terminals. It operates b/w -40 to 85°C and has a supply voltage of 3V. With a small outline package style, it's ideal for industrial telecom circuit applications.

R-PDSO-G20

6.5 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

40

4.4 mm

SA606DK,118 by NXP Semiconductors

SA606DK,118

NXP Semiconductors

SA606DK,118 by NXP Semiconductors is a telecom interface IC with 20 terminals. It operates b/w -40 to 85°C and has a supply voltage of 3V. The package is small outline, low profile, ideal for industrial telecom circuit applications.

R-PDSO-G20

6.5 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

SA612AN,112 by NXP Semiconductors

SA612AN,112

NXP Semiconductors

SA612AN,112 by NXP Semiconductors is an 8-terminal telecom interface IC with a rectangular package style. It operates b/w -40 to 85°C and has a nominal voltage of 6V. Ideal for industrial applications requiring reliable telecom circuitry in compact designs.

R-PDIP-T8

9.5 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

250

Not Qualified

4.2 mm

6 V

NO

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

2.54 mm

DUAL

40

7.62 mm

SA636DK,112 by NXP Semiconductors

SA636DK,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

6.5 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

40

4.4 mm

SA636DK,118 by NXP Semiconductors

SA636DK,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

6.5 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

SA639DH,512 by NXP Semiconductors

SA639DH,512

NXP Semiconductors

SA639DH,512 by NXP Semiconductors is a Telecom Interface IC with 24 terminals. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. The package style is small outline, thin profile, shrink pitch making it suitable for industrial telecom circuit applications.

R-PDSO-G24

7.8 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3/5

Not Qualified

1.1 mm

Other Telecom ICs

.01 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

40

4.4 mm

SA647DH,112 by NXP Semiconductors

SA647DH,112

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA647DH,118 by NXP Semiconductors

SA647DH,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

6.5 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

AD9364BBCZREEL by Analog Devices

AD9364BBCZREEL

Analog Devices

AD9364BBCZREEL by Analog Devices is a 144-terminal telecom IC with a supply voltage of 1.8V, operating b/w -40 to 85°C. It features a grid array package style and is suitable for telecom circuit applications requiring low profile and fine pitch components.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD9364BBCZ by Analog Devices

AD9364BBCZ

Analog Devices

AD9364BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.8V. Ideal for telecom circuits, it features a fine pitch and bottom terminal position for surface mount applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

SST12LP17E-QU8E by Microchip Technology

SST12LP17E-QU8E

Microchip Technology

SST12LP17E-QU8E by Microchip Technology is a telecom interface IC with 1 function. It has a small outline, heat sink/slug package style and operates in an industrial temperature range of -40 to 85 °C. This IC is commonly used in telecom circuits with a nominal voltage of 3.3 V.

S-PDSO-N8

e3

2 mm

3

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

DUAL

2 mm

MP45DT02TR-M by STMicroelectronics

MP45DT02TR-M

STMicroelectronics

STMicroelectronics MP45DT02TR-M is a telecom IC with 6 terminals, operating b/w -30 to 85°C. It has a rectangular shape, grid array package style, and nickel palladium gold finish. With a nominal voltage of 1.8V, it's ideal for telecom circuit applications due to its compact size (4.72mm x 3.76mm) and no-lead terminal form.

R-XBGA-N6

e4

4.72 mm

3

1

6

85 Cel

-30 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

260

1.35 mm

1.8 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

BOTTOM

3.76 mm

MRF24J40MDT-I/RM by Microchip Technology

MRF24J40MDT-I/RM

Microchip Technology

Microchip Technology's MRF24J40MDT-I/RM is a telecom IC with 12 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 2.54mm. Ideal for industrial applications requiring reliable wireless communication in compact spaces.

R-XDMA-N12

e3

33.02 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.3528 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

2.54 mm

DUAL

22.86 mm

STA311B by STMicroelectronics

STA311B

STMicroelectronics

STA311B by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C and 90 °C. It features a compact 56-terminal quad package with a nominal voltage of 3.3V. Ideal for surface mount designs, it ensures efficient thermal management in telecom circuits.

S-XQCC-N56

8 mm

1

56

90 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

8 mm

STHVDAC-253MF3 by STMicroelectronics

STHVDAC-253MF3

STMicroelectronics

STHVDAC-253MF3 by STMicroelectronics is a 16-terminal IC with plastic package, suitable for telecom circuits. It operates b/w -30 °C to 85°C, with a nominal voltage of 3.3V. The grid array package style has very thin profile and fine pitch, making it ideal for telecom interface applications.

R-PBGA-B16

1.7 mm

1

16

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.655 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

NOT SPECIFIED

1.6 mm

XCC2564MODNCMOET by Texas Instruments

XCC2564MODNCMOET

Texas Instruments

Texas Instruments XCC2564MODNCMOET is a 33-terminal SQUARE CHIP CARRIER IC with operating temperatures from -20 to 70°C. It's a TELECOM CIRCUIT suitable for telecom interfaces, featuring a nominal voltage of 3.6V and surface mount compatibility.

