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LC72725KMA

Onsemi

LC72725KMA by Onsemi

LC72725KMA by Onsemi is a Telecom Interface IC with 16 terminals, CMOS technology, and 3V supply voltage. It operates b/w -40 °C to 85°C, suitable for industrial applications. This small outline package is surface mountable and ideal for telecom circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,540 parts In-Stock

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Digiode

USA . 538 parts In-Stock

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538

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Problanco Electronics

Mexico . 8,280 parts In-Stock

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8,280

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SupplyDigital Components

Austria . 7,454 parts In-Stock

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TANS Electronics

Latvia . 2,613 parts In-Stock

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Corphita

USA . 2,265 parts In-Stock

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Kulean Microsystems

USA . 1,310 parts In-Stock

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UHIMA Technologies

Türkiye . 582 parts In-Stock

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Corohmni

South Africa . 421 parts In-Stock

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Overview

Upgrade your telecom systems with the LC72725KMA by Onsemi, a top-quality Telecom Interface IC that guarantees reliability and superior performance. Onsemi is a trusted manufacturer known for its cutting-edge technology and innovative solutions. This small outline package is perfect for various applications in the telecommunications industry, offering customers unparalleled value and benefits. Experience seamless operation and enhanced functionality with the LC72725KMA, the ultimate choice for telecom interface solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials offer good insulation properties and protection against environmental factors, making the product more durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and allows for efficient space utilization.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functions, making the product versatile and suitable for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions, enhancing the product's versatility.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V makes the product compatible with a wide range of systems and power sources.

Technical Specifications

Other Function Telecom Interface ICs LC72725KMA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LC72725KMA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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