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Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.

Other Function Telecom Interface ICs

Available Parts 1,254

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
VSC8484YJP by Microchip Technology

VSC8484YJP

Microchip Technology

VSC8484YJP by Microchip Technology is a telecom IC with 324 terminals in a square grid array package. It operates b/w -40°C to 105°C, suitable for industrial use. With a nominal voltage of 1.2V, it is designed for telecom circuit applications.

S-PBGA-B324

18.6 mm

1

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.74 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

1 mm

BOTTOM

18.6 mm

ADF5902WCCPZ-RL7 by Analog Devices

ADF5902WCCPZ-RL7

Analog Devices

ADF5902WCCPZ-RL7 by Analog Devices is a telecom IC with 32 terminals, operating at -40 to 105 °C. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm. This chip carrier package with very thin profile is ideal for industrial applications requiring high temperature tolerance.

S-XQCC-N32

5 mm

3

1

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

FIDO5100CBCZ by Analog Devices

FIDO5100CBCZ

Analog Devices

FIDO5100CBCZ by Analog Devices is a telecom IC with 144 terminals in a square grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With a low profile of 1.24mm and CMOS technology, it has a nominal voltage of 1.2V for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5200CBCZ by Analog Devices

FIDO5200CBCZ

Analog Devices

FIDO5200CBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With CMOS technology and a nominal voltage of 1.2V, it is ideal for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

450-0106C by Laird Technologies

450-0106C

Laird Technologies

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

NOT SPECIFIED

TELECOM CIRCUIT

NOT SPECIFIED

ADS58J64IRRHT by Texas Instruments

ADS58J64IRRHT

Texas Instruments

Texas Instruments ADS58J64IRRHT is a 72-terminal telecom IC with max analog input of 2V. Operating b/w -40 to 85°C, it's ideal for industrial applications requiring a nominal voltage of 1.15V. This surface-mount chip carrier supports quad terminal position and nickel palladium gold finish.

2 V

R-XQCC-N72

e4

3

1

72

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

260

1.15 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

QUAD

30

RN4678APL-V/RM113 by Microchip Technology

RN4678APL-V/RM113

Microchip Technology

RN4678APL-V/RM113 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20 to 70°C. It has a compact rectangular package measuring 12mm in width and 22mm in length, suitable for surface mount applications. With a nominal voltage of 1.9V, it is ideal for commercial temperature grade telecom circuit designs.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

BM78SPPS5MC2-0004AA by Microchip Technology

BM78SPPS5MC2-0004AA

Microchip Technology

BM78SPPS5MC2-0004AA by Microchip Technology is a surface mount telecom interface IC with 1 function and 33 terminals. It operates at temperatures ranging from -20 to 70 °C and has a nominal voltage of 1.9 V. This IC is commonly used in telecom circuits for various applications.

R-XXMA-N33

e4

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

255

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

GOLD OVER NICKEL

NO LEAD

1.1 mm

UNSPECIFIED

40

12 mm

EFR32BG13P532F512GM32-D by Silicon Labs

EFR32BG13P532F512GM32-D

Silicon Labs

EFR32BG13P532F512GM32-D by Silicon Labs is a telecom IC with 32 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and MSL level of 3, suitable for industrial applications requiring a compact chip carrier package with no lead terminals.

S-XQCC-N32

5 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

5 mm

EFR32BG13P632F512GM32-D by Silicon Labs

EFR32BG13P632F512GM32-D

Silicon Labs

EFR32BG13P632F512GM32-D by Silicon Labs is a Telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and package style of CHIP CARRIER. Ideal for telecom applications due to its industrial temperature grade and no-lead terminal form.

S-XQCC-N32

5 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

5 mm

ZED-F9P-01B by U-blox Ag

ZED-F9P-01B

U-blox Ag

ZED-F9P-01B by U-blox Ag is a GNSS Module with 54 terminals, operating temperature range of -40 to 85°C. It is surface mountable and suitable for industrial applications requiring precise positioning and timing accuracy.