S-XBCC-B33

7 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

1.4 mm

3.6 V

YES

TELECOM CIRCUIT

OTHER

BUTT

BOTTOM

7 mm

ALM-GN001-BLKG by Broadcom

ALM-GN001-BLKG

Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N6

2.3 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

1.7 mm

ALM-GN001-TR1G by Broadcom

ALM-GN001-TR1G

Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N6

2.3 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

1.7 mm

SI4330-B1-FMR by Silicon Labs

SI4330-B1-FMR

Silicon Labs

SI4330-B1-FMR by Silicon Labs is a 20-terminal SQUARE chip carrier with matte tin finish. Operating b/w -40 to 85 °C, it's an industrial-grade telecom circuit IC with a nominal voltage of 3 V. Ideal for telecom interfaces, this surface-mount device has a very thin profile and quad terminal position.

S-XQCC-N20

e3

4 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

40

4 mm

CC2531F128RHAR by Texas Instruments

CC2531F128RHAR

Texas Instruments

CC2531F128RHAR by Texas Instruments is a telecom IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it offers high performance in compact designs.

S-PQCC-N40

e4

6 mm

3

1

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC2531F128RHAT by Texas Instruments

CC2531F128RHAT

Texas Instruments

CC2531F128RHAT by Texas Instruments is a telecom IC with 40 terminals, operating b/w -40 to 125°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This chip carrier package is ideal for automotive applications due to its nickel palladium gold finish and moisture sensitivity level of 3.

S-PQCC-N40

e4

6 mm

3

1

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

TLK2711AIRCPR by Texas Instruments

TLK2711AIRCPR

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HVFQFP; Package Shape: SQUARE;

S-PQFP-G64

e4

10 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

10 mm

TLK2711AIRCP by Texas Instruments

TLK2711AIRCP

Texas Instruments

TLK2711AIRCP by Texas Instruments is a telecom IC with 64 terminals, operating at 2.5V. It has a temperature range of -40 to 85°C and features a flatpack package style. Ideal for telecom circuit applications due to its industrial-grade performance and very thin profile design.

S-PQFP-G64

e4

10 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

10 mm

TLK2711AJRZQE by Texas Instruments

TLK2711AJRZQE

Texas Instruments

TLK2711AJRZQE by Texas Instruments is a telecom interface IC with 80 terminals in a square grid array package. Operating at 2.5V, it has a temperature range of 0-70°C and terminal finish of Tin Silver Copper. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for commercial applications.

S-PBGA-B80

e1

5 mm

3

1

80

70 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

BGA80,9X9,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

ONET8501PBRGTT by Texas Instruments

ONET8501PBRGTT

Texas Instruments

ONET8501PBRGTT by Texas Instruments is a telecom interface IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 100°C, has a data rate of 11300 Mbps, and requires a nominal voltage of 3.3V. Ideal for industrial applications requiring high-speed telecommunications circuitry.

11300 Mbps

S-PQCC-N16

e4

3 mm

2

1

16

100 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SN761634RTWR by Texas Instruments

SN761634RTWR

Texas Instruments

SN761634RTWR by Texas Instruments is a telecom interface IC with 24 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it has a nominal voltage of 3V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold terminal finish.

S-PQCC-N24

e4

4 mm

2

1

24

85 Cel

-20 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.8 mm

Other Telecom ICs

3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TDA7541W by STMicroelectronics

TDA7541W

STMicroelectronics

TDA7541W by STMicroelectronics is a versatile telecom interface IC designed for industrial applications. It features a wide operating temp range of -40 °C to 85°C, operates at a nominal voltage of 8.5V, and comes in a compact 64-terminal flatpack package. Ideal for robust telecom circuits, it ensures reliable performance in demanding environments.

S-PQFP-G64

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

NOT SPECIFIED

Not Qualified

8.5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

QUAD

NOT SPECIFIED

TDA7541 by STMicroelectronics

TDA7541

STMicroelectronics

TDA7541 by STMicroelectronics is a BICMOS telecom interface IC designed for industrial applications. It features a low profile 64-terminal package, operates b/w -40 °C to 85°C, and requires a nominal voltage of 8.5V. Ideal for surface mount designs, it ensures reliable performance in telecom circuits.

S-PQFP-G64

10 mm

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.6 mm

8.5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

10 mm

TDA7255V by Infineon Technologies

TDA7255V

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: VQCCN; Package Shape: RECTANGULAR;

R-PQCC-N40

6.5 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

LCC40,.22X.26,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NOT SPECIFIED

2.5/5

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5.5 mm

ADF9010BCPZ-RL7 by Analog Devices

ADF9010BCPZ-RL7

Analog Devices

Analog Devices ADF9010BCPZ-RL7 is a BICMOS technology telecom IC with 48 terminals, operating b/w -40 to 85 °C. It has a supply voltage of 3.3V and low current draw of 0.41mA. Ideal for telecom circuits, it comes in a square chip carrier package with matte tin finish and very thin profile.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

.41 mA

3.3 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm

ADF9010BCPZ by Analog Devices

ADF9010BCPZ

Analog Devices

Analog Devices ADF9010BCPZ is a 48-terminal BICMOS telecom IC with 3.3V supply, operating from -40 to 85 °C. It features a square chip carrier package style and matte tin finish, suitable for industrial applications requiring low power consumption at 0.41mA.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

.41 mA

3.3 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm