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LC72710W

Onsemi

LC72710W by Onsemi

The Onsemi LC72710W is a CMOS telecom interface IC with 64 terminals in a square flatpack package. Operating temperature range of -40 to 85 °C, supply voltage of 5V, and max current of 25mA make it ideal for industrial applications requiring precise signal processing and communication functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,793 parts In-Stock

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Digiode

USA . 883 parts In-Stock

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TANS Electronics

Latvia . 7,268 parts In-Stock

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Problanco Electronics

Mexico . 6,744 parts In-Stock

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Kulean Microsystems

USA . 3,335 parts In-Stock

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SupplyDigital Components

Austria . 2,629 parts In-Stock

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Corphita

USA . 1,258 parts In-Stock

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UHIMA Technologies

Türkiye . 535 parts In-Stock

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Corohmni

South Africa . 488 parts In-Stock

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Overview

Unlock the potential of your telecom applications with the LC72710W by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Designed for optimal performance, this interface IC is perfect for a wide range of applications. With its advanced technology and industrial-grade temperature rating, the LC72710W ensures seamless operation even in challenging environments. Experience the value and benefits that Onsemi brings to the table with this exceptional product. Elevate your projects with the LC72710W and discover a whole new level of efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the ICs, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially for mass production and automated assembly processes.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with most electronic systems, making it versatile for various applications.

No. of Terminals: 64

Having 64 terminals allows for a higher level of connectivity and functionality, making it suitable for complex telecom interface applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can withstand high temperatures without compromising performance, ideal for industrial use.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C ensures reliable performance in cold environments, making it suitable for a wide range of operating conditions.

Technology: CMOS

Being constructed using CMOS technology results in low power consumption and fast switching speeds, making it energy-efficient and high performing.

Maximum Supply Current: 25 mA

Operating at a maximum supply current of 25 mA ensures efficient power usage, reducing heat generation and potentially extending the lifespan of the IC.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm allows for compact packaging and efficient use of space on circuit boards, ideal for space-constrained applications.

Technical Specifications

Other Function Telecom Interface ICs LC72710W attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

25 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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