R-XBGA-B54

1

54

85 Cel

-40 Cel

LGA

RECTANGULAR

GRID ARRAY

TS 16949

3 V

YES

GNSS Module

INDUSTRIAL

BUTT

BOTTOM

MGM210P032JIA2 by Silicon Labs

MGM210P032JIA2

Silicon Labs

TELECOM CIRCUIT;

TELECOM CIRCUIT

SA636DK/02J by NXP Semiconductors

SA636DK/02J

NXP Semiconductors

SA636DK/02J by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold terminal finish, 3V supply voltage, and peak reflow temperature of 260°C.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

SSOP20,.25

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

WF111-E-V1-ETSI by Silicon Labs

WF111-E-V1-ETSI

Silicon Labs

TELECOM CIRCUIT;

TELECOM CIRCUIT

FIDO5110BBCZ by Analog Devices

FIDO5110BBCZ

Analog Devices

FIDO5110BBCZ by Analog Devices is a Telecom Circuit IC with 144 terminals in a low profile, fine pitch grid array package. Operating temperature range from -40 to 85 °C makes it suitable for industrial applications. It operates at a nominal voltage of 1.2V and utilizes CMOS technology for efficient performance.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5110CBCZ by Analog Devices

FIDO5110CBCZ

Analog Devices

FIDO5110CBCZ by Analog Devices is a telecom IC with 144 terminals in a square grid array package. Operating temperature ranges from -40 to 105 °C, suitable for industrial use. It features CMOS technology, 1.2V supply voltage, and 0.8mm terminal pitch, ideal for telecom circuit applications.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5210BBCZ by Analog Devices

FIDO5210BBCZ

Analog Devices

FIDO5210BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With a nominal voltage of 1.2V and CMOS technology, it's ideal for telecom circuit interfaces.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5210CBCZ by Analog Devices

FIDO5210CBCZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

TFF1024HN/N1,135 by NXP Semiconductors

TFF1024HN/N1,135

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Length: 3.5 mm;

R-PQCC-N16

3.5 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.1X.14,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.5 mm

QUAD

2.5 mm

MFRC52302HN1,157 by NXP Semiconductors

MFRC52302HN1,157

NXP Semiconductors

TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;

e4

1

260

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

30

RN4020BCN-V/RM120 by Microchip Technology

RN4020BCN-V/RM120

Microchip Technology

RN4020BCN-V/RM120 by Microchip Technology is a telecom IC with 24 terminals, operating at -30 to 85°C. It has a data rate of 1 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for telecom circuit applications due to its TS16949 screening level and compact rectangular package design.

1 Mbps

R-XXMA-N24

e4

19.5 mm

1

24

85 Cel

-30 Cel

UNSPECIFIED

XMA

MODULE,24LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.38 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

GOLD OVER NICKEL

NO LEAD

1.2 mm

UNSPECIFIED

11.5 mm

RN4678APL-V/RM120 by Microchip Technology

RN4678APL-V/RM120

Microchip Technology

RN4678APL-V/RM120 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20 to 70°C. It has a supply voltage of 1.9V and terminal pitch of 1.1mm. This surface-mount rectangular package is ideal for telecom circuit applications due to its compact size and commercial temperature grade suitability.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

AD9082BBPZ-4D2AC by Analog Devices

AD9082BBPZ-4D2AC

Analog Devices

AD9082BBPZ-4D2AC by Analog Devices is a telecom IC with 324 terminals in a grid array package. It operates b/w -40 to 85 °C, with a peak reflow temperature of 260°C. Ideal for telecom circuits, it has a nominal voltage of 1V and terminal pitch of 0.8mm.

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

S-PBGA-B324

15 mm

3

1

324

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.72 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

15 mm

AD9082BBPZRL-4D2AC by Analog Devices

AD9082BBPZRL-4D2AC

Analog Devices

AD9082BBPZRL-4D2AC by Analog Devices is a telecom IC with 324 terminals, operating temperature range of -40 to 85 °C. It features a grid array package style, ball terminal form, and nominal voltage of 1V. Ideal for telecom circuits, this IC is designed for industrial applications requiring fine pitch surface mount technology.

