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ADF9010BCPZ-RL

Analog Devices

ADF9010BCPZ-RL by Analog Devices

Analog Devices ADF9010BCPZ-RL is a BICMOS technology telecom IC with 48 terminals, operating at -40 to 85 °C. It has a supply voltage of 3.3V and low current draw of 0.41mA, suitable for telecom circuit applications in industrial settings. The chip carrier package style with matte tin finish and square shape makes it ideal for surface mount assembly with a compact size of 7x7mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,633 parts In-Stock

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2,633

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Digiode

USA . 22 parts In-Stock

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22

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Distributors (Availability)

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Parana Technologies

USA . 768 parts In-Stock

1+ parts

$6.011

100+ parts

-

1k+ parts

$5.590

10k+ parts

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768

$6.011

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$5.590

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IDEA Electronic Components Group

UK . 520 parts In-Stock

1+ parts

$6.463

100+ parts

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$6.140

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520

$6.463

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$6.140

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AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$7.633

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878

$7.633

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DigiPath Technology Company

USA . 1,893 parts In-Stock

1+ parts

$10.082

100+ parts

$9.679

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1,893

$10.082

$9.679

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Semicontronic

India . 903 parts In-Stock

1+ parts

$261.000

100+ parts

$254.475

1k+ parts

$253.170

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903

$261.000

$254.475

$253.170

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One Stop Electronics

USA . 214 parts In-Stock

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$495.000

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214

$495.000

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Native Components

USA . 553 parts In-Stock

1+ parts

$2,180.700

100+ parts

$2,137.086

1k+ parts

$2,115.279

10k+ parts

$2,093.472

553

$2,180.700

$2,137.086

$2,115.279

$2,093.472

Northwest PG Solutions

USA . 283 parts In-Stock

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$2,398.770

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283

$2,398.770

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Corphita

USA . 635 parts In-Stock

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635

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Overview

Enhance your telecom interface systems with the ADF9010BCPZ-RL by Analog Devices. Known for their exceptional quality and reliability, Analog Devices offers cutting-edge technology that ensures optimal performance in various applications. This square-shaped surface-mount IC boasts a compact design and operates at a wide temperature range, making it ideal for industrial use. With a nominal supply voltage of 3.3V and low supply current, this product delivers efficient and cost-effective solutions for your telecommunications needs. Upgrade your systems today with the ADF9010BCPZ-RL and experience unparalleled value and performance.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting onto a PCB, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape can provide improved stability and ease of handling during the manufacturing process.

Power Supplies (V): 3.3

Operating at a common voltage of 3.3V, making it compatible with many standard power supplies and systems.

No. of Terminals: 48

High number of terminals allows for connectivity to various components and interfaces, increasing versatility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Incorporates multiple package styles for optimal performance, heat dissipation, and space-saving in tight layout designs.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Withstands low temperatures, ensuring functionality in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing reliability.

Terminal Position: QUAD

Quad terminal position enables reliable connection and improves signal integrity.

Maximum Seated Height: 1 mm

Low seated height saves space and allows for compact design integration.

Width: 7 mm

Compact width makes it suitable for applications with limited board space.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes without damage.

Length: 7 mm

Short length facilitates efficient PCB layout and compact system design.

Technology: BICMOS

Utilizes BiCMOS technology for high-speed performance and low power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safety.

Maximum Supply Current: 0.41 mA

Low supply current consumption for energy efficiency and reduced operating costs.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring reliable communication performance.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V for compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for standard handling and storage precautions.

Technical Specifications

Other Function Telecom Interface ICs ADF9010BCPZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.41 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF9010BCPZ-RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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