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NCV7428MWL3R2G

Onsemi

NCV7428MWL3R2G by Onsemi

NCV7428MWL3R2G by Onsemi is an 8-terminal telecom interface IC with a small outline, heat sink package. It operates b/w -40 to 125 °C and has a nominal voltage of 12V. Ideal for automotive applications requiring a compact, surface-mount solution.

Median Price

$1.016

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$1.030

100+ parts

$0.588

1k+ parts

$0.509

10k+ parts

$0.469

3,000

$1.030

$0.588

$0.509

$0.469

Rochester

USA . 3,140 parts In-Stock

1+ parts

-

100+ parts

$0.979

1k+ parts

$0.813

10k+ parts

$0.725

3,140

-

$0.979

$0.813

$0.725

Verical

USA . 3,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.016

10k+ parts

$0.906

3,140

-

-

$1.016

$0.906

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 695 parts In-Stock

1+ parts

$0.533

100+ parts

-

1k+ parts

-

10k+ parts

-

695

$0.533

-

-

-

Vyrian

USA . 754 parts In-Stock

1+ parts

$0.561

100+ parts

-

1k+ parts

-

10k+ parts

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754

$0.561

-

-

-

ComSIT Distribution GmbH

Germany . 153,000 parts In-Stock

1+ parts

-

100+ parts

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153,000

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-

-

-

NexGen Digital

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,598 parts In-Stock

1+ parts

$0.505

100+ parts

-

1k+ parts

-

10k+ parts

-

1,598

$0.505

-

-

-

Corohmni

South Africa . 325 parts In-Stock

1+ parts

$0.561

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$0.561

-

-

-

Microchip USA

USA . 5,638 parts In-Stock

1+ parts

$3.899

100+ parts

-

1k+ parts

-

10k+ parts

-

5,638

$3.899

-

-

-

Component Stockers USA

USA . 6,151 parts In-Stock

1+ parts

$7.170

100+ parts

-

1k+ parts

-

10k+ parts

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6,151

$7.170

-

-

-

SupplyDigital Components

Austria . 7,448 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,448

-

-

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Problanco Electronics

Mexico . 4,245 parts In-Stock

1+ parts

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100+ parts

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4,245

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,000

-

-

-

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Infinite Electronics LLP (Excess)

. 2,148 parts In-Stock

1+ parts

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2,148

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TANS Electronics

Latvia . 1,695 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,695

-

-

-

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Kulean Microsystems

USA . 1,484 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,484

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-

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Kepictronics

USA . 822 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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822

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UHIMA Technologies

Türkiye . 773 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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773

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-

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iodParts Technologies Inc.

India . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

-

-

-

-

Overview

Experience seamless connectivity and reliable performance with the NCV7428MWL3R2G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and cutting-edge technology in every product. This telecom interface IC is designed for a wide range of applications, offering unparalleled value and benefits to customers. Trust in the NCV7428MWL3R2G to deliver exceptional results and enhance your telecommunications systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Square package shape helps optimize space utilization on circuit boards, making it ideal for compact designs.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, enabling the product to interface with different components effectively.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the product remains functional even in extreme cold environments.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish enhances solderability and conductivity, promoting stable electrical connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connection options, accommodating various circuit board configurations.

Width: 3 mm

Narrow width allows for space-efficient integration on crowded circuit boards, enabling compact and streamlined device designs.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder joint formation during manufacturing, enhancing overall product reliability.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification signifies the product's suitability for automotive applications, ensuring reliable performance in vehicle systems.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12 V, the product is compatible with standard power sources commonly used in electronic devices.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for precise connections and signal transmission, ensuring high performance in telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs NCV7428MWL3R2G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCV7428MWL3R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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