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BGS110MN20E6327XTSA1

Infineon Technologies

BGS110MN20E6327XTSA1 by Infineon Technologies

BGS110MN20E6327XTSA1 by Infineon is a 20-terminal telecom IC with a nominal voltage of 3.5V. It operates b/w -30°C to 85°C, in a square chip carrier package style. With terminals at the bottom and 0.4mm pitch, it's ideal for telecom interface applications.

Median Price

$0.494

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 445 parts In-Stock

1+ parts

$0.018

100+ parts

$0.017

1k+ parts

$0.016

10k+ parts

-

445

$0.018

$0.017

$0.016

-

Farnell

UK . 3,000 parts In-Stock

1+ parts

$0.701

100+ parts

$0.471

1k+ parts

$0.328

10k+ parts

$0.297

3,000

$0.701

$0.471

$0.328

$0.297

Element14

Singapore . 3,000 parts In-Stock

1+ parts

$1.420

100+ parts

$0.922

1k+ parts

$0.643

10k+ parts

$0.549

3,000

$1.420

$0.922

$0.643

$0.549

Rochester

USA . 5,149,345 parts In-Stock

1+ parts

-

100+ parts

$0.476

1k+ parts

$0.395

10k+ parts

$0.352

5,149,345

-

$0.476

$0.395

$0.352

Verical

USA . 4,239,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.494

10k+ parts

$0.441

4,239,000

-

-

$0.494

$0.441

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 900 parts In-Stock

1+ parts

$0.017

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$0.017

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.334

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.334

-

-

-

Vyrian

USA . 12,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,818

-

-

-

-

VNN

France . 2,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

-

-

-

-

Bristol Electronics

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 265 parts In-Stock

1+ parts

$0.016

100+ parts

-

1k+ parts

-

10k+ parts

-

265

$0.016

-

-

-

Ampacity Inc.

Singapore . 3,056,274 parts In-Stock

1+ parts

$0.033

100+ parts

-

1k+ parts

-

10k+ parts

-

3,056,274

$0.033

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.334

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.334

-

-

-

Modulus Dynamics

Lithuania . 2,874 parts In-Stock

1+ parts

$6.155

100+ parts

$5.909

1k+ parts

$5.663

10k+ parts

-

2,874

$6.155

$5.909

$5.663

-

AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$15.320

100+ parts

-

1k+ parts

-

10k+ parts

-

783

$15.320

-

-

-

GreenTree Electronics

Israel . 213,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

213,000

-

-

-

-

RC Electronics

USA . 91,728 parts In-Stock

1+ parts

-

100+ parts

$0.360

1k+ parts

$0.330

10k+ parts

$0.320

91,728

-

$0.360

$0.330

$0.320

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Overview

Enhance your telecom applications with the BGS110MN20E6327XTSA1 by Infineon Technologies. This chip carrier package offers top-of-the-line quality and reliability, ensuring optimal performance in a compact square shape. With 20 terminals and a nominal supply voltage of 3.5V, this telecom interface IC provides seamless connectivity and efficient operation. Elevate your projects with the trusted manufacturer and advanced technology that Infineon Technologies delivers, and experience the value and benefits that this product brings to your designs.

Feature Benefit Bullets

Surface Mount: YES

Being surface mount allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

The square package shape can provide a more compact design for the product, saving space in the overall system.

No. of Terminals: 20

Having 20 terminals allows for sufficient connectivity options within the IC, enabling versatile functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal conductivity and protection for the IC, ensuring reliability and longevity.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can function effectively even under high temperature environments, increasing its applicability.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30°C makes this IC suitable for a wide range of environmental conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing, simplifying the overall design process.

Maximum Seated Height: 0.77 mm

The low maximum seated height of 0.77mm ensures that the IC can fit into space-constrained designs without compromising on performance.

Width: 2.3 mm

The compact width of 2.3mm enables efficient placement of the IC on the PCB, contributing to a streamlined and organized layout.

Length: 2.3 mm

The small length of 2.3mm further adds to the IC's space-saving capabilities, allowing for more flexibility in system design.

Terminal Form: BUTT

The butt terminal form simplifies the soldering process during assembly, ensuring a secure and reliable connection for the IC.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed as a telecom circuit IC, this product offers tailored functionalities and performance optimized for telecom applications.

Nominal Supply Voltage: 3.5 V

The nominal supply voltage of 3.5V ensures compatibility with standard power sources, making integration into existing systems more convenient.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4mm allows for high-density mounting of the IC on the PCB, enabling more features to be packed into a limited space.

Technical Specifications

Other Function Telecom Interface ICs BGS110MN20E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-XBCC-B20

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.77 mm

Nominal Supply Voltage:

3.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.3 mm

Trade Compliance

BGS110MN20E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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