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NCV7428D1L5R2G

Onsemi

NCV7428D1L5R2G by Onsemi

NCV7428D1L5R2G by Onsemi is an AEC-Q100 compliant telecom IC with 12V supply voltage. It features a small outline package, matte tin terminal finish, and dual terminal position. Ideal for automotive applications requiring a temperature range of -40 to 125 °C.

Median Price

$0.820

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,000 parts In-Stock

1+ parts

$0.820

100+ parts

$0.464

1k+ parts

$0.400

10k+ parts

$0.371

3,000

$0.820

$0.464

$0.400

$0.371

DigiKey

USA . 2,850 parts In-Stock

1+ parts

$0.820

100+ parts

$0.464

1k+ parts

$0.399

10k+ parts

$0.366

2,850

$0.820

$0.464

$0.399

$0.366

Chip1Stop

Japan . 2,800 parts In-Stock

1+ parts

$8.690

100+ parts

$3.460

1k+ parts

$2.280

10k+ parts

-

2,800

$8.690

$3.460

$2.280

-

Flip Electronics (Authorized)

USA . 261,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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261,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,412 parts In-Stock

1+ parts

$1.948

100+ parts

-

1k+ parts

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10k+ parts

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2,412

$1.948

-

-

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Vyrian

USA . 1,572 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

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10k+ parts

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1,572

$2.050

-

-

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Flip Electronics

USA . 261,182 parts In-Stock

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261,182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 239 parts In-Stock

1+ parts

$0.460

100+ parts

-

1k+ parts

-

10k+ parts

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239

$0.460

-

-

-

Corphita

USA . 1,960 parts In-Stock

1+ parts

$1.845

100+ parts

-

1k+ parts

-

10k+ parts

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1,960

$1.845

-

-

-

Corohmni

South Africa . 318 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

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10k+ parts

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318

$2.570

-

-

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Component Stockers USA

USA . 3,754 parts In-Stock

1+ parts

$2.930

100+ parts

$1.870

1k+ parts

$1.420

10k+ parts

-

3,754

$2.930

$1.870

$1.420

-

Perfect Parts

USA . 10,080 parts In-Stock

1+ parts

-

100+ parts

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10,080

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Problanco Electronics

Mexico . 6,779 parts In-Stock

1+ parts

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6,779

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Microchip USA

USA . 6,508 parts In-Stock

1+ parts

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6,508

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Kepictronics

USA . 5,522 parts In-Stock

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5,522

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Kulean Microsystems

USA . 5,026 parts In-Stock

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5,026

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QUARKTWIN TECHNOLOGY LTD

USA . 4,701 parts In-Stock

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4,701

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TANS Electronics

Latvia . 4,661 parts In-Stock

1+ parts

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4,661

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SupplyDigital Components

Austria . 4,398 parts In-Stock

1+ parts

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4,398

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

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Metaverse IC Inc.

Canada . 2,243 parts In-Stock

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2,243

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Component Connect

USA . 1,100 parts In-Stock

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1,100

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UHIMA Technologies

Türkiye . 972 parts In-Stock

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972

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iodParts Technologies Inc.

India . 100 parts In-Stock

1+ parts

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100

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Overview

Unlock seamless communication with the NCV7428D1L5R2G by Onsemi. Crafted with precision and expertise, this telecom interface IC guarantees reliability and performance. Ideal for automotive applications, this small outline package delivers exceptional value, ensuring smooth operations even in extreme temperatures. Experience the benefits of quality engineering and innovative design with this versatile product that exceeds expectations. Elevate your projects with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the telecom interface IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Screening Level: AEC-Q100

Ensures that the product meets automotive industry standards for quality and reliability.

Package Shape: RECTANGULAR

Facilitates easy integration into existing electronic devices and systems.

No. of Terminals: 8

Provides sufficient connectivity options for the telecom interface IC to interface with other components.

Maximum Operating Temperature: 125 °C

Allows the product to operate in a wide range of temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold conditions, making the product suitable for various applications.

Terminal Finish: MATTE TIN

Provides a smooth and corrosion-resistant finish for the terminals, ensuring good electrical connections.

Terminal Position: DUAL

Allows for versatile mounting options and easier routing of connections on the circuit board.

Maximum Seated Height: 1.72 mm

Helps in reducing the overall height profile of the product, making it suitable for compact electronic devices.

Width: 3.937 mm

Compact width dimension allows for efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures that the telecom interface IC can withstand peak reflow temperatures for the specified duration, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes, ensuring proper soldering of the terminals.

Length: 4.927 mm

Optimal length dimension for easy placement and routing in various electronic applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range and reliability, making it suitable for automotive applications.

Terminal Form: GULL WING

Provides a stable and durable terminal design for easy mounting and soldering onto circuit boards.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance in telecom systems.

Nominal Supply Voltage: 12 V

Designed to operate efficiently at a nominal supply voltage of 12V, making it compatible with standard power sources.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy connectivity and efficient routing of connections on the circuit board.

Moisture Sensitivity Level (MSL): 2

With MSL level 2, the product can withstand moderate exposure to moisture during storage and assembly processes.

Technical Specifications

Other Function Telecom Interface ICs NCV7428D1L5R2G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.927 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.72 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

NCV7428D1L5R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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