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HMC736LP4TR

Analog Devices

HMC736LP4TR by Analog Devices

Analog Devices' HMC736LP4TR is a telecom IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Nominal voltage is 4.2V, making it ideal for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,094 parts In-Stock

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7,094

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Digiode

USA . 392 parts In-Stock

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392

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,066 parts In-Stock

1+ parts

$11.779

100+ parts

-

1k+ parts

$10.955

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1,066

$11.779

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$10.955

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IDEA Electronic Components Group

UK . 1,183 parts In-Stock

1+ parts

$12.666

100+ parts

$12.033

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$12.033

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1,183

$12.666

$12.033

$12.033

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AZTECH Wire

Italy . 784 parts In-Stock

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$17.183

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784

$17.183

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DigiPath Technology Company

USA . 432 parts In-Stock

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$19.759

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$18.969

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$18.969

432

$19.759

$18.969

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$18.969

Semicontronic

India . 952 parts In-Stock

1+ parts

$136.000

100+ parts

$132.600

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$131.920

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952

$136.000

$132.600

$131.920

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One Stop Electronics

USA . 191 parts In-Stock

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$215.000

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191

$215.000

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Corphita

USA . 922 parts In-Stock

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922

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Overview

Elevate your telecom interface applications with the Analog Devices HMC736LP4TR. Crafted by a trusted manufacturer known for quality, this cutting-edge IC offers unparalleled performance and reliability. Its innovative design and versatile applications make it a must-have for any telecom project. Experience seamless connectivity and enhanced functionality with this top-of-the-line product. Upgrade your systems today and unlock a world of possibilities with the HMC736LP4TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and enabling efficient manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact and uniform design, making it easy to arrange multiple components on a board.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in a variety of environmental conditions.

Width: 4 mm

The narrow width of 4mm allows for dense packing of components on a board, saving valuable space in electronic devices.

Nominal Supply Voltage: 4.2 V

The nominal supply voltage of 4.2V is compatible with a wide range of electronic systems, providing flexibility in application.

Technical Specifications

Other Function Telecom Interface ICs HMC736LP4TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

4.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC736LP4TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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