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HMC773ALC3B

Analog Devices

HMC773ALC3B by Analog Devices

Analog Devices' HMC773ALC3B is a telecom IC with 12 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with TUNGSTEN NICKEL GOLD finish and 0.5mm terminal pitch. Ideal for industrial applications requiring very thin profile and surface mount compatibility.

Median Price

$102.910

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 8 parts In-Stock

1+ parts

$102.000

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-

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8

$102.000

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Analog Devices Inc

USA . 35 parts In-Stock

1+ parts

$102.910

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$80.475

1k+ parts

$66.920

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-

35

$102.910

$80.475

$66.920

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Mouser Electronics

USA . 291 parts In-Stock

1+ parts

$118.750

100+ parts

$98.040

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-

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291

$118.750

$98.040

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Newark

USA . 2 parts In-Stock

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$121.820

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$100.980

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$121.820

$100.980

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DigiKey

USA . 171 parts In-Stock

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$122.170

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$92.751

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$122.170

$92.751

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Arrow

USA . 3 parts In-Stock

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$80.190

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$80.190

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Verical

USA . 3 parts In-Stock

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$80.190

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$80.190

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Distributors (In-Stock)

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Digiode

USA . 240 parts In-Stock

1+ parts

$86.516

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240

$86.516

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Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$87.285

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$87.285

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Vyrian

USA . 3,215 parts In-Stock

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Chip Stock

USA . 825 parts In-Stock

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825

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Distributors (Availability)

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Corohmni

South Africa . 544 parts In-Stock

1+ parts

$7.631

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544

$7.631

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Parana Technologies

USA . 4,333 parts In-Stock

1+ parts

$8.356

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$7.771

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4,333

$8.356

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$7.771

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IDEA Electronic Components Group

UK . 1,448 parts In-Stock

1+ parts

$8.985

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$8.536

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1,448

$8.985

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$8.536

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Aztec Data Supply Inc.

USA . 3,900 parts In-Stock

1+ parts

$11.541

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3,900

$11.541

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DigiPath Technology Company

USA . 1,927 parts In-Stock

1+ parts

$14.017

100+ parts

$13.456

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$13.456

1,927

$14.017

$13.456

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$13.456

AZTECH Wire

Italy . 215 parts In-Stock

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$14.183

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215

$14.183

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Semicontronic

India . 350 parts In-Stock

1+ parts

$66.840

100+ parts

$65.169

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$64.835

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350

$66.840

$65.169

$64.835

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Ampacity Inc.

Singapore . 94 parts In-Stock

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$66.840

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94

$66.840

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Continental Prestige Electronics

USA . 34 parts In-Stock

1+ parts

$75.790

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$65.030

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34

$75.790

$65.030

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Corphita

USA . 845 parts In-Stock

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$81.963

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845

$81.963

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Netroflash

USA . 100 parts In-Stock

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$87.285

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100

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Lixinc

USA . 2,991 parts In-Stock

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Argo Parts USA

USA . 1,878 parts In-Stock

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Authorized Procurement Solutions

USA . 6 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the Analog Devices HMC773ALC3B. As a leading manufacturer in the industry, Analog Devices delivers cutting-edge telecom interface ICs that are designed to exceed expectations. The HMC773ALC3B offers a wide range of applications and benefits, providing customers with exceptional value and performance. Elevate your projects with this top-of-the-line product and unlock new possibilities in telecommunications technology. Trust Analog Devices for all your IC needs and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliability for the product, making it suitable for various telecom applications.

Surface Mount: YES

The surface mount capability makes the product easy to assemble on circuit boards, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, contributing to a compact design.

No. of Terminals: 12

Having 12 terminals provides ample connectivity options for the product, allowing it to interface with various telecommunications systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product can function reliably in diverse operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product remains operational even in cold environments.

Terminal Finish: TUNGSTEN NICKEL GOLD

The tungsten nickel gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance of the product.

Terminal Position: QUAD

The quad terminal position allows for efficient signal routing and connectivity, enhancing the product's overall functionality.

Maximum Seated Height: 0.92 mm

The low maximum seated height of 0.92 mm helps in achieving a compact overall product size, suitable for space-constrained telecom applications.

Width: 3 mm

The narrow width of 3 mm further contributes to a space-saving design, making the product ideal for integration into telecom systems with limited space.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during the manufacturing process, leading to a robust product construction.

Length: 3 mm

The short length of 3 mm complements the narrow width, creating a compact form factor suitable for modern telecom devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that the product can withstand harsh environmental conditions commonly encountered in industrial settings.

Terminal Form: NO LEAD

The no-lead terminal form enhances the product's environmental friendliness and complies with RoHS regulations, making it a greener choice for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

The specific telecom IC type ensures that the product is optimized for telecom applications, providing reliable performance and compatibility with telecom systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density circuit design, enabling more connections within a limited space, ideal for telecom interfaces.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has a moderate level of moisture sensitivity, making it suitable for a wide range of manufacturing and operating environments.

Technical Specifications

Other Function Telecom Interface ICs HMC773ALC3B attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-CQCC-N12

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.92 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TUNGSTEN NICKEL GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC773ALC3B Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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