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CC2531F128RHAR

Texas Instruments

CC2531F128RHAR by Texas Instruments

CC2531F128RHAR by Texas Instruments is a telecom IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it offers high performance in compact designs.

Median Price

$7.104

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

$5.430

100+ parts

$5.100

1k+ parts

$4.610

10k+ parts

-

5,000

$5.430

$5.100

$4.610

-

Texas Instruments

USA . 9,700 parts In-Stock

1+ parts

$6.845

100+ parts

$5.580

1k+ parts

$3.720

10k+ parts

-

9,700

$6.845

$5.580

$3.720

-

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$7.750

1k+ parts

-

10k+ parts

-

5,000

-

$7.750

-

-

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$7.362

1k+ parts

$6.588

10k+ parts

$6.200

5,000

-

$7.362

$6.588

$6.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,085 parts In-Stock

1+ parts

$5.396

100+ parts

-

1k+ parts

-

10k+ parts

-

3,085

$5.396

-

-

-

Vyrian

USA . 8,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,965

-

-

-

-

DigiKey Marketplace

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 519 parts In-Stock

1+ parts

$1.177

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$1.177

-

-

-

Northwest PG Solutions

USA . 422 parts In-Stock

1+ parts

$1.295

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$1.295

-

-

-

Corphita

USA . 1,408 parts In-Stock

1+ parts

$5.112

100+ parts

-

1k+ parts

-

10k+ parts

-

1,408

$5.112

-

-

-

Parana Technologies

USA . 2,132 parts In-Stock

1+ parts

$11.623

100+ parts

-

1k+ parts

$12.018

10k+ parts

-

2,132

$11.623

-

$12.018

-

DigiPath Technology Company

USA . 1,151 parts In-Stock

1+ parts

$12.798

100+ parts

$11.774

1k+ parts

-

10k+ parts

-

1,151

$12.798

$11.774

-

-

ChromeModa Solutions

Germany . 4,400 parts In-Stock

1+ parts

$13.059

100+ parts

$10.708

1k+ parts

-

10k+ parts

-

4,400

$13.059

$10.708

-

-

IDEA Electronic Components Group

UK . 1,003 parts In-Stock

1+ parts

$13.059

100+ parts

$12.406

1k+ parts

$11.753

10k+ parts

-

1,003

$13.059

$12.406

$11.753

-

Corohmni

South Africa . 27 parts In-Stock

1+ parts

$17.692

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$17.692

-

-

-

Advanced Electronics

New Zealand . 37 parts In-Stock

1+ parts

$19.304

100+ parts

$17.567

1k+ parts

$15.829

10k+ parts

-

37

$19.304

$17.567

$15.829

-

Perfect Parts

USA . 18,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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18,715

-

-

-

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A-Z Elektronik GmbH

Germany . 5,313 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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5,313

-

-

-

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Alle Elektronik GmbH

Germany . 3,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,542

-

-

-

-

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,500

-

-

-

-

Overview

Experience the high-quality performance and reliability of the CC2531F128RHAR by Texas Instruments, a leader in innovative semiconductor solutions. This telecom interface IC offers a wide range of applications in the telecommunications industry, providing customers with unmatched value and benefits. With a durable plastic package body material and advanced features like surface mount capabilities and a wide temperature range, this product delivers superior functionality and efficiency. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for telecom applications where portability and reliability are key.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying assembly processes.

No. of Terminals: 40

Having a higher number of terminals provides more connectivity options, making this product versatile for various telecom interface applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in diverse settings.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product is optimized for efficient communication and data processing in telecommunication networks.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V, this product is energy-efficient and suitable for low power telecom devices, reducing overall power consumption.

Technical Specifications

Other Function Telecom Interface ICs CC2531F128RHAR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC2531F128RHAR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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