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Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.

Other Function Telecom Interface ICs

Available Parts 1,254

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
BGU8004Z by NXP Semiconductors

BGU8004Z

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

.65 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.32 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.22 mm

BOTTOM

.44 mm

BGX7221HN/1,518 by NXP Semiconductors

BGX7221HN/1,518

NXP Semiconductors

TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE; No. of Functions: 1;

S-PQCC-N36

6 mm

3

1

36

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

TELECOM CIRCUIT

NO LEAD

.5 mm

QUAD

6 mm

OL2300NHN/F,118 by NXP Semiconductors

OL2300NHN/F,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N16

e4

3 mm

1

1

16

85 Cel

-25 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.12SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.7

Not Qualified

1 mm

Other Telecom ICs

19 mA

2.7 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

OL2311AHN/C0B,515 by NXP Semiconductors

OL2311AHN/C0B,515

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

2A

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.7

Not Qualified

.85 mm

Other Telecom ICs

21.5 mA

2.7 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

5 mm

OL2381AHN/C0B,515 by NXP Semiconductors

OL2381AHN/C0B,515

NXP Semiconductors

OL2381AHN/C0B,515 by NXP Semiconductors is a telecom interface IC with 32 terminals in a square chip carrier package. Operating at 2.7V, it has a temperature range of -25 to 85°C and low supply current of 0.0012mA. Ideal for telecom circuits, this IC is surface mountable and features a very thin profile for compact applications.

S-PQCC-N32

5 mm

2A

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.7

Not Qualified

.85 mm

Other Telecom ICs

.0012 mA

2.7 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

5 mm

SA616BS,115 by NXP Semiconductors

SA616BS,115

NXP Semiconductors

SA616BS,115 by NXP Semiconductors is a Telecom Interface IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Nominal voltage of 3V and terminal pitch of 0.5mm make it ideal for telecom circuits.

S-PQCC-N20

4 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

4 mm

SA636BS,115 by NXP Semiconductors

SA636BS,115

NXP Semiconductors

SA636BS,115 by NXP Semiconductors is a telecom interface IC with 1 function. It has a package style of CHIP CARRIER and a very thin profile. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications.

S-PQCC-N20

4 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

4 mm

SL2S1502FTBX by NXP Semiconductors

SL2S1502FTBX

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;

R-PDSO-N3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

260

.5 mm

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.55 mm

DUAL

1 mm

SL2S2002FUD,003 by NXP Semiconductors

SL2S2002FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S2102FTB,115 by NXP Semiconductors

SL2S2102FTB,115

NXP Semiconductors

SL2S2102FTB,115 by NXP Semiconductors is a telecom interface IC with 3 terminals. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. This CMOS technology IC is ideal for industrial telecom circuits due to its small outline and thin profile package style.

R-PDSO-N3

e3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

260

.5 mm

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.55 mm

DUAL

30

1 mm

SL2S2102FUD,003 by NXP Semiconductors

SL2S2102FUD,003

NXP Semiconductors

SL2S2102FUD,003 by NXP Semiconductors is a CMOS telecom IC with 4 terminals. It operates in industrial temperature range (-40 to 85°C) and is surface mountable. Ideal for telecom circuit applications due to its uncased chip package style.

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5002FUD,003 by NXP Semiconductors

SL2S5002FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5102FUD,003 by NXP Semiconductors

SL2S5102FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5302FUD,003 by NXP Semiconductors

SL2S5302FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5402FUD,003 by NXP Semiconductors

SL2S5402FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL3S1001FTT,118 by NXP Semiconductors

SL3S1001FTT,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G8

e4

3 mm

1

1

8

80 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

1.1 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

3 mm

SL3S1003FTB0,115 by NXP Semiconductors

SL3S1003FTB0,115

NXP Semiconductors

NXP Semiconductors' SL3S1003FTB0,115 is a Telecom Interface IC with 6 terminals. It operates in temperatures ranging from -40 to 85°C and features CMOS technology. This small outline IC is ideal for telecom circuit applications due to its thin profile and no-lead terminal form.

R-PDSO-N6

1.45 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

DUAL

1 mm

SL3S1202FTB1,115 by NXP Semiconductors

SL3S1202FTB1,115

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;

R-PBCC-B3

e3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

BCC

LCC3(UNSPEC)

RECTANGULAR

CHIP CARRIER

260

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

BUTT

.55 mm

BOTTOM

30

1 mm

SL3S1202FTT,118 by NXP Semiconductors

SL3S1202FTT,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G8

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP8,.19

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

Not Qualified

1.1 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

30

3 mm

SL3S1203FUF,003 by NXP Semiconductors

SL3S1203FUF,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

1.8

Not Qualified

Other Telecom ICs

.265 mA

1.8 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

SL3S1213FTB0,115 by NXP Semiconductors

SL3S1213FTB0,115

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

R-PDSO-N6

e3

1.45 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

SOLCC6,.04,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

260

1.8

Not Qualified

.5 mm

Other Telecom ICs

.265 mA

1.8 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

DUAL

30

1 mm

SL3S1213FUF,003 by NXP Semiconductors

SL3S1213FUF,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

1.8

Not Qualified

Other Telecom ICs

.265 mA

1.8 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

TFF1007HN/N1,115 by NXP Semiconductors

TFF1007HN/N1,115

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF1007HN/N1,118 by NXP Semiconductors

TFF1007HN/N1,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11086HN/N1,111 by NXP Semiconductors

TFF11086HN/N1,111

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11086HN/N1X by NXP Semiconductors

TFF11086HN/N1X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11092HN/N1X by NXP Semiconductors

TFF11092HN/N1X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

e4

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TFF11092HN/N1 by NXP Semiconductors

TFF11092HN/N1

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11101HN/N1,118 by NXP Semiconductors

TFF11101HN/N1,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11101HN/N1X by NXP Semiconductors

TFF11101HN/N1X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11115HN/N1,111 by NXP Semiconductors

TFF11115HN/N1,111

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11139HN/N1,118 by NXP Semiconductors

TFF11139HN/N1,118

NXP Semiconductors

NXP Semiconductors TFF11139HN/N1,118 is a telecom interface IC with 24 terminals in a square chip carrier package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for industrial telecom circuits, this IC is surface mountable and features a very thin profile design.

