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LC72725KV

Onsemi

LC72725KV by Onsemi

LC72725KV by Onsemi is a CMOS telecom IC with 16 terminals in a small outline package. Operating temperature ranges from -20 to 70 °C, suitable for telecom circuits. Features include 3V supply voltage, 0.65mm terminal pitch, and GULL WING terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 962 parts In-Stock

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Vyrian

USA . 299 parts In-Stock

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299

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SupplyDigital Components

Austria . 7,840 parts In-Stock

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7,840

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Problanco Electronics

Mexico . 3,296 parts In-Stock

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Kulean Microsystems

USA . 2,547 parts In-Stock

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Corphita

USA . 1,399 parts In-Stock

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TANS Electronics

Latvia . 1,311 parts In-Stock

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UHIMA Technologies

Türkiye . 774 parts In-Stock

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774

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Kepictronics

USA . 259 parts In-Stock

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Corohmni

South Africa . 90 parts In-Stock

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Overview

Unlock the potential of your telecom applications with the LC72725KV by Onsemi. Crafted with precision and quality, this small outline, low profile IC offers seamless connectivity and enhanced performance. Perfect for a wide range of telecom functions, this product guarantees reliability and efficiency. Trust Onsemi to deliver cutting-edge technology that will take your projects to the next level. Experience the value and benefits of the LC72725KV and revolutionize your telecom interface solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology makes for easier and more efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB.

No. of Terminals: 16

16 terminals provide ample connectivity options for various telecom applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This small outline, low profile package style with shrink pitch helps in reducing space usage on the PCB.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stable performance even in harsh environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows for use in a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting and connection options.

Maximum Seated Height: 1.5 mm

Low seated height helps in reducing overall height of the PCB assembly.

Width: 4.4 mm

Compact width helps in saving space on the PCB layout.

Length: 5.2 mm

Short length ensures efficient utilization of PCB real estate.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability during assembly and operation.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance in such scenarios.

Nominal Supply Voltage: 3 V

Operates at a common voltage level, making it compatible with a wide range of systems.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density integration and saves space on the PCB.

Technical Specifications

Other Function Telecom Interface ICs LC72725KV attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

5.2 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LC72725KV Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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