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NCV7425DW0R2G

Onsemi

NCV7425DW0R2G by Onsemi

NCV7425DW0R2G by Onsemi is a telecom interface IC with 16 terminals, operating temperature range of -40 to 125 °C. It features a small outline package style, Gull Wing terminal form, and nominal voltage of 12V. Ideal for automotive applications requiring high-temperature performance and reliable connectivity in compact spaces.

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$1.060

1k+ parts

$0.880

10k+ parts

$0.784

1,500

-

$1.060

$0.880

$0.784

DigiKey

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.330

10k+ parts

-

1,500

-

-

$1.330

-

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.100

10k+ parts

$0.981

1,500

-

-

$1.100

$0.981

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,146 parts In-Stock

1+ parts

$0.906

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

$0.906

-

-

-

Chip Stock

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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18,000

-

-

-

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Vyrian

USA . 11,345 parts In-Stock

1+ parts

-

100+ parts

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11,345

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 930 parts In-Stock

1+ parts

$0.859

100+ parts

-

1k+ parts

-

10k+ parts

-

930

$0.859

-

-

-

Vigor

Singapore . 771 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

-

771

$0.870

-

-

-

Corohmni

South Africa . 365 parts In-Stock

1+ parts

$0.954

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$0.954

-

-

-

Component Stockers USA

USA . 1,850 parts In-Stock

1+ parts

$0.970

100+ parts

$0.910

1k+ parts

$0.820

10k+ parts

-

1,850

$0.970

$0.910

$0.820

-

AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$20.630

100+ parts

-

1k+ parts

-

10k+ parts

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564

$20.630

-

-

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Problanco Electronics

Mexico . 7,398 parts In-Stock

1+ parts

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100+ parts

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7,398

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Kulean Microsystems

USA . 6,657 parts In-Stock

1+ parts

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100+ parts

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6,657

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TANS Electronics

Latvia . 3,926 parts In-Stock

1+ parts

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3,926

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UHIMA Technologies

Türkiye . 725 parts In-Stock

1+ parts

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725

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Kepictronics

USA . 619 parts In-Stock

1+ parts

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619

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SupplyDigital Components

Austria . 512 parts In-Stock

1+ parts

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1k+ parts

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512

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Microchip USA

USA . 239 parts In-Stock

1+ parts

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100+ parts

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239

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Overview

Enhance your telecommunications systems with the NCV7425DW0R2G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in all their products. This telecom interface IC offers seamless integration, improved performance, and enhanced functionality for a wide range of applications. Experience the value and benefits that this product brings to your projects, from its compact design to its superior operating temperature range. Upgrade your systems today with the NCV7425DW0R2G and elevate your telecommunications experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product suitable for various environments and conditions.

Surface Mount: YES

Surface mount technology allows for easier and more efficient manufacturing and assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy and space-efficient mounting on circuit boards.

No. of Terminals: 16

Having 16 terminals provides flexibility and connectivity options for different applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the PCB while maintaining functionality.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand demanding conditions without performance issues.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows the product to function effectively in both extreme cold and hot environments.

Terminal Finish: TIN

Tin terminal finish helps in ensuring good electrical conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved reliability in connectivity.

Maximum Seated Height: 2.65 mm

Low maximum seated height contributes to a compact and streamlined design for space-constrained applications.

Width: 7.5 mm

Narrow width makes the product suitable for installations where space is limited.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures proper soldering and secure attachment during assembly.

Length: 10.3 mm

Compact length allows for efficient placement on the PCB without taking up unnecessary space.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability and performance in automotive applications where temperature fluctuations are common.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical strength and secure solder joints for long-term durability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimized performance in communication systems.

Nominal Supply Voltage: 12 V

Nominal supply voltage of 12V meets standard power requirements for many telecom applications.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for higher density and more connections in a limited space.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates the product can withstand moderate exposure to humidity during manufacturing and operation.

Technical Specifications

Other Function Telecom Interface ICs NCV7425DW0R2G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

NCV7425DW0R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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