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PI3EQX1001XUAEX

Diodes Incorporated

PI3EQX1001XUAEX by Diodes Incorporated

Diodes Inc. PI3EQX1001XUAEX is a 3.3V telecom IC with 18 terminals in a square chip carrier package. Operating from 0 to 70°C, it has a very thin profile of 0.4mm and quad terminal position, suitable for telecom circuit applications.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$1.110

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50

$1.110

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Vyrian

USA . 2,764 parts In-Stock

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2,764

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 5,369 parts In-Stock

1+ parts

$1.110

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5,369

$1.110

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Continental Prestige Electronics

USA . 523 parts In-Stock

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$1.110

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$1.088

523

$1.110

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$1.088

Netroflash

USA . 100 parts In-Stock

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$1.110

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$1.088

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100

$1.110

$1.088

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AZTECH Wire

Italy . 828 parts In-Stock

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$17.445

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828

$17.445

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Ampacity Inc.

Singapore . 988 parts In-Stock

1+ parts

$309.000

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988

$309.000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Microchip USA

USA . 416 parts In-Stock

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Overview

Unlock the power of seamless communication with the PI3EQX1001XUAEX by Diodes Incorporated. As a leader in the industry, Diodes Incorporated brings you unmatched quality and reliability. This innovative telecom interface IC is designed to optimize performance and efficiency, making it ideal for a wide range of applications. Experience faster data transfer, enhanced connectivity, and improved overall functionality with this cutting-edge product. Trust Diodes Incorporated to deliver exceptional value and superior technology that exceeds your expectations. Elevate your projects with the PI3EQX1001XUAEX and revolutionize your communication experience.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

The square shape of the package provides consistency in size and design, making it suitable for a wide range of application requirements.

No. of Terminals: 18

With a moderate number of terminals, this product can support complex telecom interface functions while maintaining a manageable design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in varied temperature settings, enhancing the product's versatility.

Terminal Position: QUAD

Quad terminal positioning enables efficient signal routing and connectivity within the circuit, optimizing performance and functionality.

Maximum Seated Height: 0.4 mm

The extremely low maximum seated height contributes to a slim and compact profile, ideal for space-constrained applications.

Width: 2 mm

The narrow width of the product facilitates close placement of components on the PCB, maximizing layout efficiency.

Length: 2 mm

The compact length of the product allows for a condensed footprint on the circuit board, helping to conserve space.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for standard operating environments, offering reliable performance in typical usage scenarios.

Terminal Form: NO LEAD

The no-lead terminal form enhances solder joint integrity and reliability, ensuring robust connections for long-term operation.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type offers features and functionalities tailored to meet the demands of telecommunications systems.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage is commonly used in telecom equipment, ensuring compatibility with existing power systems.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for dense terminal placement, enabling intricate circuit design and high signal density.

Technical Specifications

Other Function Telecom Interface ICs PI3EQX1001XUAEX attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Diodes Incorporated

Specs

JESD-30 Code:

S-XQCC-N18

Length:

2 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

PI3EQX1001XUAEX Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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