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11139HN/N1X by NXP Semiconductors

TFF11139HN/N1X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11145HN/N1X by NXP Semiconductors

TFF11145HN/N1X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

UAA3220TS/V1S,118 by NXP Semiconductors

UAA3220TS/V1S,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G24

8.2 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

5.3 mm

BGM781N11E6327XUSA1 by Infineon Technologies

BGM781N11E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 11; Package Code: VSON; Package Shape: SQUARE;

S-PDSO-N11

2.5 mm

1

11

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

NOT SPECIFIED

2.5 mm

BGS16MN14E6327XTSA1 by Infineon Technologies

BGS16MN14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N14

e3

2 mm

1

1

14

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

3.5 V

YES

CMOS

TELECOM CIRCUIT

OTHER

Tin (Sn)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

2 mm

NRF51822-CEAA-R7 by Nordic Semiconductor Asa

NRF51822-CEAA-R7

Nordic Semiconductor Asa

NRF51822-CEAA-R7 by Nordic Semiconductor Asa is a Telecom IC with 62 terminals in a grid array package. Operating from -25 to 75°C, it has a nominal voltage of 1.8V. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design.

R-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.5 mm

NRF51822-CFAC-R by Nordic Semiconductor Asa

NRF51822-CFAC-R

Nordic Semiconductor Asa

NRF51822-CFAC-R by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile grid array packages.

S-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.83 mm

NRF51822-QFAA-R by Nordic Semiconductor Asa

NRF51822-QFAA-R

Nordic Semiconductor Asa

NRF51822-QFAA-R by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, -25 to 75°C operating temperature range, and 0.4mm terminal pitch. It is used in telecom circuits due to its square chip carrier package style and very thin profile, suitable for surface mount applications.

S-XQCC-N48

6 mm

1

48

75 Cel

-25 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.95 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

6 mm

NRF51822-CEAA-R by Nordic Semiconductor Asa

NRF51822-CEAA-R

Nordic Semiconductor Asa

NRF51822-CEAA-R by Nordic Semiconductor Asa is a Telecom IC with 62 terminals in a grid array package. Operating from -25 to 75°C, it has a nominal voltage of 1.8V. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for compact applications.

R-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.5 mm

NRF51822-QFAA-T by Nordic Semiconductor Asa

NRF51822-QFAA-T

Nordic Semiconductor Asa

NRF51822-QFAA-T by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, operating b/w -25 to 75°C. It comes in a square chip carrier package style, suitable for telecom circuit applications due to its very thin profile and quad terminal position.

S-XQCC-N48

6 mm

1

48

75 Cel

-25 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.95 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

6 mm

NRF51822-QFAC-R7 by Nordic Semiconductor Asa

NRF51822-QFAC-R7

Nordic Semiconductor Asa

NRF51822-QFAC-R7 by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, operating from -25 to 75°C. It features a square chip carrier package style and quad terminal position, suitable for telecom circuit applications requiring a very thin profile design.

S-XQCC-N48

e3

6 mm

1

48

75 Cel

-25 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.95 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

TIN

NO LEAD

.4 mm

QUAD

6 mm

NRF51822-QFAC-T by Nordic Semiconductor Asa

NRF51822-QFAC-T

Nordic Semiconductor Asa

NRF51822-QFAC-T by Nordic Semiconductor Asa is a 48-terminal telecom IC with a 1.8V supply voltage, operating b/w -25°C to 75°C. It features a square chip carrier package style and tin terminal finish, suitable for telecom circuit applications requiring a very thin profile design.

S-XQCC-N48

e3

6 mm

1

48

75 Cel

-25 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.95 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

TIN

NO LEAD

.4 mm

QUAD

6 mm

NRF51822-CFAC-R7 by Nordic Semiconductor Asa

NRF51822-CFAC-R7

Nordic Semiconductor Asa

NRF51822-CFAC-R7 by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square grid array package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile components in the commercial extended temperature range.

S-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.83 mm

NRF51822-QFAB-R by Nordic Semiconductor Asa

NRF51822-QFAB-R

Nordic Semiconductor Asa

NRF51822-QFAB-R by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, operating from -25 to 75°C. It features a square chip carrier package style at 0.95mm height, suitable for telecom circuit applications.

S-XQCC-N48

6 mm

1

48

75 Cel

-25 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.95 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

6 mm

NRF51822-QFAB-T by Nordic Semiconductor Asa

NRF51822-QFAB-T

Nordic Semiconductor Asa

NRF51822-QFAB-T by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, -25 to 75°C operating range, and 0.4mm terminal pitch. It is used in telecom circuits due to its square chip carrier package style and quad terminal position, suitable for surface mount applications.

S-XQCC-N48

6 mm

1

48

75 Cel

-25 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.95 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

6 mm

NRF51822-CDAB-R by Nordic Semiconductor Asa

NRF51822-CDAB-R

Nordic Semiconductor Asa

NRF51822-CDAB-R by Nordic Semiconductor Asa is a telecom IC with 56 terminals in a rectangular package. It operates b/w -25°C to 75°C, with a nominal voltage of 1.8V. The package style is grid array, very thin profile, fine pitch, making it suitable for various telecom circuit applications.

R-PBGA-B56

3.5 mm

1

1

56

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

3.33 mm