Loading...

LMX8410RGZR

Texas Instruments

LMX8410RGZR by Texas Instruments

LMX8410RGZR by Texas Instruments is a 48-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, surface mount compatibility, and nickel palladium gold silver terminal finish. Ideal for industrial telecom circuit applications requiring compact design and high-temperature resilience.

Median Price

$68.942

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,931 parts In-Stock

1+ parts

$68.942

100+ parts

$66.868

1k+ parts

$51.836

10k+ parts

-

2,931

$68.942

$66.868

$51.836

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,091 parts In-Stock

1+ parts

$65.495

100+ parts

-

1k+ parts

-

10k+ parts

-

4,091

$65.495

-

-

-

Vyrian

USA . 5,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,807

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 428 parts In-Stock

1+ parts

$7.287

100+ parts

-

1k+ parts

$7.786

10k+ parts

-

428

$7.287

-

$7.786

-

ChromeModa Solutions

Germany . 2,197 parts In-Stock

1+ parts

$8.188

100+ parts

$6.714

1k+ parts

-

10k+ parts

-

2,197

$8.188

$6.714

-

-

IDEA Electronic Components Group

UK . 1,510 parts In-Stock

1+ parts

$8.188

100+ parts

-

1k+ parts

$7.369

10k+ parts

-

1,510

$8.188

-

$7.369

-

AZTECH Wire

Italy . 120 parts In-Stock

1+ parts

$8.870

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$8.870

-

-

-

Corphita

USA . 2,346 parts In-Stock

1+ parts

$62.048

100+ parts

-

1k+ parts

-

10k+ parts

-

2,346

$62.048

-

-

-

DigiPath Technology Company

USA . 1,945 parts In-Stock

1+ parts

-

100+ parts

$7.382

1k+ parts

-

10k+ parts

-

1,945

-

$7.382

-

-

Overview

Discover the cutting-edge LMX8410RGZR by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This telecom interface IC boasts a wide range of applications and benefits, making it a versatile solution for various industries. With its advanced features, reliability, and performance, this product offers exceptional value to customers looking for superior functionality and efficiency. Upgrade your projects with the LMX8410RGZR and experience unparalleled quality and innovation in a compact and durable package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the IC, making it suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape provides a compact design, saving space on the circuit board and enabling efficient layout options.

No. of Terminals: 48

Having 48 terminals allows for a wide range of connections and functionalities, making the IC versatile and adaptable.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environmental conditions and ensure reliable performance in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively even in cold environments, expanding its usability range.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple high-quality finishes on the terminals enhances conductivity, reliability, and resistance to corrosion, ensuring long-term performance.

Terminal Position: QUAD

The quad terminal position enables efficient and secure connections, enhancing the stability and integrity of the IC in various applications.

Maximum Seated Height: 1 mm

The low maximum seated height ensures compatibility with compact designs and allows for flexible installation options in space-constrained environments.

Width: 7 mm

The narrow width of the IC facilitates compact device designs and enables efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature during assembly minimizes the risk of thermal damage to the IC and ensures consistent quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable soldering processes and ensures secure attachment of the IC to the circuit board.

Length: 7 mm

The compact length of the IC contributes to space-saving designs and efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature conditions, making the IC suitable for industrial applications.

Terminal Form: NO LEAD

The use of lead-free terminal form complies with environmental regulations and promotes sustainability in manufacturing processes.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC offers specialized functionality and optimized performance in telecommunications applications.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage is commonly used in telecom applications, ensuring compatibility and reliable operation in telecom circuits.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density connections and compact design layouts, maximizing functionality in telecom applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent moisture-related issues during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs LMX8410RGZR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMX8410RGZR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 1