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LC72720YVS-MPB-E

Onsemi

LC72720YVS-MPB-E by Onsemi

LC72720YVS-MPB-E by Onsemi is a telecom IC with 30 terminals, operating from -40 to 85 °C. It has a supply voltage of 3.3V and peak reflow temp of 260°C. Ideal for telecom circuits, it comes in a small outline package with gull wing terminals.

Median Price

$5.790

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 187 parts In-Stock

1+ parts

-

100+ parts

$5.000

1k+ parts

$4.470

10k+ parts

$4.210

187

-

$5.000

$4.470

$4.210

DigiKey

USA . 187 parts In-Stock

1+ parts

-

100+ parts

$5.790

1k+ parts

-

10k+ parts

-

187

-

$5.790

-

-

Verical

USA . 187 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

-

10k+ parts

-

187

-

$6.250

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 708 parts In-Stock

1+ parts

$5.292

100+ parts

-

1k+ parts

-

10k+ parts

-

708

$5.292

-

-

-

Vyrian

USA . 6,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,745

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 432 parts In-Stock

1+ parts

$4.720

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$4.720

-

-

-

Corphita

USA . 1,345 parts In-Stock

1+ parts

$5.013

100+ parts

-

1k+ parts

-

10k+ parts

-

1,345

$5.013

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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SupplyDigital Components

Austria . 6,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,037

-

-

-

-

Kulean Microsystems

USA . 3,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,633

-

-

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TANS Electronics

Latvia . 1,480 parts In-Stock

1+ parts

-

100+ parts

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1,480

-

-

-

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Problanco Electronics

Mexico . 353 parts In-Stock

1+ parts

-

100+ parts

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353

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-

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UHIMA Technologies

Türkiye . 340 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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340

-

-

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Continental Prestige Electronics

USA . 187 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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187

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Overview

Unlock the full potential of your telecom applications with the LC72720YVS-MPB-E by Onsemi. Crafted with precision and expertise, this high-quality telecom interface IC offers unparalleled performance and reliability. Whether you're looking to enhance communication systems or optimize network connectivity, this product is designed to meet your needs. With a compact design and advanced features, the LC72720YVS-MPB-E provides exceptional value and efficiency for all your telecommunications projects. Trust Onsemi to deliver cutting-edge solutions that push the boundaries of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and reducing manufacturing costs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic devices, making this product compatible with a wide range of systems.

Moisture Sensitivity Level (MSL): 4

With MSL level 4, this product can withstand standard moisture exposure during storage and transportation, ensuring product quality.

Technical Specifications

Other Function Telecom Interface ICs LC72720YVS-MPB-E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e6

Length:

9.75 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.6 mm

Trade Compliance

LC72720YVS-MPB-E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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