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Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.

Other Function Telecom Interface ICs

Available Parts 1,254

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
CC2560BYFVR by Texas Instruments

CC2560BYFVR

Texas Instruments

CC2560BYFVR by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

R-PBGA-B54

e1

3.265 mm

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.925 mm

CC2560BYFVT by Texas Instruments

CC2560BYFVT

Texas Instruments

CC2560BYFVT by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

R-PBGA-B54

e1

3.265 mm

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.925 mm

STA8090EXGAJTR by STMicroelectronics

STA8090EXGAJTR

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGAJ by STMicroelectronics

STA8090EXGAJ

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGATR by STMicroelectronics

STA8090EXGATR

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGA by STMicroelectronics

STA8090EXGA

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

e3

9 mm

3

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

BALL

.65 mm

BOTTOM

9 mm

TLE8457BSJXUMA1 by Infineon Technologies

TLE8457BSJXUMA1

Infineon Technologies

TLE8457BSJXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC is ideal for telecom circuit applications due to its compact size and gull wing terminal form.

R-PDSO-G8

e3

5 mm

3

1

8

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

AEC-Q100

1.75 mm

8 V

YES

BICMOS

TELECOM CIRCUIT

TIN

GULL WING

1.27 mm

DUAL

4 mm

BGS13PN10E6327XTSA1 by Infineon Technologies

BGS13PN10E6327XTSA1

Infineon Technologies

BGS13PN10E6327XTSA1 by Infineon is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features CMOS technology, nominal voltage of 2.85V, and terminal pitch of 0.4mm for telecom circuits.

R-XBCC-B10

e3

1.5 mm

1

1

10

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

2.85 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

BUTT

.4 mm

BOTTOM

1.1 mm

BGS18GA14E6327XTSA1 by Infineon Technologies

BGS18GA14E6327XTSA1

Infineon Technologies

BGS18GA14E6327XTSA1 by Infineon Technologies is a telecom interface IC with 14 terminals in a square package. Operating temperature ranges from -30°C to 85°C, suitable for telecom circuits requiring a nominal voltage of 3V. With surface mount capability and compact dimensions of 2x2mm, it is ideal for microelectronic assembly applications.

S-XQMA-B14

2 mm

1

1

14

85 Cel

-30 Cel

UNSPECIFIED

SQUARE

MICROELECTRONIC ASSEMBLY

.65 mm

3 V

YES

TELECOM CIRCUIT

OTHER

BUTT

QUAD

2 mm

BGM1033N7E6327XUSA1 by Infineon Technologies

BGM1033N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N6

2.3 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

2.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

NOT SPECIFIED

1.7 mm

BGM15HA12E6327XTSA1 by Infineon Technologies

BGM15HA12E6327XTSA1

Infineon Technologies

BGM15HA12E6327XTSA1 by Infineon is a telecom interface IC with 12 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 2.8V, it's ideal for telecom circuit applications requiring surface mount technology.

R-PBCC-N12

e4

1.9 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

.65 mm

2.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD NICKEL

NO LEAD

.4 mm

BOTTOM

1.1 mm

BGM15MA12E6327XTSA1 by Infineon Technologies

BGM15MA12E6327XTSA1

Infineon Technologies

BGM15MA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals, operating temperature range of -40 to 85°C. It features a chip carrier package style, very thin profile, and no-lead terminal form. Ideal for telecom circuit applications with a nominal voltage of 2.8V and compact dimensions of 1.9mm x 1.1mm x 0.65mm.

R-PBCC-N12

1.9 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

.65 mm

2.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

BOTTOM

1.1 mm

BGS16GA14E6327XTSA1 by Infineon Technologies

BGS16GA14E6327XTSA1

Infineon Technologies

BGS16GA14E6327XTSA1 by Infineon is a telecom interface IC with 14 terminals in a square chip carrier package. Operating temperature ranges from -30 to 85°C, suitable for telecom circuits with a nominal voltage of 3V. Its compact size of 2x2mm and 0.65mm height make it ideal for space-constrained applications.

S-PBCC-N14

2 mm

1

1

14

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

3 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.4 mm

BOTTOM

2 mm

BGT24AR2E6433XUMA1 by Infineon Technologies

BGT24AR2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

BGT24AT2E6433XUMA1 by Infineon Technologies

BGT24AT2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

BGT24ATR12E6433XUMA1 by Infineon Technologies

BGT24ATR12E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

ADRF5045BCCZN-R7 by Analog Devices

ADRF5045BCCZN-R7

Analog Devices

Analog Devices' ADRF5045BCCZN-R7 is a 24-terminal IC with -40 to 85°C operating temp, suitable for telecom circuits. It features a 3.3V nominal voltage, 0.5mm terminal pitch, and industrial temperature grade. The package style is grid array with heat sink/slug in a square shape, making it ideal for surface mount applications.

