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NCV7425DW5G

Onsemi

NCV7425DW5G by Onsemi

NCV7425DW5G by Onsemi is a Telecom Interface IC with 16 terminals in a small outline package. It operates b/w -40 to 125 °C, suitable for automotive applications. With a nominal voltage of 12V, it features Gull Wing terminals and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,990 parts In-Stock

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5,990

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Digiode

USA . 421 parts In-Stock

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421

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Distributors (Availability)

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AZTECH Wire

Italy . 250 parts In-Stock

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$21.980

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250

$21.980

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TANS Electronics

Latvia . 6,906 parts In-Stock

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Kulean Microsystems

USA . 3,321 parts In-Stock

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3,321

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SupplyDigital Components

Austria . 3,166 parts In-Stock

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Problanco Electronics

Mexico . 1,441 parts In-Stock

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1,441

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UHIMA Technologies

Türkiye . 858 parts In-Stock

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858

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Corphita

USA . 713 parts In-Stock

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Vigor

Singapore . 166 parts In-Stock

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Corohmni

South Africa . 157 parts In-Stock

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Microchip USA

USA . 139 parts In-Stock

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Overview

Elevate your telecom interface applications with the NCV7425DW5G by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge solutions in the category of Other Function Telecom Interface ICs. This product offers unmatched value and benefits for customers seeking seamless connectivity and superior performance. Say goodbye to technical glitches and hello to smooth operations with the NCV7425DW5G. Experience the advantages firsthand and elevate your telecom system to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making this product suitable for long-term use.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation onto a circuit board.

No. of Terminals: 16

Having 16 terminals provides versatility and flexibility in connecting to other components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in harsh environmental conditions.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance for reliable connections.

Nominal Supply Voltage: 12 V

The 12V nominal supply voltage is a common standard in many applications, making this product compatible with various systems.

Technical Specifications

Other Function Telecom Interface ICs NCV7425DW5G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

NCV7425DW5G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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