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

S-PBGA-B324

15 mm

3

1

324

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.72 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

15 mm

PN7150B0HN/C11004E by NXP Semiconductors

PN7150B0HN/C11004E

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N40

6 mm

1

40

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

2.75 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

6 mm

PN7150B0HN/C11004Y by NXP Semiconductors

PN7150B0HN/C11004Y

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N40

6 mm

1

40

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

2.75 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

6 mm

ESP32-WROVER-B(M213DH6464PH3Q0) by Espressif Systems (Shanghai)

ESP32-WROVER-B(M213DH6464PH3Q0)

Espressif Systems (Shanghai)

ESP32-WROVER-B by Espressif Systems is a telecom IC with 39 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm. Ideal for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages with surface mount capability.

R-XXMA-N39

31.4 mm

1

39

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

3.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.27 mm

UNSPECIFIED

NOT SPECIFIED

18 mm

AX5051-1-TA05 by Onsemi

AX5051-1-TA05

Onsemi

TELECOM CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;

e4

1

260

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

30

BM71BLES1FC2-0B05BA by Microchip Technology

BM71BLES1FC2-0B05BA

Microchip Technology

BM71BLES1FC2-0B05BA by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates at temperatures ranging from -40 to 85 °C and has a max seated height of 2.1 mm. With a data rate of 0.0086 Mbps, it is suitable for various telecom circuit applications.

.0086 Mbps

R-XXMA-X16

11.5 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.1 mm

3 V

YES

TELECOM CIRCUIT

NO LEAD

UNSPECIFIED

9 mm

RN4678APL-V/RM122 by Microchip Technology

RN4678APL-V/RM122

Microchip Technology

RN4678APL-V/RM122 by Microchip Tech is a surface mount IC with 33 terminals, operating temp range of -20 to 70°C. Telecom circuit type with nominal voltage of 1.9V. Ideal for telecom interfaces due to its compact rectangular package style and no-lead terminal form.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

RN4678-V/RM122 by Microchip Technology

RN4678-V/RM122

Microchip Technology

RN4678-V/RM122 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20°C to 70°C. It has a supply voltage of 1.9V and compact dimensions of 12mm width, 22mm length, and 2.46mm height. Ideal for surface mount applications in telecom circuits due to its no-lead terminal form and rectangular package style.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

BGS13SL9E6327XTSA1 by Infineon Technologies

BGS13SL9E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 9; Package Code: BCC; Package Shape: SQUARE;

S-XBCC-B9

1.15 mm

1

9

85 Cel

-30 Cel

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

.32 mm

3 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

1.15 mm

AD6674BCPZ-1000 by Analog Devices

AD6674BCPZ-1000

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZ-500 by Analog Devices

AD6674BCPZ-500

Analog Devices

AD6674BCPZ-500 by Analog Devices is a 64-terminal telecom IC with a square shape and 0.5mm terminal pitch. Operating b/w -40 to 85°C, it has a nominal voltage of 1.25V and matte tin finish. Ideal for industrial applications requiring very thin profile package style and no lead terminal form.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZ-750 by Analog Devices

AD6674BCPZ-750

Analog Devices

AD6674BCPZ-750 by Analog Devices is a 64-terminal telecom IC with a nominal voltage of 1.25V. It operates in industrial temperature range (-40 to 85 °C) and features matte tin terminal finish. This square-shaped chip carrier is suitable for telecom circuit applications requiring surface mount technology.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZRL7-1000 by Analog Devices

AD6674BCPZRL7-1000

Analog Devices

AD6674BCPZRL7-1000 by Analog Devices is a 64-terminal telecom IC with a square package shape and matte tin finish. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 1.25V, it is ideal for telecom circuit applications requiring a very thin profile design.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZRL7-500 by Analog Devices

AD6674BCPZRL7-500

Analog Devices

AD6674BCPZRL7-500 by Analog Devices is a 64-terminal telecom IC with a square package style. It operates b/w -40 to 85 °C, suitable for industrial applications. With a nominal voltage of 1.25V, it is designed for telecom circuit interfaces in compact spaces.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZRL7-750 by Analog Devices