S-XBGA-B24

e4

4 mm

3

-3.3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.96 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.5 mm

BOTTOM

30

4 mm

ADRF5045BCCZN by Analog Devices

ADRF5045BCCZN

Analog Devices

Analog Devices' ADRF5045BCCZN is a 24-terminal SQUARE IC with -40 to 85 °C operating temp. Ideal for TELECOM CIRCUIT applications, it has a 3.3V supply voltage and nickel palladium gold finish. The GRID ARRAY package style with 0.5mm pitch makes it suitable for industrial use in telecom interfaces.

S-XBGA-B24

e4

4 mm

3

-3.3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.96 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.5 mm

BOTTOM

30

4 mm

RN4870-I/RM128 by Microchip Technology

RN4870-I/RM128

Microchip Technology

RN4870-I/RM128 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C, and data rate of 0.01 Mbps. It is used in industrial applications requiring a nominal voltage of 3.3V for wireless communication.

.01 Mbps

R-XXMA-N33

22 mm

1

33

85 Cel

-40 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

ADL5335ACPZN-R7 by Analog Devices

ADL5335ACPZN-R7

Analog Devices

ADL5335ACPZN-R7 by Analog Devices is a telecom IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 5V, it features nickel palladium gold terminal finish and very thin profile design for telecom applications.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

ADL5335ACPZN by Analog Devices

ADL5335ACPZN

Analog Devices

ADL5335ACPZN by Analog Devices is a 16-terminal telecom IC with a square package shape and industrial temperature grade. It operates b/w -40 to 85 °C, suitable for telecom circuits with a nominal voltage of 5V. The chip carrier has a very thin profile, terminal pitch of 0.65mm, and peak reflow temperature of 260°C.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

ADRF5044BCCZN-R7 by Analog Devices

ADRF5044BCCZN-R7

Analog Devices

Analog Devices' ADRF5044BCCZN-R7 is a 24-terminal SQUARE package IC with -40 to 85 °C operating temp. Ideal for TELECOM CIRCUIT applications, it has a 3.3 V nominal voltage and 0.5 mm terminal pitch. With NICKEL PALLADIUM GOLD finish, it suits INDUSTRIAL-grade telecom interfaces.

S-XBGA-B24

e4

4 mm

3

-3.3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.96 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.5 mm

BOTTOM

30

4 mm

NL3HS644FCTAG by Onsemi

NL3HS644FCTAG

Onsemi

NL3HS644FCTAG by Onsemi is a 36-terminal, telecom interface IC with a nominal voltage of 3.3V. It features a grid array package style with very thin profile and fine pitch, suitable for telecom circuit applications. The package body material is plastic/epoxy, making it surface mountable with a terminal pitch of 0.4mm and max seated height of 0.54mm.

S-PBGA-B36

2.34 mm

1

36

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.54 mm

3.3 V

YES

TELECOM CIRCUIT

BALL

.4 mm

BOTTOM

NOT SPECIFIED

2.34 mm

LMX8410RGZR by Texas Instruments

LMX8410RGZR

Texas Instruments

LMX8410RGZR by Texas Instruments is a 48-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, surface mount compatibility, and nickel palladium gold silver terminal finish. Ideal for industrial telecom circuit applications requiring compact design and high-temperature resilience.

S-PQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

LMX8410RGZT by Texas Instruments

LMX8410RGZT

Texas Instruments

LMX8410RGZT by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include 3.3V supply voltage, surface mountable, and terminal finish of nickel palladium gold silver.

S-PQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

PI3EQX1001XUAEX by Diodes Incorporated

PI3EQX1001XUAEX

Diodes Incorporated

Diodes Inc. PI3EQX1001XUAEX is a 3.3V telecom IC with 18 terminals in a square chip carrier package. Operating from 0 to 70°C, it has a very thin profile of 0.4mm and quad terminal position, suitable for telecom circuit applications.

S-XQCC-N18

2 mm

1

18

70 Cel

0 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.4 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

2 mm

AX5031-1-TA05 by Onsemi

AX5031-1-TA05

Onsemi

The Onsemi AX5031-1-TA05 is a CMOS telecom IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 3V, it is ideal for telecom circuit applications requiring a very thin profile design.

