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HMC701LP6CE

Analog Devices

HMC701LP6CE by Analog Devices

Analog Devices' HMC701LP6CE is a BICMOS technology telecom IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 3.3 V, it's ideal for telecom circuit applications requiring a very thin profile and matte tin terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,354 parts In-Stock

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4,354

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Digiode

USA . 388 parts In-Stock

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388

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Chip Stock

USA . 350 parts In-Stock

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350

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Semtec, LLC

USA . 211 parts In-Stock

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211

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Sensible Micro Corp

USA . 35 parts In-Stock

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35

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Distributors (Availability)

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AZTECH Wire

Italy . 252 parts In-Stock

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$5.609

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252

$5.609

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Parana Technologies

USA . 1,096 parts In-Stock

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$7.908

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$7.354

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$7.908

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$7.354

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IDEA Electronic Components Group

UK . 351 parts In-Stock

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$8.503

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$8.078

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351

$8.503

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$8.078

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DigiPath Technology Company

USA . 2,072 parts In-Stock

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$13.265

100+ parts

$12.734

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$12.734

2,072

$13.265

$12.734

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$12.734

Microchip USA

USA . 163 parts In-Stock

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$74.865

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$74.865

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Component Stockers USA

USA . 461 parts In-Stock

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$99.990

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461

$99.990

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One Stop Electronics

USA . 546 parts In-Stock

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$115.000

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546

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Semicontronic

India . 499 parts In-Stock

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$620.000

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$604.500

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$601.400

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499

$620.000

$604.500

$601.400

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 678 parts In-Stock

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Overview

Elevate your telecommunications projects with the HMC701LP6CE by Analog Devices. This top-notch Telecom Interface IC boasts exceptional quality and reliability, backed by a trusted manufacturer. Ideal for a wide range of applications, this chip carrier features cutting-edge technology and a compact design for seamless integration. Experience enhanced performance and efficiency with the HMC701LP6CE, providing unmatched value and benefits to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides a good balance of durability and cost-effectiveness, making this product a reliable choice for telecom applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding environmental conditions, ensuring reliable performance in various settings.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is commonly used in many telecom applications, making this product compatible with a wide range of systems.

Technical Specifications

Other Function Telecom Interface ICs HMC701LP6CE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

HMC701LP6CE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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