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LC72725KVS

Onsemi

LC72725KVS by Onsemi

LC72725KVS by Onsemi is a telecom IC with 16 terminals in a small outline package. It operates b/w -40 °C to 85°C, suitable for industrial applications. With CMOS technology and 0.65mm terminal pitch, it's ideal for telecom interface circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,318 parts In-Stock

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2,318

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Vyrian

USA . 1,401 parts In-Stock

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1,401

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Distributors (Availability)

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Kulean Microsystems

USA . 7,416 parts In-Stock

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7,416

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TANS Electronics

Latvia . 3,047 parts In-Stock

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3,047

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SupplyDigital Components

Austria . 2,251 parts In-Stock

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Problanco Electronics

Mexico . 1,911 parts In-Stock

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Corphita

USA . 1,288 parts In-Stock

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UHIMA Technologies

Türkiye . 574 parts In-Stock

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574

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Corohmni

South Africa . 410 parts In-Stock

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Overview

Discover the cutting-edge LC72725KVS by Onsemi, a game-changing product in the realm of Other Function Telecom Interface ICs. Designed with precision and expertise, this telecom circuit offers unparalleled quality and reliability. From its small outline package to industrial-grade temperature performance, this innovative solution is perfect for a wide range of applications. Trust Onsemi's reputation for excellence and unlock a world of possibilities with the LC72725KVS. Experience seamless connectivity, enhanced functionality, and superior performance - all at an unbeatable value. Elevate your projects with this essential component that brings convenience and efficiency to the forefront.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the IC, ensuring reliability and longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, making this product convenient for assembly processes.

No. of Terminals: 16

With 16 terminals, this product can accommodate multiple connections and functions, providing versatility for various telecom interface applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions, increasing the product's reliability in demanding settings.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows the product to function effectively in both extreme heat and cold conditions, making it suitable for diverse environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and performance of the product in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs LC72725KVS attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

5.2 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LC72725KVS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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