S-XQCC-N20

e3

4 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

4 mm

HMC773ALC3BTR-R5 by Analog Devices

HMC773ALC3BTR-R5

Analog Devices

Analog Devices' HMC773ALC3BTR-R5 is a telecom IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. With a very thin profile and no-lead terminal form, it's ideal for telecom interface applications.

S-XQCC-N12

2.9 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.9 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

2.9 mm

LEA-6H-0 by U-blox Ag

LEA-6H-0

U-blox Ag

LEA-6H-0 by U-blox Ag is a telecom circuit IC with 28 terminals, operating at -40 to 85°C. It features a 3V supply voltage, AEC-Q100 screening level, and compact rectangular package ideal for industrial applications. With dual terminal position and no lead terminal form, it offers reliable performance in microelectronic assemblies.

R-XDMA-N28

22.4 mm

1

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

AEC-Q100

2.7 mm

3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.1 mm

DUAL

NOT SPECIFIED

17 mm

LC72720YVS-MPB-E by Onsemi

LC72720YVS-MPB-E

Onsemi

LC72720YVS-MPB-E by Onsemi is a telecom IC with 30 terminals, operating from -40 to 85 °C. It has a supply voltage of 3.3V and peak reflow temp of 260°C. Ideal for telecom circuits, it comes in a small outline package with gull wing terminals.

R-PDSO-G30

e6

9.75 mm

4

1

30

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

1.5 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN BISMUTH

GULL WING

.65 mm

DUAL

30

5.6 mm

LC72720YVS-TLM-E by Onsemi

LC72720YVS-TLM-E

Onsemi

LC72720YVS-TLM-E by Onsemi is a telecom IC with 30 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Features include 3.3V supply voltage, Gull Wing terminals, and tin bismuth finish for telecom circuit applications.

R-PDSO-G30

e6

9.75 mm

4

1

30

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

1.5 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN BISMUTH

GULL WING

.65 mm

DUAL

30

5.6 mm

BGS110MN20E6327XTSA1 by Infineon Technologies

BGS110MN20E6327XTSA1

Infineon Technologies

BGS110MN20E6327XTSA1 by Infineon is a 20-terminal telecom IC with a nominal voltage of 3.5V. It operates b/w -30°C to 85°C, in a square chip carrier package style. With terminals at the bottom and 0.4mm pitch, it's ideal for telecom interface applications.

S-XBCC-B20

2.3 mm

1

1

20

85 Cel

-30 Cel

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

.77 mm

3.5 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

2.3 mm

HMC641ALP4ETR by Analog Devices

HMC641ALP4ETR

Analog Devices

HMC641ALP4ETR by Analog Devices is a telecom interface IC with 24 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal negative supply voltage of -3V and terminal pitch of 0.5mm, it is ideal for telecom circuit designs requiring compact and high-performance solutions.

S-XQCC-N24

4 mm

-3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.95 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

4 mm

LMS7002M by Lime Microsystems

LMS7002M

Lime Microsystems

Lime Microsystems' LMS7002M is a telecom IC with 261 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.2V and uses a grid array package style. Ideal for industrial applications requiring precise telecom circuit functionality in compact form factor.

S-PBGA-B261

11.5 mm

1

261

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

BOTTOM

11.5 mm

IP4047CX6/LF,135 by Nexperia

IP4047CX6/LF,135

Nexperia

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

1.44 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.7 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

.99 mm

RN41XVC-I/RM by Microchip Technology

RN41XVC-I/RM

Microchip Technology

Microchip Technology's RN41XVC-I/RM is a telecom IC with 20 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial applications. The package style is rectangular with dimensions of 24.4mm x 29.9mm, making it suitable for various telecom interface functions.

R-XDMA-T20

29.9 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

DUAL

24.4 mm

RN41XVU-I/RM by Microchip Technology

RN41XVU-I/RM

Microchip Technology

Microchip Technology's RN41XVU-I/RM is a telecom IC with 20 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and nickel/gold terminal finish. This rectangular package is ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY design.

R-XDMA-T20

e4

29.9 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Gold (Ni/Au)

THROUGH-HOLE

DUAL

24.4 mm

RN42XVU-I/RM by Microchip Technology

RN42XVU-I/RM

Microchip Technology

RN42XVU-I/RM by Microchip Technology is a telecom interface IC with 1 function. It has a rectangular package shape with 20 terminals and a max seated height of 2mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V, making it suitable for various telecom circuit applications.

