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HMC737LP4

Analog Devices

HMC737LP4 by Analog Devices

Analog Devices' HMC737LP4 is a 24-terminal telecom IC with a 4.2V supply voltage, suitable for industrial applications. It features a chip carrier package style, operates b/w -40°C to 85°C, and has a terminal pitch of 0.5mm. Ideal for telecom circuits requiring compact design and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,209 parts In-Stock

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5,209

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Digiode

USA . 745 parts In-Stock

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745

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,231 parts In-Stock

1+ parts

$12.507

100+ parts

-

1k+ parts

$11.631

10k+ parts

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2,231

$12.507

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$11.631

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AZTECH Wire

Italy . 615 parts In-Stock

1+ parts

$13.393

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615

$13.393

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IDEA Electronic Components Group

UK . 599 parts In-Stock

1+ parts

$13.448

100+ parts

$12.776

1k+ parts

$12.776

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599

$13.448

$12.776

$12.776

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DigiPath Technology Company

USA . 830 parts In-Stock

1+ parts

$20.979

100+ parts

$20.140

1k+ parts

-

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$20.140

830

$20.979

$20.140

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$20.140

Ampacity Inc.

Singapore . 495 parts In-Stock

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$174.000

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495

$174.000

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Semicontronic

India . 1,122 parts In-Stock

1+ parts

$395.000

100+ parts

$385.125

1k+ parts

$383.150

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1,122

$395.000

$385.125

$383.150

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One Stop Electronics

USA . 1,315 parts In-Stock

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$983.000

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1,315

$983.000

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Corphita

USA . 353 parts In-Stock

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353

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Overview

Elevate your telecom systems with the cutting-edge HMC737LP4 by Analog Devices. Crafted from high-quality plastic/epoxy material, this chip carrier package boasts a compact square shape with 24 terminals for seamless integration. Designed for industrial-grade performance, this telecom interface IC offers unparalleled reliability and precision. Whether you're looking to enhance communication equipment or upgrade your network infrastructure, the HMC737LP4 delivers exceptional value and efficiency that will elevate your operations to the next level. Choose Analog Devices for top-tier quality and innovation in telecommunications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for telecommunications applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving time and space in electronic devices.

Package Shape: SQUARE

The square package shape provides a compact design, making it suitable for space-constrained applications.

No. of Terminals: 24

Having a sufficient number of terminals allows for versatile connectivity options, enhancing the product's functionality and compatibility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good heat dissipation and protection for the integrated circuit within, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes the product suitable for use in both extreme cold and hot environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good conductivity and solderability, facilitating secure connections during assembly.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of signals and power within the IC, optimizing performance and reliability.

Maximum Seated Height: 1 mm

The low seated height of 1 mm enables a slim profile for the product, making it a suitable choice for compact electronic designs.

Width: 4 mm

The small width of 4 mm contributes to the overall compactness of the product, making it ideal for space-saving applications.

Length: 4 mm

The short length of 4 mm further enhances the product's compact design, enabling easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and performance in harsh industrial environments, making it a dependable choice for telecom applications.

Terminal Form: NO LEAD

The no lead terminal form complies with environmental regulations and promotes eco-friendly manufacturing practices.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC type offers optimized functionality and performance for telecommunications applications.

Nominal Supply Voltage: 4.2 V

The 4.2V nominal supply voltage is ideal for telecom applications, providing stable power for optimal operation.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting of components on PCBs, enhancing the product's efficiency and functionality.

Technical Specifications

Other Function Telecom Interface ICs HMC737LP4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

4.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC737LP4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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