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ADF9010BCPZ

Analog Devices

ADF9010BCPZ by Analog Devices

Analog Devices ADF9010BCPZ is a 48-terminal BICMOS telecom IC with 3.3V supply, operating from -40 to 85 °C. It features a square chip carrier package style and matte tin finish, suitable for industrial applications requiring low power consumption at 0.41mA.

Median Price

$33.270

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 51 parts In-Stock

1+ parts

$30.670

100+ parts

-

1k+ parts

$17.700

10k+ parts

-

51

$30.670

-

$17.700

-

DigiKey

USA . 420 parts In-Stock

1+ parts

$35.870

100+ parts

$29.398

1k+ parts

$26.344

10k+ parts

-

420

$35.870

$29.398

$26.344

-

Verical

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 396 parts In-Stock

1+ parts

$27.341

100+ parts

-

1k+ parts

-

10k+ parts

-

396

$27.341

-

-

-

Vyrian

USA . 5,142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,142

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 309 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

$0.069

309

$0.072

-

-

$0.069

Northwest PG Solutions

USA . 950 parts In-Stock

1+ parts

$0.079

100+ parts

-

1k+ parts

-

10k+ parts

$0.069

950

$0.079

-

-

$0.069

Parana Technologies

USA . 1,524 parts In-Stock

1+ parts

$9.343

100+ parts

-

1k+ parts

$8.689

10k+ parts

-

1,524

$9.343

-

$8.689

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IDEA Electronic Components Group

UK . 1,467 parts In-Stock

1+ parts

$10.046

100+ parts

-

1k+ parts

$9.544

10k+ parts

-

1,467

$10.046

-

$9.544

-

DigiPath Technology Company

USA . 1,912 parts In-Stock

1+ parts

$15.672

100+ parts

$15.045

1k+ parts

-

10k+ parts

$15.045

1,912

$15.672

$15.045

-

$15.045

Ampacity Inc.

Singapore . 738 parts In-Stock

1+ parts

$18.690

100+ parts

-

1k+ parts

-

10k+ parts

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738

$18.690

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-

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Semicontronic

India . 507 parts In-Stock

1+ parts

$18.690

100+ parts

$18.223

1k+ parts

$18.129

10k+ parts

-

507

$18.690

$18.223

$18.129

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Corphita

USA . 628 parts In-Stock

1+ parts

$25.902

100+ parts

-

1k+ parts

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10k+ parts

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628

$25.902

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Overview

Experience the cutting-edge technology of Analog Devices with the ADF9010BCPZ, a top-of-the-line telecom interface IC that promises unmatched quality and performance. Designed for optimal functionality and reliability, this square-shaped chip carrier boasts a very thin profile and matte tin finish, making it perfect for a wide range of telecom applications. Trust Analog Devices to deliver superior products that exceed expectations, providing you with the value, benefits, and advantages you need to stay ahead in today's competitive market. Elevate your projects with the ADF9010BCPZ and experience excellence like never before.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on the surface of a circuit board, making it convenient for assembly and saving space.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and alignment with other components.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of systems and devices.

No. of Terminals: 48

With 48 terminals, this product offers a high level of connectivity and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides enhanced performance and thermal management.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows this product to function in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy connection and compatibility with standard mounting configurations.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm minimizes the overall profile of the product and saves space in the system.

Width: 7 mm

The compact width of 7 mm enables easy integration of this product into various electronic devices and systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures robust soldering and assembly processes.

Length: 7 mm

The short length of 7 mm contributes to the overall compact design and efficient use of board space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for use in harsh industrial environments with extreme temperature variations.

Technology: BICMOS

The BICMOS technology offers a combination of the advantages of both bipolar and CMOS technologies, providing a balance of performance and power efficiency.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking and enhances the product's reliability.

Maximum Supply Current: 0.41 mA

The low maximum supply current of 0.41 mA helps minimize power consumption and improve energy efficiency.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, this product is specifically designed for telecommunications applications, ensuring reliable and high-quality performance.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in many electronic systems, providing compatibility with a wide range of devices and circuits.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand moderate levels of moisture exposure during storage and transportation, ensuring product reliability.

Technical Specifications

Other Function Telecom Interface ICs ADF9010BCPZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.41 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF9010BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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