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LC72708E

Onsemi

LC72708E by Onsemi

The Onsemi LC72708E is a CMOS IC with 44 terminals, operating at -40 to 85 °C. It has a supply voltage of 5V and max current of 25mA. This telecom interface IC in a square package is ideal for industrial applications requiring surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,496 parts In-Stock

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Vyrian

USA . 1,161 parts In-Stock

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SupplyDigital Components

Austria . 7,829 parts In-Stock

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Kulean Microsystems

USA . 6,644 parts In-Stock

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TANS Electronics

Latvia . 5,770 parts In-Stock

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Corphita

USA . 1,086 parts In-Stock

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UHIMA Technologies

Türkiye . 893 parts In-Stock

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Problanco Electronics

Mexico . 383 parts In-Stock

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Corohmni

South Africa . 247 parts In-Stock

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Overview

Enhance your telecom interface with the LC72708E by Onsemi, a high-quality solution that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in electronic components, this product is designed for a wide range of applications in the telecommunications industry. With its cutting-edge technology and industrial-grade temperature tolerance, the LC72708E ensures seamless operation and efficiency. Upgrade your systems today and experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the circuit board.

Package Shape: SQUARE

The square package shape provides a uniform footprint, making it easy to integrate into existing designs.

Power Supplies (V): 5

With a power supply of 5V, this product is compatible with standard voltage levels, ensuring easy integration into different systems.

No. of Terminals: 44

Having 44 terminals allows for a high level of connectivity and functionality in the product.

Package Style (Meter): FLATPACK

The flatpack package style makes this product compact and space-efficient, ideal for applications with limited space.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high-temperature environments, increasing its versatility.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures the reliability of this product in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position provides a secure connection and ease of soldering, ensuring stable performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the temperature and reliability requirements of demanding environments.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making this product efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form offers a strong mechanical connection and easy surface mounting, enhancing the overall durability and ease of installation.

Maximum Supply Current: 25 mA

With a maximum supply current of 25 mA, this product operates efficiently without drawing excessive power.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with a wide range of systems, making this product versatile and easy to integrate.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for a high density of terminals, enabling more connections in a limited space.

Technical Specifications

Other Function Telecom Interface ICs LC72708E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G44

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

25 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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