R-XDMA-T20

e4

29.9 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Gold (Ni/Au)

THROUGH-HOLE

DUAL

24.4 mm

ENW89823C4KF by Panasonic

ENW89823C4KF

Panasonic

TELECOM CIRCUIT;

TELECOM CIRCUIT

HMC745LC3TR-R5 by Analog Devices

HMC745LC3TR-R5

Analog Devices

Analog Devices' HMC745LC3TR-R5 is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm, ideal for telecom circuit applications.

S-CQCC-N16

2.9 mm

3

1

16

85 Cel

-40 Cel

CERAMIC, METAL-SEALED COFIRED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

2.9 mm

AX-SFEU-1-01-TB05 by Onsemi

AX-SFEU-1-01-TB05

Onsemi

AX-SFEU-1-01-TB05 by Onsemi is a Telecom Circuit IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. This surface-mount IC is ideal for telecom interface applications requiring a very thin profile and industrial temperature grade.

R-PQCC-N40

e4

7 mm

1

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.27,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

AX5243-1-TA05 by Onsemi

AX5243-1-TA05

Onsemi

AX5243-1-TA05 by Onsemi is a telecom IC with CMOS technology, operating b/w -40 to 85°C. It features 20 terminals in a square chip carrier package style, suitable for telecom circuit applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it offers high performance in industrial temperature grades.

S-XQCC-N20

e3

4 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

4 mm

AX5243-1-TW30 by Onsemi

AX5243-1-TW30

Onsemi

AX5243-1-TW30 by Onsemi is a CMOS telecom IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features include 3V supply voltage, matte tin finish, and quad terminal position for telecom interface functions.

S-XQCC-N20

e3

4 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

BGA5M1BN6E6327XTSA1 by Infineon Technologies

BGA5M1BN6E6327XTSA1

Infineon Technologies

Infineon's BGA5M1BN6E6327XTSA1 is a RECTANGULAR CHIP CARRIER with 6 terminals, operating from -40 to 85°C. It is an INDUSTRIAL-grade TELECOM CIRCUIT IC with a supply voltage of 1.8V, suitable for telecom interface applications due to its compact size and surface-mount capability.

R-XBCC-B6

1.1 mm

1

1

6

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.4 mm

BOTTOM

.7 mm

BGSF110GN26E6327XTSA1 by Infineon Technologies

BGSF110GN26E6327XTSA1

Infineon Technologies

BGSF110GN26E6327XTSA1 by Infineon is a Telecom IC with 26 terminals in a rectangular chip carrier package. Operating temperature range from -30 to 85°C, suitable for telecom circuits. Utilizes CMOS technology with a nominal voltage of 3V, ideal for surface mount applications.

R-PQCC-N26

e4

3.4 mm

1

1

26

85 Cel

-30 Cel

PLASTIC/EPOXY

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

.77 mm

3 V

YES

CMOS

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD SILVER

NO LEAD

QUAD

2.6 mm

RM024-P125-C-30 by Laird Technologies

RM024-P125-C-30

Laird Technologies

RM024-P125-C-30 by Laird Technologies is an industrial-grade TELECOM CIRCUIT with a data rate of 0.5 Mbps. Operating temperature ranges from -40°C to 85°C, making it suitable for various telecom applications. Packaged in MICROELECTRONIC ASSEMBLY, this IC is ideal for telecommunications interfaces requiring reliable performance in harsh environments.

ALSO AVAILABLE WITH 280kbps data rate

.5 Mbps

R-XXMA-X

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

NO

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

RM024-S125-C-30 by Laird Technologies

RM024-S125-C-30

Laird Technologies

RM024-S125-C-30 by Laird Technologies is an industrial-grade TELECOM CIRCUIT with a data rate of 0.5 Mbps. Operating temperature ranges from -40°C to 85°C, making it suitable for various telecom applications. Packaged in MICROELECTRONIC ASSEMBLY, this RECTANGULAR device excels in telecom interface functions.

ALSO AVAILABLE WITH 280kbps data rate

.5 Mbps

R-XXMA-X

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

NO

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

ADAR1000ACCZN-R7 by Analog Devices

ADAR1000ACCZN-R7

Analog Devices

ADAR1000ACCZN-R7 by Analog Devices is a telecom IC with 88 terminals, operating temp range of -40 to 85°C. It has a nominal voltage of 3.3V and negative supply voltage of -5V. Ideal for telecom circuits, this IC comes in a square package style with surface mount feature.

S-PBGA-B88

7 mm

3

-5 V

1

88

85 Cel

-40 Cel

PLASTIC/EPOXY

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.5 mm

BOTTOM

7 mm