AD6674BCPZRL7-750

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

WL1807MODGIMOCT by Texas Instruments

WL1807MODGIMOCT

Texas Instruments

WL1807MODGIMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -40 to 85°C, it has a nominal voltage of 3.7V and supports data rates up to 100 Mbps. Ideal for industrial applications requiring high-speed telecommunications functionality.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

XWL1837MODGIMOC by Texas Instruments

XWL1837MODGIMOC

Texas Instruments

XWL1837MODGIMOC by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates b/w -40°C to 85°C, with a supply voltage of 3.7V. Ideal for telecom circuit applications due to its compact rectangular shape and surface-mount compatibility.

R-PBGA-N100

13.4 mm

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

3.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.7 mm

BOTTOM

13.3 mm

NCV7428MW3R2G by Onsemi

NCV7428MW3R2G

Onsemi

NCV7428MW3R2G by Onsemi is an 8-terminal telecom interface IC with a small outline, heat sink package. It operates b/w -40 to 125 °C and has a nominal voltage of 12V. Ideal for automotive applications requiring a compact, surface-mount solution with dual terminal position.

S-PDSO-N8

e3

3 mm

1

1

8

125 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

12 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

NO LEAD

.65 mm

DUAL

30

3 mm

STA020DJTR by STMicroelectronics

STA020DJTR

STMicroelectronics

STA020DJTR by STMicroelectronics is a telecom interface IC designed for commercial applications. It features a 3.3V nominal voltage, operates b/w 0 °C to 70 °C, and has a compact 24-terminal gull-wing package. Ideal for surface mount technology in telecom devices.

R-PDSO-G24

e4

15.4 mm

3

1

24

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

2.65 mm

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

STA8088G by STMicroelectronics

STA8088G

STMicroelectronics

STA8088G by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a max operating temp of 85 °C and a min of -40 °C. It has a compact 7x7 mm size with 56 terminals and operates at a nominal voltage of 1.2V. Ideal for automotive and telecom systems, it meets AEC-Q100 standards.

S-XQCC-N56

7 mm

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

QUAD

7 mm

450-0064R by Ls Research

450-0064R

Ls Research

LS Research's 450-0064R is a telecom IC with 52 terminals, operating b/w -40 to 85°C. Its compact rectangular package measures 13x18mm, with a low seated height of 1.9mm. Ideal for industrial applications requiring a 3.6V supply voltage and surface mount compatibility.

R-XQMA-N52

18 mm

4

1

52

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1 mm

QUAD

13 mm

450-0064 by Ls Research

450-0064

Ls Research

LS Research 450-0064 is a telecom IC with 52 terminals in a rectangular microelectronic assembly. Operating at -40 to 85°C, it has a nominal voltage of 3.6V and terminal pitch of 1mm. Ideal for telecom interface applications due to its industrial temperature grade and no lead terminal form.

R-XQMA-N52

18 mm

4

1

52

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1 mm

QUAD

13 mm

ADN2882A-DF by Analog Devices

ADN2882A-DF

Analog Devices

ADN2882A-DF by Analog Devices is a telecom IC with 17 terminals, operating temp. range of -40 to 95 °C, and supply voltage of 3.3V. It's used in industrial applications for telecom circuits requiring surface mount rectangular package style.

R-XUUC-N17

1.2 mm

1

17

95 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

.25 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

.7 mm

LNBH26LSPQR by STMicroelectronics

LNBH26LSPQR

STMicroelectronics

STMicroelectronics LNBH26LSPQR is a 24-terminal telecom IC with 12V supply voltage. It features a square chip carrier package, 1mm seated height, and 0.5mm terminal pitch. Ideal for telecom circuits, this IC is surface mountable and has a quad terminal position for compact applications.

S-XQCC-N24

4 mm

1

1

24

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

12 V

YES

TELECOM CIRCUIT

NO LEAD

.5 mm

QUAD

4 mm

BGU8004X by NXP Semiconductors

BGU8004X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

.65 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.32 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.22 mm

BOTTOM

.44 mm