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LC72709W

Onsemi

LC72709W by Onsemi

The Onsemi LC72709W is a CMOS IC with 64 terminals in a square flatpack package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It requires 5V nominal voltage and has a max supply current of 25mA, making it ideal for telecom interface applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,244 parts In-Stock

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Digiode

USA . 912 parts In-Stock

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SupplyDigital Components

Austria . 3,995 parts In-Stock

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Kulean Microsystems

USA . 2,868 parts In-Stock

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TANS Electronics

Latvia . 1,488 parts In-Stock

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UHIMA Technologies

Türkiye . 619 parts In-Stock

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Corohmni

South Africa . 423 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 112 parts In-Stock

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Overview

Discover the ultimate solution for your telecom interface needs with the LC72709W by Onsemi. With a reputation for excellence in manufacturing, Onsemi delivers quality and reliability in every product. This versatile IC is ideal for various applications in the telecom industry, offering unmatched performance and efficiency. Experience the value and benefits of the LC72709W, designed to meet the demands of industrial-grade operations with ease. Upgrade your systems today and elevate your communication capabilities with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the product suitable for use in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and improving overall product reliability.

Package Shape: SQUARE

Square package shape provides a compact design that fits well in tight spaces and allows for efficient board layout.

Power Supplies (V): 5

5V power supply simplifies the power requirements and compatibility with standard power sources.

No. of Terminals: 64

With 64 terminals, the product offers flexibility and connectivity options for various applications.

Package Style (Meter): FLATPACK

Flatpack package style allows for easy handling and installation, facilitating the assembly process.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40 °C ensures reliability in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position provides a secure connection and efficient signal transmission, enhancing overall product performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the product can be used in harsh industrial environments without degradation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form ensures easy soldering and secure connections, enhancing the product's overall durability and reliability.

Maximum Supply Current: 25 mA

With a maximum supply current of 25mA, the product operates efficiently while conserving power, making it a cost-effective choice.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, the product is compatible with standard power sources, ensuring ease of integration.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5mm provides fine pitch connections, allowing for high-density mounting and space-saving design.

Technical Specifications

Other Function Telecom Interface ICs LC72709W attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

25 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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