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HMC745LC3TR-R5

Analog Devices

HMC745LC3TR-R5 by Analog Devices

Analog Devices' HMC745LC3TR-R5 is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm, ideal for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,166 parts In-Stock

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Digiode

USA . 526 parts In-Stock

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AZTECH Wire

Italy . 307 parts In-Stock

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$5.018

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Parana Technologies

USA . 4,458 parts In-Stock

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$6.688

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$6.219

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IDEA Electronic Components Group

UK . 2,177 parts In-Stock

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$7.191

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$6.831

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DigiPath Technology Company

USA . 2,297 parts In-Stock

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$11.218

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$10.769

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$10.769

2,297

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$10.769

One Stop Electronics

USA . 226 parts In-Stock

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$26.000

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Microchip USA

USA . 4,011 parts In-Stock

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$248.288

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Semicontronic

India . 1,578 parts In-Stock

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$397.000

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$387.075

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$385.090

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Component Stockers USA

USA . 44 parts In-Stock

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$1,831.070

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Corphita

USA . 861 parts In-Stock

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Overview

Elevate your telecommunications systems with the high-quality HMC745LC3TR-R5 from Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch products that guarantee reliability and performance. This Telecom Interface IC is designed for a wide range of applications, offering unparalleled value and benefits to customers. With its advanced features and innovative technology, the HMC745LC3TR-R5 ensures seamless communication and optimal functionality. Upgrade your systems today and experience the superior advantages this product has to offer.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent thermal conductivity and durability, making this product highly reliable in harsh operating conditions.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product is suitable for industrial applications where temperature fluctuations may occur.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in telecom applications, ensuring compatibility with a wide range of devices.

Technical Specifications

Other Function Telecom Interface ICs HMC745LC3TR-R5 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-CQCC-N16

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.9 mm

Trade Compliance

HMC745LC3TR-R5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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