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NCV7428MW3R2G

Onsemi

NCV7428MW3R2G by Onsemi

NCV7428MW3R2G by Onsemi is an 8-terminal telecom interface IC with a small outline, heat sink package. It operates b/w -40 to 125 °C and has a nominal voltage of 12V. Ideal for automotive applications requiring a compact, surface-mount solution with dual terminal position.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,928 parts In-Stock

1+ parts

$0.980

100+ parts

$0.558

1k+ parts

$0.457

10k+ parts

$0.427

5,928

$0.980

$0.558

$0.457

$0.427

DigiKey

USA . 5,175 parts In-Stock

1+ parts

$0.980

100+ parts

$0.558

1k+ parts

$0.485

10k+ parts

-

5,175

$0.980

$0.558

$0.485

-

Verical

USA . 75,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.559

10k+ parts

$0.498

75,000

-

-

$0.559

$0.498

Rochester

USA . 75,000 parts In-Stock

1+ parts

-

100+ parts

$0.538

1k+ parts

$0.447

10k+ parts

$0.398

75,000

-

$0.538

$0.447

$0.398

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 557 parts In-Stock

1+ parts

$1.282

100+ parts

-

1k+ parts

-

10k+ parts

-

557

$1.282

-

-

-

Chip Stock

USA . 91,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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91,750

-

-

-

-

Flip Electronics

USA . 7,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,785

-

-

-

-

Vyrian

USA . 5,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,456

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,894

-

-

-

-

NexGen Digital

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 505 parts In-Stock

1+ parts

$1.215

100+ parts

-

1k+ parts

-

10k+ parts

-

505

$1.215

-

-

-

Corohmni

South Africa . 428 parts In-Stock

1+ parts

$1.350

100+ parts

-

1k+ parts

-

10k+ parts

-

428

$1.350

-

-

-

Microchip USA

USA . 5,711 parts In-Stock

1+ parts

$3.899

100+ parts

-

1k+ parts

-

10k+ parts

-

5,711

$3.899

-

-

-

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$20.374

100+ parts

$18.540

1k+ parts

$16.707

10k+ parts

-

15

$20.374

$18.540

$16.707

-

RC Electronics

USA . 75,317 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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75,317

-

-

-

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iodParts Technologies Inc.

India . 45,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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45,000

-

-

-

-

Perfect Parts

USA . 32,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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32,928

-

-

-

-

Problanco Electronics

Mexico . 7,865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,865

-

-

-

-

Kulean Microsystems

USA . 7,167 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,167

-

-

-

-

TANS Electronics

Latvia . 5,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,214

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

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UHIMA Technologies

Türkiye . 329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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329

-

-

-

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SupplyDigital Components

Austria . 143 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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143

-

-

-

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GreenTree Electronics

Israel . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

-

-

-

-

Overview

Discover the NCV7428MW3R2G by Onsemi, a cutting-edge telecom interface IC that guarantees top-notch quality and reliability. With Onsemi's renowned reputation for innovative technology, this product is designed to exceed expectations in various applications. From automotive to telecommunications, this versatile IC offers unmatched value and benefits to customers seeking high-performance solutions. Experience seamless integration, optimal efficiency, and superior functionality with the NCV7428MW3R2G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to environmental factors, making this product suitable for long-term use.

Surface Mount: YES

Surface mount feature allows for easy installation and integration into electronic devices, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

Square package shape contributes to a compact design, making it easier to fit into electronic assemblies with limited space.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functions, providing flexibility in the application of this product.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the product can withstand demanding conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to function reliably in a wide range of environments, including harsh conditions.

Terminal Finish: MATTE TIN

Matte tin finish on terminals enhances solderability and corrosion resistance, ensuring a secure and reliable connection in various operating environments.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved signal integrity, enhancing the overall performance and reliability of the product.

Maximum Seated Height: 1 mm

Low maximum seated height allows for a slim and compact design, making it suitable for use in space-constrained applications.

Width: 3 mm

With a narrow width of 3 mm, this product can be easily integrated into tight spaces, maximizing efficiency in electronic device designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient assembly processes, saving time and reducing production costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering and assembly, ensuring the longevity and performance of the product.

Length: 3 mm

Compact length of 3 mm contributes to a space-saving design, making this product ideal for applications where size constraints are a concern.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification indicates that the product meets industry standards for performance and reliability in automotive applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with RoHS regulations, making this product a sustainable and safe choice for electronic devices.

Telecom IC Type: TELECOM CIRCUIT

Telecom circuit type ensures compatibility with telecommunications systems, making this product suitable for a wide range of communication applications.

Nominal Supply Voltage: 12 V

Nominal supply voltage of 12 V allows for efficient power consumption and operation, making this product energy-efficient and cost-effective.

Terminal Pitch: 0.65 mm

Small terminal pitch of 0.65 mm enables precise and compact connections, facilitating high-density designs and improving overall performance.

Technical Specifications

Other Function Telecom Interface ICs NCV7428MW3R2G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCV7428MW3R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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