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AX5031-1-TA05

Onsemi

AX5031-1-TA05 by Onsemi

The Onsemi AX5031-1-TA05 is a CMOS telecom IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 3V, it is ideal for telecom circuit applications requiring a very thin profile design.

Median Price

$0.944

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 110 parts In-Stock

1+ parts

$0.944

100+ parts

$0.887

1k+ parts

$0.802

10k+ parts

-

110

$0.944

$0.887

$0.802

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Distributors (In-Stock)

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Digiode

USA . 2,163 parts In-Stock

1+ parts

$0.897

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-

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2,163

$0.897

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Vyrian

USA . 2,836 parts In-Stock

1+ parts

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2,836

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ACDS - Activité Composants Distribution Service

France . 501 parts In-Stock

1+ parts

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501

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Bristol Electronics

USA . 501 parts In-Stock

1+ parts

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501

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Distributors (Availability)

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Corphita

USA . 384 parts In-Stock

1+ parts

$0.850

100+ parts

-

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384

$0.850

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Component Stockers USA

USA . 77 parts In-Stock

1+ parts

$0.930

100+ parts

$0.880

1k+ parts

-

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77

$0.930

$0.880

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Corohmni

South Africa . 103 parts In-Stock

1+ parts

$0.944

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103

$0.944

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Andel Nordic

Denmark . 2,442 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

$11.898

10k+ parts

$11.898

2,442

$17.000

-

$11.898

$11.898

AZTECH Wire

Italy . 592 parts In-Stock

1+ parts

$19.950

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592

$19.950

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Problanco Electronics

Mexico . 4,793 parts In-Stock

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4,793

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TANS Electronics

Latvia . 4,381 parts In-Stock

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Kulean Microsystems

USA . 2,999 parts In-Stock

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2,999

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SupplyDigital Components

Austria . 2,329 parts In-Stock

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Northwest PG Solutions

USA . 1,695 parts In-Stock

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1,695

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UHIMA Technologies

Türkiye . 527 parts In-Stock

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527

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Native Components

USA . 42 parts In-Stock

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42

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Overview

Elevate your telecom interface systems with the AX5031-1-TA05 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior quality and reliability in every product. This versatile chip carrier boasts a very thin profile, making it ideal for a wide range of applications. With a nominal supply voltage of 3V and industrial-grade temperature tolerance, this telecom circuit ensures optimal performance in any environment. Experience seamless connectivity and unmatched efficiency with the AX5031-1-TA05 from Onsemi. Elevate your telecom interface systems with the AX5031-1-TA05 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior quality and reliability in every product. This versatile chip carrier boasts a very thin profile, making it ideal for a wide range of applications. With a nominal supply voltage of 3V and industrial-grade temperature tolerance, this telecom circuit ensures optimal performance in any environment. Experience seamless connectivity and unmatched efficiency with the AX5031-1-TA05 from Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

No. of Terminals: 20

Sufficient number of terminals for connecting to various components and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient heat dissipation and slim form factor.

Maximum Operating Temperature: 85 °C

Can operate effectively in higher temperature environments.

Minimum Operating Temperature: -40 °C

Can operate effectively in lower temperature environments.

Terminal Finish: TIN

Tin finish provides good electrical conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal configuration allows for easy connection to external devices.

Maximum Seated Height: 1 mm

Low seated height makes it suitable for applications with space constraints.

Width: 4 mm

Compact width allows for efficient use of board space.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints during assembly.

Length: 4 mm

Compact length allows for efficient use of board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: NO LEAD

No lead terminal form provides environmental benefits and compliance with RoHS regulations.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance in such use cases.

Nominal Supply Voltage: 3 V

Optimal supply voltage for efficient operation of the IC.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for higher density mounting on the circuit board.

Technical Specifications

Other Function Telecom Interface ICs AX5031-1-TA05 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

AX5031-1-TA05 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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