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ADF9010BCPZ-RL7

Analog Devices

ADF9010BCPZ-RL7 by Analog Devices

Analog Devices ADF9010BCPZ-RL7 is a BICMOS technology telecom IC with 48 terminals, operating b/w -40 to 85 °C. It has a supply voltage of 3.3V and low current draw of 0.41mA. Ideal for telecom circuits, it comes in a square chip carrier package with matte tin finish and very thin profile.

Median Price

$29.890

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 8,400 parts In-Stock

1+ parts

$29.890

100+ parts

$19.238

1k+ parts

$17.700

10k+ parts

-

8,400

$29.890

$19.238

$17.700

-

DigiKey

USA . 1,499 parts In-Stock

1+ parts

$36.680

100+ parts

$27.081

1k+ parts

-

10k+ parts

-

1,499

$36.680

$27.081

-

-

Verical

USA . 10,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$19.035

10k+ parts

-

10,500

-

-

$19.035

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 197 parts In-Stock

1+ parts

$30.922

100+ parts

-

1k+ parts

-

10k+ parts

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197

$30.922

-

-

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Vyrian

USA . 11,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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11,169

-

-

-

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Classic Components Corporation

USA . 2 parts In-Stock

1+ parts

-

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-

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,345 parts In-Stock

1+ parts

$7.907

100+ parts

-

1k+ parts

$7.353

10k+ parts

-

1,345

$7.907

-

$7.353

-

IDEA Electronic Components Group

UK . 126 parts In-Stock

1+ parts

$8.502

100+ parts

-

1k+ parts

$8.077

10k+ parts

-

126

$8.502

-

$8.077

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DigiPath Technology Company

USA . 1,444 parts In-Stock

1+ parts

$13.263

100+ parts

$12.733

1k+ parts

-

10k+ parts

$12.733

1,444

$13.263

$12.733

-

$12.733

Semicontronic

India . 550 parts In-Stock

1+ parts

$18.690

100+ parts

$18.223

1k+ parts

$18.129

10k+ parts

-

550

$18.690

$18.223

$18.129

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Corphita

USA . 346 parts In-Stock

1+ parts

$29.295

100+ parts

-

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10k+ parts

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346

$29.295

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S.R.D Solutions

India . 20,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20,000

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Northwest PG Solutions

USA . 797 parts In-Stock

1+ parts

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797

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Native Components

USA . 386 parts In-Stock

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386

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Overview

Discover the cutting-edge technology of the ADF9010BCPZ-RL7 by Analog Devices, a high-quality telecom interface IC that delivers unrivaled performance and reliability. With Analog Devices' reputation for excellence in semiconductor manufacturing, this product is sure to exceed your expectations. Ideal for a wide range of telecom applications, this chip carrier boasts a very thin profile and matte tin terminal finish, making it a versatile and efficient choice for all your connectivity needs. Experience the value and benefits of Analog Devices' ADF9010BCPZ-RL7 and elevate your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure placement on PCBs, making installation and assembly more efficient.

Package Shape: SQUARE

Square packaging provides a compact and space-saving design, ideal for applications where size constraints are important.

Power Supplies (V): 3.3

Operates at a common voltage level (3.3V), making it compatible with a wide range of systems and devices.

No. of Terminals: 48

Offers a high number of terminals for connectivity options, enabling versatile and customizable circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal performance and overall reliability.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, ensuring stable performance under varying conditions.

Minimum Operating Temperature: -40 °C

Can withstand low-temperature settings, making it suitable for use in diverse operating environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, contributing to long-term durability.

Terminal Position: QUAD

Quad terminal configuration simplifies connection and enables efficient signal routing for enhanced functionality.

Maximum Seated Height: 1 mm

Low profile design with maximum seated height of 1mm allows for compact integration into space-limited applications.

Width: 7 mm

Narrow width of 7mm facilitates installation in confined spaces and allows for efficient PCB layout.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures, ensuring reliable soldering during manufacturing processes.

Length: 7 mm

Compact length of 7mm contributes to the overall small form factor, suitable for applications requiring minimal footprint.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates robustness and reliability for operation in harsh industrial environments.

Technology: BICMOS

Utilizes BiCMOS technology for integrated circuits, offering a balance of high-speed performance and low power consumption.

Terminal Form: NO LEAD

Lead-free terminal form ensures environmental compliance and promotes sustainable manufacturing practices.

Maximum Supply Current: 0.41 mA

Low maximum supply current of 0.41mA helps in reducing power consumption and energy usage, enhancing efficiency.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, providing optimized functionality and performance for telecommunications applications.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage of 3.3V, ensuring compatibility with typical power sources and systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and connectivity, offering flexibility in PCB design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, making it suitable for handling and storage in standard manufacturing environments.

Technical Specifications

Other Function Telecom Interface ICs ADF9010BCPZ-RL7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.41 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF9010BCPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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