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LC72711LW

Onsemi

LC72711LW by Onsemi

LC72711LW by Onsemi is a CMOS telecom interface IC with 64 terminals in a square flatpack package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It requires 3/3.3V power supply and has a max supply current of 20mA, making it ideal for various telecommunications functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,910 parts In-Stock

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Digiode

USA . 1,308 parts In-Stock

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TANS Electronics

Latvia . 4,166 parts In-Stock

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SupplyDigital Components

Austria . 4,007 parts In-Stock

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Corphita

USA . 2,314 parts In-Stock

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Kulean Microsystems

USA . 1,932 parts In-Stock

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Problanco Electronics

Mexico . 1,536 parts In-Stock

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UHIMA Technologies

Türkiye . 327 parts In-Stock

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Corohmni

South Africa . 286 parts In-Stock

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Overview

Discover the innovative LC72711LW by Onsemi, a cutting-edge telecom interface IC that promises unrivaled quality and performance. Designed with precision by a trusted industry leader, this product offers unmatched reliability and functionality in a variety of applications. From telecommunications to networking, the LC72711LW is sure to exceed your expectations. Experience the value and benefits of this exceptional product today and elevate your projects to new heights with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides a durable and cost-effective solution for the product.

Surface Mount: YES

Surface mount capability makes installation and assembly easier and more efficient.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards.

Power Supplies (V): 3/3.3

Compatible with commonly used power supply voltages, making it versatile for various applications.

No. of Terminals: 64

Ample number of terminals for connecting to other components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact and streamlined design.

Maximum Operating Temperature: 85 °C

Can operate effectively in higher temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature conditions, providing flexibility for various environments.

Terminal Position: QUAD

Quad terminal position allows for easy connection and integration into circuit boards.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and performance under harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high switching speeds for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections to circuit boards, reducing the risk of disconnection.

Maximum Supply Current: 20 mA

Capable of handling up to 20mA of supply current, suitable for various power requirements.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for high-density packaging and efficient use of space on circuit boards.

Technical Specifications

Other Function Telecom Interface ICs LC72711LW attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

20 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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