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LC72720YVS-TLM-E

Onsemi

LC72720YVS-TLM-E by Onsemi

LC72720YVS-TLM-E by Onsemi is a telecom IC with 30 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Features include 3.3V supply voltage, Gull Wing terminals, and tin bismuth finish for telecom circuit applications.

Median Price

$2.499

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,405 parts In-Stock

1+ parts

-

100+ parts

$2.360

1k+ parts

$2.110

10k+ parts

$1.980

15,405

-

$2.360

$2.110

$1.980

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.638

10k+ parts

-

9,000

-

-

$2.638

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,000 parts In-Stock

1+ parts

$2.489

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$2.489

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-

-

Vyrian

USA . 8,459 parts In-Stock

1+ parts

-

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8,459

-

-

-

-

Cyclops Electronics Ltd

UK . 475 parts In-Stock

1+ parts

-

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475

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,212 parts In-Stock

1+ parts

$2.358

100+ parts

-

1k+ parts

-

10k+ parts

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1,212

$2.358

-

-

-

Corohmni

South Africa . 143 parts In-Stock

1+ parts

$2.620

100+ parts

-

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10k+ parts

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143

$2.620

-

-

-

AZTECH Wire

Italy . 990 parts In-Stock

1+ parts

$17.720

100+ parts

-

1k+ parts

-

10k+ parts

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990

$17.720

-

-

-

Continental Prestige Electronics

USA . 15,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.370

10k+ parts

-

15,405

-

-

$5.370

-

SupplyDigital Components

Austria . 6,333 parts In-Stock

1+ parts

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6,333

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Kepictronics

USA . 5,164 parts In-Stock

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5,164

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Kulean Microsystems

USA . 4,210 parts In-Stock

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4,210

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Problanco Electronics

Mexico . 3,275 parts In-Stock

1+ parts

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3,275

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TANS Electronics

Latvia . 1,419 parts In-Stock

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1,419

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-

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UHIMA Technologies

Türkiye . 249 parts In-Stock

1+ parts

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1k+ parts

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249

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Overview

Enhance your telecom interfaces with the high-quality LC72720YVS-TLM-E by Onsemi. Designed to meet industrial standards, this small outline, low profile IC offers reliability and precision in various applications. With a nominal supply voltage of 3.3V and dual terminal position, this product ensures seamless performance in telecom circuits. Trust Onsemi's expertise in manufacturing to deliver exceptional value and efficiency, making it the ideal choice for your interface needs. Upgrade your systems today and experience the benefits of superior technology with the LC72720YVS-TLM-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to heat, making the product suitable for long-term use in various environments.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and facilitating automated manufacturing processes.

No. of Terminals: 30

Provides ample connectivity options for interfacing with other components, enhancing versatility and functionality.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for use in industrial settings where heat may be a concern.

Nominal Supply Voltage: 3.3 V

Operates at a common voltage level, ensuring compatibility with a wide range of systems and reducing the need for additional components.

Technical Specifications

Other Function Telecom Interface ICs LC72720YVS-TLM-E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e6

Length:

9.75 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.6 mm

Trade Compliance

LC72720YVS-TLM-E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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